RU2018122239A - Способ осаждения из газовой фазы путем разложения металлоорганических соединений с применением в качестве них алкилиндиевых соединений в виде их растворов в углеводородах - Google Patents
Способ осаждения из газовой фазы путем разложения металлоорганических соединений с применением в качестве них алкилиндиевых соединений в виде их растворов в углеводородах Download PDFInfo
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- indium
- gas
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- 238000000034 method Methods 0.000 title claims 16
- 150000001875 compounds Chemical class 0.000 title claims 7
- 150000002902 organometallic compounds Chemical group 0.000 title claims 5
- 238000000354 decomposition reaction Methods 0.000 title claims 4
- 229930195733 hydrocarbon Natural products 0.000 title claims 4
- 150000002430 hydrocarbons Chemical class 0.000 title claims 4
- 239000004215 Carbon black (E152) Substances 0.000 title claims 3
- 230000008021 deposition Effects 0.000 title claims 2
- 239000007789 gas Substances 0.000 claims 7
- 229910052738 indium Inorganic materials 0.000 claims 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 7
- 125000004432 carbon atom Chemical group C* 0.000 claims 5
- 239000002243 precursor Substances 0.000 claims 5
- 238000006243 chemical reaction Methods 0.000 claims 4
- 239000002904 solvent Substances 0.000 claims 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 claims 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 239000012159 carrier gas Substances 0.000 claims 2
- 238000007740 vapor deposition Methods 0.000 claims 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims 1
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 1
- 150000001491 aromatic compounds Chemical class 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000000407 epitaxy Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 claims 1
- 239000008096 xylene Substances 0.000 claims 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/407—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- C07F5/00—Compounds containing elements of Groups 3 or 13 of the Periodic Table
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/301—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
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- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
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- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
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- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
- C30B35/007—Apparatus for preparing, pre-treating the source material to be used for crystal growth
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Claims (16)
1. Способ получения индийсодержащего слоя методом осаждения из газовой фазы путем разложения металлоорганических соединений, при этом индийсодержащий слой формируют на подложке в реакционной камере (4), а индий подают в процесс в виде индийсодержащего соединения-предшественника формулы InR3, где остатки R независимо друг от друга выбраны из алкильных остатков с 1-6 атомами углерода, отличающийся тем, что индийсодержащее соединение-предшественник подают в растворе, содержащем растворитель и растворенное в нем индийсодержащее соединение-предшественник, при этом растворитель содержит по меньшей мере один углеводород с 1-8 атомами углерода.
2. Способ по п. 1, где метод осаждения из газовой фазы путем разложения металлоорганических соединений представляет собой метод газофазной эпитаксии путем разложения металлоорганических соединений.
3. Способ по меньшей мере по одному из предыдущих пунктов, где соединение-предшественник представляет собой триметилиндий.
4. Способ по меньшей мере по одному из предыдущих пунктов, где растворитель содержит по меньшей мере один алкан и/или по меньшей мере одно ароматическое соединение.
5. Способ по меньшей мере по одному из предыдущих пунктов, где растворитель состоит из углеводородов с 5-8 атомами углерода, предпочтительно представляет собой пентан, гексан, гептан, октан, толуол, бензол, ксилол или их смесь.
6. Способ по меньшей мере по одному из предыдущих пунктов, где на долю соединения-предшественника в растворе приходится от 5 до 60 мас. %.
7. Способ по меньшей мере по одному из предыдущих пунктов, при осуществлении которого раствор перед его подачей в реакционную камеру (4) переводят в газовую фазу с помощью испарителя (2) прямого действия.
8. Способ по п. 7, при осуществлении которого температура в испарителе (2) прямого действия составляет от 0 до 100°С, предпочтительно от 10 до 50°С, и/или давление в нем составляет от 50 до 1200 мбар.
9. Способ по меньшей мере по п. 7 или 8, при осуществлении которого газовую фазу перед ее поступлением в реакционную камеру (4) смешивают с газом-носителем.
10. Способ по п. 9, где испаритель (2) прямого действия имеет смесительную камеру (2), в которой газовую фазу смешивают с газом-носителем.
11. Способ по меньшей мере по одному из пп. 7-10, где испаритель (2) прямого действия имеет регулятор (5) расхода жидкости, регулятор (12) расхода газа, смесительную камеру (2) и смесительный клапан.
12. Способ по меньшей мере по одному из предыдущих пунктов, при осуществлении которого в реакционную камеру (4) вводят еще по меньшей мере одно реакционноспособное вещество.
