RU2614387C2 - Сборка на печатной плате - Google Patents

Сборка на печатной плате Download PDF

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Publication number
RU2614387C2
RU2614387C2 RU2013140175A RU2013140175A RU2614387C2 RU 2614387 C2 RU2614387 C2 RU 2614387C2 RU 2013140175 A RU2013140175 A RU 2013140175A RU 2013140175 A RU2013140175 A RU 2013140175A RU 2614387 C2 RU2614387 C2 RU 2614387C2
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RU
Russia
Prior art keywords
substrate
electronic components
circuit board
printed circuit
category
Prior art date
Application number
RU2013140175A
Other languages
English (en)
Russian (ru)
Other versions
RU2013140175A (ru
Inventor
Ханфэн ЦЗИ
Абрахам Рудольф БАЛКЕНЕНДЕ
Хун ЧЭНЬ
Original Assignee
Филипс Лайтинг Холдинг Б.В.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Филипс Лайтинг Холдинг Б.В. filed Critical Филипс Лайтинг Холдинг Б.В.
Publication of RU2013140175A publication Critical patent/RU2013140175A/ru
Application granted granted Critical
Publication of RU2614387C2 publication Critical patent/RU2614387C2/ru

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/047—Soldering with different solders, e.g. two different solders on two sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Processing Of Solid Wastes (AREA)
RU2013140175A 2011-01-30 2012-01-30 Сборка на печатной плате RU2614387C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN2011070824 2011-01-30
CNPCT/CN2011/070824 2011-01-30
PCT/IB2012/050408 WO2012101611A1 (en) 2011-01-30 2012-01-30 Printed circuit board assembly

Publications (2)

Publication Number Publication Date
RU2013140175A RU2013140175A (ru) 2015-03-10
RU2614387C2 true RU2614387C2 (ru) 2017-03-27

Family

ID=45768261

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2013140175A RU2614387C2 (ru) 2011-01-30 2012-01-30 Сборка на печатной плате

Country Status (7)

Country Link
US (1) US9113584B2 (enExample)
EP (1) EP2668834A1 (enExample)
JP (1) JP6138698B2 (enExample)
CN (1) CN103340021B (enExample)
BR (1) BR112013019109A2 (enExample)
RU (1) RU2614387C2 (enExample)
WO (1) WO2012101611A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2815074C1 (ru) * 2023-05-10 2024-03-11 Акционерное общество "МЦСТ" Гибридное посадочное место конденсаторов

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3011713B1 (fr) * 2013-10-09 2017-06-23 Valeo Systemes De Controle Moteur Module electrique, systeme electrique comportant un tel module electrique, procedes de fabrication correspondants
CN104792438B (zh) * 2014-01-17 2018-03-30 上海宝信软件股份有限公司 电子组件生命期监测系统
US10772249B2 (en) 2015-03-18 2020-09-08 Mycronic AB Method, system and device for providing and changing information related to an SMT job
CN105791725A (zh) * 2016-03-14 2016-07-20 东莞康佳电子有限公司 超高清人机交互电视生产线工艺
GB2555659B (en) * 2016-11-07 2020-01-15 Cirrus Logic Int Semiconductor Ltd Package for MEMS device and process
DE102022113851A1 (de) * 2022-06-01 2023-12-07 Ersa Gmbh System zur Bestimmung von Verschmutzungskoeffizienten und/oder Verschmutzungsgraden insbesondere beim Reflowlöten von Leiterplatten und zugehörige Auswerteinheit
DE102024131479A1 (de) * 2024-10-29 2026-04-30 Tridonic Gmbh & Co Kg Leiterplatte und verfahren zum trennen von bauteilen von einem träger einer leiterplatte und vorzugsweise recyceln dieser bauteile

Citations (4)

