RU2632045C2 - Устройство для полировки изделий - Google Patents

Устройство для полировки изделий Download PDF

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Publication number
RU2632045C2
RU2632045C2 RU2013128242A RU2013128242A RU2632045C2 RU 2632045 C2 RU2632045 C2 RU 2632045C2 RU 2013128242 A RU2013128242 A RU 2013128242A RU 2013128242 A RU2013128242 A RU 2013128242A RU 2632045 C2 RU2632045 C2 RU 2632045C2
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RU
Russia
Prior art keywords
plate
polishing
upper ring
carrier plate
stopper
Prior art date
Application number
RU2013128242A
Other languages
English (en)
Russian (ru)
Other versions
RU2013128242A (ru
Inventor
Еити МОРОЗУМИ
Харумити КОЯМА
Манабу КАСУО
Масаки ВАДА
Original Assignee
Фудзикоси Мэшинери Корп.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Фудзикоси Мэшинери Корп. filed Critical Фудзикоси Мэшинери Корп.
Publication of RU2013128242A publication Critical patent/RU2013128242A/ru
Application granted granted Critical
Publication of RU2632045C2 publication Critical patent/RU2632045C2/ru

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
RU2013128242A 2012-06-20 2013-06-19 Устройство для полировки изделий RU2632045C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012138375A JP6028410B2 (ja) 2012-06-20 2012-06-20 ワーク研磨装置
JP2012-138375 2012-06-20

Publications (2)

Publication Number Publication Date
RU2013128242A RU2013128242A (ru) 2014-12-27
RU2632045C2 true RU2632045C2 (ru) 2017-10-02

Family

ID=49890643

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2013128242A RU2632045C2 (ru) 2012-06-20 2013-06-19 Устройство для полировки изделий

Country Status (5)

Country Link
JP (1) JP6028410B2 (ko)
KR (1) KR102017900B1 (ko)
CN (1) CN103506935B (ko)
RU (1) RU2632045C2 (ko)
TW (1) TWI643705B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107309726A (zh) * 2017-08-14 2017-11-03 海盐孚邦机械有限公司 一种柱塞套生产用半自动端面磨平机
CN108581749A (zh) * 2018-04-28 2018-09-28 湖南宇晶机器股份有限公司 高精密曲面抛光机精准加压系统
CN114505782B (zh) * 2020-11-17 2023-08-04 长鑫存储技术有限公司 固定装置及检测系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1104762A1 (ru) * 1979-04-23 1988-03-07 Грузинский политехнический институт им.В.И.Ленина Устройство дл абразивной обработки плоских поверхностей
JPH0699349A (ja) * 1992-09-18 1994-04-12 Toshiba Mach Co Ltd 研磨方法及びその装置
US5377451A (en) * 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US6328629B1 (en) * 1997-02-19 2001-12-11 Ebara Corporation Method and apparatus for polishing workpiece

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04129668A (ja) * 1990-09-18 1992-04-30 Asahi Glass Co Ltd 研磨装置及び研磨方法
CN1445060A (zh) * 2002-03-07 2003-10-01 株式会社荏原制作所 抛光装置
TWI238754B (en) * 2002-11-07 2005-09-01 Ebara Tech Inc Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof
JP2005159011A (ja) * 2003-11-26 2005-06-16 Seiko Epson Corp 研磨装置、リテーナーリングおよび半導体装置の製造方法
CN101972979B (zh) * 2010-08-30 2012-03-21 南京航空航天大学 一种金刚石表面化学机械复合研磨抛光方法与装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1104762A1 (ru) * 1979-04-23 1988-03-07 Грузинский политехнический институт им.В.И.Ленина Устройство дл абразивной обработки плоских поверхностей
JPH0699349A (ja) * 1992-09-18 1994-04-12 Toshiba Mach Co Ltd 研磨方法及びその装置
US5377451A (en) * 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US6328629B1 (en) * 1997-02-19 2001-12-11 Ebara Corporation Method and apparatus for polishing workpiece

Also Published As

Publication number Publication date
TWI643705B (zh) 2018-12-11
CN103506935A (zh) 2014-01-15
KR20130142925A (ko) 2013-12-30
RU2013128242A (ru) 2014-12-27
JP2014000647A (ja) 2014-01-09
KR102017900B1 (ko) 2019-09-03
TW201400238A (zh) 2014-01-01
CN103506935B (zh) 2017-12-22
JP6028410B2 (ja) 2016-11-16

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