13. Применение раствора, состоящего из
(а) соединения формулы InR3, где остатки R независимо друг от друга выбраны из алкильных остатков с 1-6 атомами углерода, в количестве от 5 до 60 мас. % и
(б) по меньшей мере одного углеводорода с 1-8 атомами углерода в количестве от 40 до 95 мас. %,
для получения индийсодержащего слоя методом осаждения из газовой фазы путем разложения металлоорганических соединений.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15196340.2 | 2015-11-25 | ||
EP15196340.2A EP3173507A1 (de) | 2015-11-25 | 2015-11-25 | Verfahren zur metallorganischen gasphasenabscheidung unter verwendung von lösungen von indiumalkylverbindungen in kohlenwasserstoffen |
PCT/EP2016/078705 WO2017089477A1 (de) | 2015-11-25 | 2016-11-24 | Verfahren zur metallorganischen gasphasenabscheidung unter verwendung von lösungen von indiumalkylverbindungen in kohlenwasserstoffen |
Publications (3)
Publication Number | Publication Date |
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RU2018122239A true RU2018122239A (ru) | 2019-12-26 |
RU2018122239A3 RU2018122239A3 (ru) | 2020-01-30 |
RU2717452C2 RU2717452C2 (ru) | 2020-03-23 |
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Application Number | Title | Priority Date | Filing Date |
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RU2018122239A RU2717452C2 (ru) | 2015-11-25 | 2016-11-24 | Способ осаждения из газовой фазы путем разложения металлоорганических соединений с применением в качестве них алкилиндиевых соединений в виде их растворов в углеводородах |
Country Status (8)
Country | Link |
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US (1) | US20180355478A1 (ru) |
EP (2) | EP3173507A1 (ru) |
JP (2) | JP7197357B2 (ru) |
CN (1) | CN108291301B (ru) |
DE (1) | DE112016005399A5 (ru) |
RU (1) | RU2717452C2 (ru) |
TW (1) | TWI810148B (ru) |
WO (1) | WO2017089477A1 (ru) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2020050974A1 (en) * | 2018-09-03 | 2020-03-12 | Applied Materials, Inc. | Direct liquid injection system for thin film deposition |
CN110983300B (zh) * | 2019-12-04 | 2023-06-20 | 江苏菲沃泰纳米科技股份有限公司 | 镀膜设备及其应用 |
CN113502460B (zh) * | 2021-09-09 | 2021-12-03 | 苏州长光华芯光电技术股份有限公司 | 一种半导体结构的制备方法、半导体生长设备 |
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2015
- 2015-11-25 EP EP15196340.2A patent/EP3173507A1/de not_active Withdrawn
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2016
- 2016-11-23 TW TW105138442A patent/TWI810148B/zh active
- 2016-11-24 US US15/778,274 patent/US20180355478A1/en not_active Abandoned
- 2016-11-24 JP JP2018527110A patent/JP7197357B2/ja active Active
- 2016-11-24 CN CN201680068576.9A patent/CN108291301B/zh active Active
- 2016-11-24 RU RU2018122239A patent/RU2717452C2/ru active
- 2016-11-24 DE DE112016005399.1T patent/DE112016005399A5/de not_active Withdrawn
- 2016-11-24 WO PCT/EP2016/078705 patent/WO2017089477A1/de active Application Filing
- 2016-11-24 EP EP16801225.0A patent/EP3380646B1/de active Active
-
2022
- 2022-09-30 JP JP2022158583A patent/JP2022188165A/ja active Pending
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TW201734253A (zh) | 2017-10-01 |
EP3380646B1 (de) | 2020-07-08 |
EP3173507A1 (de) | 2017-05-31 |
JP2018538443A (ja) | 2018-12-27 |
CN108291301B (zh) | 2021-12-28 |
RU2717452C2 (ru) | 2020-03-23 |
JP7197357B2 (ja) | 2022-12-27 |
JP2022188165A (ja) | 2022-12-20 |
DE112016005399A5 (de) | 2018-08-09 |
TWI810148B (zh) | 2023-08-01 |
RU2018122239A3 (ru) | 2020-01-30 |
WO2017089477A1 (de) | 2017-06-01 |
EP3380646A1 (de) | 2018-10-03 |
KR20180085764A (ko) | 2018-07-27 |
US20180355478A1 (en) | 2018-12-13 |
CN108291301A (zh) | 2018-07-17 |
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