AU2001248990A1 - A method for mounting at least one electronic or mechanical component, a guide element and an electronic or mechanical component - Google Patents

A method for mounting at least one electronic or mechanical component, a guide element and an electronic or mechanical component

Info

Publication number
AU2001248990A1
AU2001248990A1 AU2001248990A AU4899001A AU2001248990A1 AU 2001248990 A1 AU2001248990 A1 AU 2001248990A1 AU 2001248990 A AU2001248990 A AU 2001248990A AU 4899001 A AU4899001 A AU 4899001A AU 2001248990 A1 AU2001248990 A1 AU 2001248990A1
Authority
AU
Australia
Prior art keywords
electronic
mechanical component
mounting
guide element
mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001248990A
Inventor
Ulf Jansson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of AU2001248990A1 publication Critical patent/AU2001248990A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
AU2001248990A 2000-04-19 2001-04-18 A method for mounting at least one electronic or mechanical component, a guide element and an electronic or mechanical component Abandoned AU2001248990A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0001452 2000-04-19
SE0001452A SE518778C2 (en) 2000-04-19 2000-04-19 Method and apparatus for mounting an electronic or mechanical component on a circuit board and a control element arranged to be surface mounted on a circuit board
PCT/SE2001/000850 WO2001080610A1 (en) 2000-04-19 2001-04-18 A method for mounting at least one electronic or mechanical component, a guide element and an electronic or mechanical component

Publications (1)

Publication Number Publication Date
AU2001248990A1 true AU2001248990A1 (en) 2001-10-30

Family

ID=20279379

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001248990A Abandoned AU2001248990A1 (en) 2000-04-19 2001-04-18 A method for mounting at least one electronic or mechanical component, a guide element and an electronic or mechanical component

Country Status (5)

Country Link
US (1) US6606789B2 (en)
EP (1) EP1283006A1 (en)
AU (1) AU2001248990A1 (en)
SE (1) SE518778C2 (en)
WO (1) WO2001080610A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7170165B2 (en) * 2005-02-02 2007-01-30 Agilent Technologies, Inc. Circuit board assembly with a brace surrounding a ball-grid array device
CN2853253Y (en) * 2005-09-29 2007-01-03 南京德朔实业有限公司 Turning saw
TWI359633B (en) * 2008-10-20 2012-03-01 Askey Computer Corp Assembly device
TWI382796B (en) * 2008-12-30 2013-01-11 Au Optronics Corp Method for manufacturing pcb, display module and fabricating method thereof
US9297494B1 (en) * 2013-08-28 2016-03-29 The Boeing Company Dagger pin interface apparatus with swivel pin
CN106851980B (en) * 2017-03-01 2023-05-26 汉得利（常州）电子股份有限公司 Mounting structure of welding-free component conversion device

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3387365A (en) * 1965-09-28 1968-06-11 John P. Stelmak Method of making electrical connections to a miniature electronic component
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
US3533155A (en) * 1967-07-06 1970-10-13 Western Electric Co Bonding with a compliant medium
US3634930A (en) * 1969-06-12 1972-01-18 Western Electric Co Methods for bonding leads and testing bond strength
US3608711A (en) * 1969-10-06 1971-09-28 Teledyne Inc Package for electronic devices and the like
US3859723A (en) * 1973-11-05 1975-01-14 Microsystems Int Ltd Bonding method for multiple chip arrays
US4025716A (en) * 1975-01-30 1977-05-24 Burroughs Corporation Dual in-line package with window frame
JPS5694800A (en) * 1979-12-28 1981-07-31 Taiyo Yuden Kk Method and device for mounting electronic part
DE3616897C1 (en) * 1986-05-20 1987-09-17 Fritz Raible Soldered connection maker for electrical and/or electronic components
US4967311A (en) 1987-07-22 1990-10-30 Tandem Computers Incorporated Electronic module interconnection system
USRE35578E (en) * 1988-12-12 1997-08-12 Sgs-Thomson Microelectronics, Inc. Method to install an electronic component and its electrical connections on a support, and product obtained thereby
US5101550A (en) * 1989-02-10 1992-04-07 Honeywell Inc. Removable drop-through die bond frame
US4956911A (en) * 1990-05-18 1990-09-18 Ag Communication Systems Corporation Tool for repairing surface mounted components on printed circuit board
IT1242420B (en) * 1990-09-03 1994-03-04 Ri Co Srl MOUNTING METHOD FOR THE APPLICATION OF ELECTRONIC COMPONENTS ON FLEXIBLE PRINTED CIRCUITS.
US5312264A (en) * 1991-11-04 1994-05-17 Gte Products Corp. Article locating and centering means
JPH06350239A (en) * 1993-06-04 1994-12-22 Toyota Motor Corp Soldering method for electrode
US5466171A (en) 1994-09-19 1995-11-14 Molex Incorporated Polarizing system for a blind mating electrical connector assembly
JP3529895B2 (en) 1995-05-31 2004-05-24 三菱電機株式会社 Semiconductor device and manufacturing method thereof
TW351865B (en) 1996-03-18 1999-02-01 Japan Solderless Terminal Mfg A connector for trip wire
US5796590A (en) * 1996-11-05 1998-08-18 Micron Electronics, Inc. Assembly aid for mounting packaged integrated circuit devices to printed circuit boards
KR100268460B1 (en) 1996-12-07 2000-10-16 윤종용 Positioning device of surface mount semiconductor IC
US6039581A (en) * 1997-12-30 2000-03-21 Honeywell Inc. Electrical connector for circuit card assemblies
US6200143B1 (en) * 1998-01-09 2001-03-13 Tessera, Inc. Low insertion force connector for microelectronic elements
US20010014551A1 (en) * 1998-10-13 2001-08-16 Steven E. Blashewski Plug-in module with installation guide, retention feature, and handle

Also Published As

Publication number Publication date
US20020042988A1 (en) 2002-04-18
SE0001452D0 (en) 2000-04-19
SE0001452L (en) 2001-10-20
US6606789B2 (en) 2003-08-19
EP1283006A1 (en) 2003-02-12
WO2001080610A1 (en) 2001-10-25
SE518778C2 (en) 2002-11-19

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