RU2018103260A - Способ производства компонента из керамических материалов - Google Patents
Способ производства компонента из керамических материалов Download PDFInfo
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- RU2018103260A RU2018103260A RU2018103260A RU2018103260A RU2018103260A RU 2018103260 A RU2018103260 A RU 2018103260A RU 2018103260 A RU2018103260 A RU 2018103260A RU 2018103260 A RU2018103260 A RU 2018103260A RU 2018103260 A RU2018103260 A RU 2018103260A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
- C04B35/101—Refractories from grain sized mixtures
- C04B35/106—Refractories from grain sized mixtures containing zirconium oxide or zircon (ZrSiO4)
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
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- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/001—Joining burned ceramic articles with other burned ceramic articles or other articles by heating directly with other burned ceramic articles
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
- G01L9/0044—Constructional details of non-semiconductive diaphragms
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- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
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Claims (14)
1. Способ производства компонента из керамических материалов, в котором:
множество слоев наносят на основной корпус (1) с помощью трафаретной печати или шаблонной печати, причем указанные слои сформированы из керамического материала, в каждом случае в определенном расположении один над другим, в виде пасты или суспензии, в которую включены порошкообразный керамический материал и по меньшей мере одно связующее, и при этом формируют по меньшей мере одну область внутри по меньшей мере одного слоя (2), имеющего определенную толщину и геометрическую форму, из дополнительного материала, который может быть удален при термической обработке и который также наносят в виде пасты или суспензии с помощью трафаретной печати или шаблонной печати; и
электрически функционирующие структуры, состоящие из электропроводящего или полупроводящего материала, наносят на и/или формируют на и/или в по меньшей мере одном из керамических слоев перед нанесением дополнительного керамического слоя; и
слоистую структуру подвергают спеканию при термической обработке, при этом происходит удаление дополнительного материала, и образуется по меньшей мере одна полость (4), имеющая определенные размеры по ширине, длине и высоте.
2. Способ по п. 1, отличающийся тем, что керамические слои сформированы из низкотемпературной совместно обжигаемой керамики (LTCC), высокотемпературной совместно обжигаемой керамики (НТСС), Al2O3, ZrO2, упрочненного оксидом алюминия оксида циркония (ATZ), упрочненного оксидом циркония оксида алюминия (ZTA), AlN и/или Si3N4.
3. Способ по любому из предшествующих пунктов, отличающийся тем, что слои компонента сформированы в определенном порядке, в определенном количестве и с определенной толщиной, в каждом случае из разных керамических материалов, при этом указанные разные керамические материалы имеют различные коэффициенты теплового расширения и/или различные степени усадки при спекании и способны спекаться друг с другом.
4. Способ по п. 1 или 2, отличающийся тем, что в нем используют эпоксидную смолу, поливиниловый спирт (ПВА), поливинилбутираль (ПВБ), поливинилиденфторид (ПВДФ), альгинаты, акрилаты, целлюлозы или системы, отвердевающие под действием УФ-излучения.
5. Способ по любому из предшествующих пунктов, отличающийся тем, что термическую обработку осуществляют в температурном диапазоне от 500°С до 1800°С.
6. Способ по любому из предшествующих пунктов, отличающийся тем, что области, в которые вводят дополнительный материал, формируют внутри по меньшей мере одного слоя, имеющего определенную толщину и геометрическую форму, посредством штамповки и/или лазерной абляции.
7. Способ по любому из предшествующих пунктов, отличающийся тем, что электрически функционирующие структуры выполнены в виде электрических электродов или проводящих дорожек, электрических резисторов и/или катушек и/или конденсаторных устройств.
8. Способ по любому из предшествующих пунктов, отличающийся тем, что каналы, камеры, мембраны и/или механические пружины формируют вместе с полостями (4), образованными внутри компонента.
9. Способ по любому из предшествующих пунктов, отличающийся тем, что формируют мембраны, имеющие усиления и/или буртики, расположенные локально определенным образом и имеющие размеры, заданные определенным образом.
10. Способ по любому из предшествующих пунктов, отличающийся тем, что формируют слои, имеющие толщину в диапазоне от 10 мкм до 50 мкм, предпочтительно в диапазоне от 10 мкм до 20 мкм.
11. Применение компонента, изготовленного с помощью способа по любому из предшествующих пунктов, в качестве датчика давления, датчика силы, датчика ускорения, микронасоса, мембранного клапана, микрореакторов, микросмесителей, электромагнитного датчика или топливного элемента и/или чувствительного элемента пьезоэлектрического привода.
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DE102015214997.8A DE102015214997A1 (de) | 2015-08-06 | 2015-08-06 | Verfahren zur Herstellung eines Bauteils aus keramischen Werkstoffen |
PCT/EP2016/068123 WO2017021291A1 (de) | 2015-08-06 | 2016-07-29 | Verfahren zur herstellung eines bauteils aus keramischen werkstoffen |
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EP3707559B1 (en) | 2017-11-08 | 2023-04-19 | ASML Netherlands B.V. | A substrate holder and a method of manufacturing a device |
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US4353957A (en) * | 1973-09-24 | 1982-10-12 | Tam Ceramics Inc. | Ceramic matrices for electronic devices and process for forming same |
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US4766671A (en) * | 1985-10-29 | 1988-08-30 | Nec Corporation | Method of manufacturing ceramic electronic device |
US4704304A (en) * | 1986-10-27 | 1987-11-03 | International Business Machines Corporation | Method for repair of opens in thin film lines on a substrate |
DE3725455A1 (de) * | 1987-07-31 | 1989-02-09 | Siemens Ag | Elektrisches vielschichtbauelement mit einem gesinterten, monolithischen keramikkoerper und verfahren zur herstellung des elektrischen vielschichtbauelementes |
JP3551876B2 (ja) * | 2000-01-12 | 2004-08-11 | 株式会社村田製作所 | 積層セラミック電子部品の製造方法 |
DE10032333A1 (de) * | 2000-07-04 | 2002-01-24 | Bosch Gmbh Robert | Keramischer Grünkörper, Verfahren zur Herstellung eines derartigen Grünkörpers und Verfahren zur Herstellung eines Keramikkörpers mit dem Grünkörper |
US7494557B1 (en) * | 2004-01-30 | 2009-02-24 | Sandia Corporation | Method of using sacrificial materials for fabricating internal cavities in laminated dielectric structures |
US20070193675A1 (en) * | 2006-02-22 | 2007-08-23 | Abhijit Gurav | Process of manufacturing a multilayer device and device manufactured thereby |
US20080218932A1 (en) * | 2007-03-08 | 2008-09-11 | Berlin Carl W | Embedded capacitor |
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