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US6705509B2 (en) * 1999-08-31 2004-03-16 Senju Metal Industry Co., Ltd. Method of recovering lead-free solder from printed circuit boards
RU2340431C2 (ru) * 2004-01-21 2008-12-10 Рем Термаль Системз ГмбХ Ремонтно-паяльная головка и осуществляемые посредством такой головки способы
US20090033337A1 (en) * 2007-08-03 2009-02-05 Pasco Robert W Temporary chip attach test carrier utilizing an interposer
US20090184407A1 (en) * 2008-01-17 2009-07-23 International Business Machines Corporation Method to recover underfilled modules by selective removal of discrete components

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US4561006A (en) 1982-07-06 1985-12-24 Sperry Corporation Integrated circuit package with integral heating circuit
US5241454A (en) 1992-01-22 1993-08-31 International Business Machines Corporation Mutlilayered flexible circuit package
JPH06260731A (ja) * 1993-03-08 1994-09-16 Hitachi Ltd プリント回路基板および該プリント回路基板を備えた回路装置
JPH09103761A (ja) * 1995-10-12 1997-04-22 Hitachi Ltd 電子部品搭載プリント配線基板の処理方法及びその装置
JPH10303523A (ja) * 1997-04-30 1998-11-13 Ricoh Co Ltd プリント回路基板
JP3603605B2 (ja) * 1998-08-04 2004-12-22 株式会社日立製作所 プリント板のリサイクル方法及びその装置
EP1156706B1 (en) * 1999-01-11 2003-10-08 Matsushita Electric Industrial Co., Ltd. A method for recycling wastes of an article having a circuit soldered with parts
JP2001135928A (ja) * 1999-11-08 2001-05-18 Pfu Ltd 再利用装置および再利用方法
JP2001203447A (ja) * 2000-01-18 2001-07-27 Minolta Co Ltd 部品を保持した保持部材、プリント板実装品、及びプリント板実装品の部品分別方法
JP3463685B2 (ja) * 2002-02-04 2003-11-05 株式会社日立製作所 分解方法およびリサイクル方法
US20040181923A1 (en) * 2003-03-17 2004-09-23 Dills James Carl Process for reusing and recycling circuit boards
US6910615B2 (en) * 2003-03-27 2005-06-28 International Business Machines Corporation Solder reflow type electrical apparatus packaging having integrated circuit and discrete components
JP4763725B2 (ja) * 2005-12-28 2011-08-31 富士通株式会社 はんだ除去装置、はんだ除去方法
KR101364538B1 (ko) 2007-12-12 2014-02-18 삼성전자주식회사 적어도 2종의 전자 부품들의 실장 방법 및 실장 장치
US8293388B2 (en) * 2009-03-02 2012-10-23 Rocky Research Thermal energy battery and method for cooling temperature sensitive components
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6705509B2 (en) * 1999-08-31 2004-03-16 Senju Metal Industry Co., Ltd. Method of recovering lead-free solder from printed circuit boards
RU2340431C2 (ru) * 2004-01-21 2008-12-10 Рем Термаль Системз ГмбХ Ремонтно-паяльная головка и осуществляемые посредством такой головки способы
US20090033337A1 (en) * 2007-08-03 2009-02-05 Pasco Robert W Temporary chip attach test carrier utilizing an interposer
US20090184407A1 (en) * 2008-01-17 2009-07-23 International Business Machines Corporation Method to recover underfilled modules by selective removal of discrete components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2815074C1 (ru) * 2023-05-10 2024-03-11 Акционерное общество "МЦСТ" Гибридное посадочное место конденсаторов

Also Published As

Publication number Publication date
BR112013019109A2 (pt) 2017-11-07
EP2668834A1 (en) 2013-12-04
US20130314885A1 (en) 2013-11-28
CN103340021B (zh) 2016-11-02
CN103340021A (zh) 2013-10-02
US9113584B2 (en) 2015-08-18
WO2012101611A1 (en) 2012-08-02
RU2013140175A (ru) 2015-03-10
JP2014504031A (ja) 2014-02-13
JP6138698B2 (ja) 2017-05-31

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Legal Events

Date Code Title Description
HZ9A Changing address for correspondence with an applicant
MM4A The patent is invalid due to non-payment of fees

Effective date: 20200131