SE0001452D0 - A method and apparatus in a production line - Google Patents

A method and apparatus in a production line

Info

Publication number
SE0001452D0
SE0001452D0 SE0001452A SE0001452A SE0001452D0 SE 0001452 D0 SE0001452 D0 SE 0001452D0 SE 0001452 A SE0001452 A SE 0001452A SE 0001452 A SE0001452 A SE 0001452A SE 0001452 D0 SE0001452 D0 SE 0001452D0
Authority
SE
Sweden
Prior art keywords
printed board
guide element
electronic
mechanical component
production line
Prior art date
Application number
SE0001452A
Other languages
English (en)
Other versions
SE518778C2 (sv
SE0001452L (sv
Inventor
Ulf Jansson
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE0001452A priority Critical patent/SE518778C2/sv
Publication of SE0001452D0 publication Critical patent/SE0001452D0/sv
Priority to US09/836,298 priority patent/US6606789B2/en
Priority to AU2001248990A priority patent/AU2001248990A1/en
Priority to EP01922216A priority patent/EP1283006A1/en
Priority to PCT/SE2001/000850 priority patent/WO2001080610A1/en
Publication of SE0001452L publication Critical patent/SE0001452L/sv
Publication of SE518778C2 publication Critical patent/SE518778C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
SE0001452A 2000-04-19 2000-04-19 Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort SE518778C2 (sv)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SE0001452A SE518778C2 (sv) 2000-04-19 2000-04-19 Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort
US09/836,298 US6606789B2 (en) 2000-04-19 2001-04-18 Method and apparatus in a production line
AU2001248990A AU2001248990A1 (en) 2000-04-19 2001-04-18 A method for mounting at least one electronic or mechanical component, a guide element and an electronic or mechanical component
EP01922216A EP1283006A1 (en) 2000-04-19 2001-04-18 A method for mounting at least one electronic or mechanical component, a guide element and an electronic or mechanical component
PCT/SE2001/000850 WO2001080610A1 (en) 2000-04-19 2001-04-18 A method for mounting at least one electronic or mechanical component, a guide element and an electronic or mechanical component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0001452A SE518778C2 (sv) 2000-04-19 2000-04-19 Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort

Publications (3)

Publication Number Publication Date
SE0001452D0 true SE0001452D0 (sv) 2000-04-19
SE0001452L SE0001452L (sv) 2001-10-20
SE518778C2 SE518778C2 (sv) 2002-11-19

Family

ID=20279379

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0001452A SE518778C2 (sv) 2000-04-19 2000-04-19 Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort

Country Status (5)

Country Link
US (1) US6606789B2 (sv)
EP (1) EP1283006A1 (sv)
AU (1) AU2001248990A1 (sv)
SE (1) SE518778C2 (sv)
WO (1) WO2001080610A1 (sv)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7170165B2 (en) * 2005-02-02 2007-01-30 Agilent Technologies, Inc. Circuit board assembly with a brace surrounding a ball-grid array device
CN2853253Y (zh) * 2005-09-29 2007-01-03 南京德朔实业有限公司 曲线锯
TWI359633B (en) * 2008-10-20 2012-03-01 Askey Computer Corp Assembly device
TWI382796B (zh) * 2008-12-30 2013-01-11 Au Optronics Corp 印刷電路板之製造方法與顯示模組及其組裝方法
US9297494B1 (en) * 2013-08-28 2016-03-29 The Boeing Company Dagger pin interface apparatus with swivel pin
CN106851980B (zh) * 2017-03-01 2023-05-26 汉得利（常州）电子股份有限公司 一种免焊接元器件转换装置的安装结构

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3387365A (en) * 1965-09-28 1968-06-11 John P. Stelmak Method of making electrical connections to a miniature electronic component
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
US3533155A (en) * 1967-07-06 1970-10-13 Western Electric Co Bonding with a compliant medium
US3634930A (en) * 1969-06-12 1972-01-18 Western Electric Co Methods for bonding leads and testing bond strength
US3608711A (en) * 1969-10-06 1971-09-28 Teledyne Inc Package for electronic devices and the like
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US4025716A (en) * 1975-01-30 1977-05-24 Burroughs Corporation Dual in-line package with window frame
JPS5694800A (en) * 1979-12-28 1981-07-31 Taiyo Yuden Kk Method and device for mounting electronic part
DE3616897C1 (en) * 1986-05-20 1987-09-17 Fritz Raible Soldered connection maker for electrical and/or electronic components
US4967311A (en) 1987-07-22 1990-10-30 Tandem Computers Incorporated Electronic module interconnection system
USRE35578E (en) * 1988-12-12 1997-08-12 Sgs-Thomson Microelectronics, Inc. Method to install an electronic component and its electrical connections on a support, and product obtained thereby
US5101550A (en) * 1989-02-10 1992-04-07 Honeywell Inc. Removable drop-through die bond frame
US4956911A (en) * 1990-05-18 1990-09-18 Ag Communication Systems Corporation Tool for repairing surface mounted components on printed circuit board
IT1242420B (it) * 1990-09-03 1994-03-04 Ri Co Srl Metodo di montaggio per l'applicazione di componenti elettronici su circuiti stampati flessibili.
US5312264A (en) * 1991-11-04 1994-05-17 Gte Products Corp. Article locating and centering means
JPH06350239A (ja) * 1993-06-04 1994-12-22 Toyota Motor Corp 電極のハンダ付け方法
US5466171A (en) 1994-09-19 1995-11-14 Molex Incorporated Polarizing system for a blind mating electrical connector assembly
JP3529895B2 (ja) 1995-05-31 2004-05-24 三菱電機株式会社 半導体装置およびその製造方法
TW351865B (en) * 1996-03-18 1999-02-01 Japan Solderless Terminal Mfg A connector for trip wire
US5796590A (en) * 1996-11-05 1998-08-18 Micron Electronics, Inc. Assembly aid for mounting packaged integrated circuit devices to printed circuit boards
KR100268460B1 (ko) 1996-12-07 2000-10-16 윤종용 표면실장용 반도체ic의 위치결정장치
US6039581A (en) * 1997-12-30 2000-03-21 Honeywell Inc. Electrical connector for circuit card assemblies
US6200143B1 (en) * 1998-01-09 2001-03-13 Tessera, Inc. Low insertion force connector for microelectronic elements
US20010014551A1 (en) * 1998-10-13 2001-08-16 Steven E. Blashewski Plug-in module with installation guide, retention feature, and handle

Also Published As

Publication number Publication date
US6606789B2 (en) 2003-08-19
AU2001248990A1 (en) 2001-10-30
EP1283006A1 (en) 2003-02-12
SE518778C2 (sv) 2002-11-19
SE0001452L (sv) 2001-10-20
US20020042988A1 (en) 2002-04-18
WO2001080610A1 (en) 2001-10-25

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