CN108136742A - 由陶瓷材料生产部件的方法 - Google Patents

由陶瓷材料生产部件的方法 Download PDF

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Publication number
CN108136742A
CN108136742A CN201680045921.7A CN201680045921A CN108136742A CN 108136742 A CN108136742 A CN 108136742A CN 201680045921 A CN201680045921 A CN 201680045921A CN 108136742 A CN108136742 A CN 108136742A
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China
Prior art keywords
layer
ceramic
lotion
suspended substance
thickness
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CN201680045921.7A
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Inventor
乌韦·帕尔奇
艾德里安·戈尔德贝尔格
斯蒂芬·齐舍
比吉特·马尼卡
卡洛琳·洛尔贝格
沃尔夫冈·杜菲尔德
迪特马尔·阿恩特
沃尔弗拉姆·克恩
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Full Import And Export Ltd By Share Ltd
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
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Full Import And Export Ltd By Share Ltd
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
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Publication of CN108136742A publication Critical patent/CN108136742A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
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Abstract

本发明涉及由陶瓷材料制造部件的方法。由陶瓷材料制成的多个层通过丝网印刷或模板印刷分别以膏体或悬浮体的形式、以限定的几何形状一个位于另一个之上地施加到主体上，在该膏体或悬浮体中包括粉状陶瓷材料和至少一种粘合剂。至少一个层内的至少一个区域由另外的材料形成且具有限定的厚度和几何形状，该另外的材料在热处理期间能够被去除且同样通过丝网印刷或模板印刷以膏体或悬浮体的形式被施加。在施加另外的陶瓷层之前，由导电材料或半导体材料制成的电功能结构施加到和/或形成在陶瓷层的至少一层上和/或形成在陶瓷层的至少一层中。然后在热处理中烧结层结构，其中除去另外的材料并且形成具有限定的宽度、长度和高度的尺寸的至少一个空洞。

Description

由陶瓷材料生产部件的方法
技术领域
本发明涉及由陶瓷材料生产部件的方法。
背景技术
陶瓷多层技术的目标是实现多层陶瓷部件和微系统。除了通过使用简单的重复单元(例如具有表面电极的相同陶瓷单层膜的简单的重复单元)来建立多层电容器和叠层致动器的陶瓷部件外，基于多层的部件也可以表现出非常复杂的3D结构。这种应用领域例如传感器系统、汽车工业、电信、和医学工程以及生物工程。在所述应用中，使用LTCC(低温共烧陶瓷，在T<1000℃烧结)和HTCC(高温共烧陶瓷，在T>1000℃烧结)作为基膜。
根据固定的过程建立多层部件是所有应用共有的。在切割成未加工的(green)、即未烧结的单层膜的尺寸之后，可以逐层形成通孔和可能进一步需要的用于空腔的开口。随后通过丝网印刷工艺对通孔进行金属化，并且印刷具有所需功能结构(例如导电迹线或电阻器)的单层膜。随后的工艺步骤是以这种方式制造的单层膜的堆叠以及它们在高温(70℃-90℃)下的压制。在随后的共烧、即包括在多层部件中的材料的共同烧制中，多层结构被压实并且被赋予所需的功能特性。
除了电功能单元外，还可以形成非电元件(例如用于传导或混合流体介质的通道和腔室、或用于压力和力测量的膜或机械弹性件)。
利用可用的电介质基膜配置所需的非电功能元件是所有这些应用共有的。由于所述基膜具有大约50μm至250μm的膜厚度，所以可以产生的结构分辨率、即小型化受到限制。
发明内容
因此，本发明的目的是提供用于由陶瓷材料生产部件的方法，其中利用陶瓷材料，部件可以进一步小型化。
根据本发明的用于由陶瓷材料生产部件的方法具有权利要求1的特征。本发明的有利实施方式和进一步的发展可以使用从属权利要求中指定的特征来实现。
在根据本发明的用于由陶瓷材料生产部件的方法中，通过丝网印刷或模板印刷将多个层施加到基体，在每一种情况下所述层以限定的几何形状、以悬浮体或膏体的形式一个位于另一个上方由陶瓷材料形成，在所述悬浮体或膏体中包括粉状陶瓷材料和至少一种粘合剂。这里，在至少一个层内形成至少一个区域，该至少一个区域具有限定的厚度和几何形状且由另外的粉末材料构成，所述另外的粉末材料可以在热处理中除去并且同样地通过丝网印刷或模板印刷以悬浮体或膏体的形式施加。
陶瓷层可由具有电绝缘或离子导电性能的LTCC、HTCC、氧化铝、氧化锆、氧化铝增韧的氧化锆(ATZ)、氧化锆增韧的氧化铝(ZTA)、氮化铝和/或氮化硅形成。另外的材料也可以被称为牺牲材料。
在根据本发明的方法的替代方案中，其中引入另外的材料的区域可以在具有限定的厚度和几何形状的至少一个层内形成，例如，通过冲压和/或激光烧蚀。
在施加另外的陶瓷层之前，由导电材料或半导体材料构成的电功能结构可以施加到和/或形成在陶瓷层的至少一层上和/或形成在陶瓷层的至少一层中。电功能结构可以配置成电极或导电轨线、电阻器和/或线圈装置或电容器装置的形式。
层结构在热处理中被烧结，其中去除(烧掉)另外的材料和有机成分，并且形成具有限定的宽度、长度和高度的尺寸的至少一个空洞。热处理可以在500℃至1800℃范围内的温度下进行。
通道、腔室、膜和/或机械弹性件可以形成有在部件内部形成的空洞。这里，膜可以形成有以局部限定的方式布置并且以限定的方式确定尺寸的增强件和/或凸起。
可以使用根据本发明的方法形成厚度在10μm至50μm的范围内、优选在10μm至20μm的范围内的层。
在根据本发明的方法的实施方式变型中，部件可以形成有不同的陶瓷材料层；其中，陶瓷材料在烧结时具有不同的热膨胀系数和/或不同的收缩度。由不同陶瓷材料构成的层在这里可以按照限定的顺序、以限定的数量和限定的厚度一个在另一个的上方形成。所用的陶瓷材料应该可以相互烧结，并且出于该目的应该能够利用材料的连续性而结合。在产生烧结的热处理中，可以通过不同陶瓷材料的不同的热膨胀系数和/或它们不同的收缩度将应变和变形直接引入到部件中。由此可以实现部件在限定的温度变化下的可预定义的行为。适用于此目的的材料配对是例如LTCC、氧化锆/ATZ、ATZ/ZTA。
使用根据本发明的方法制造的部件可以用作压力传感器、力传感器、加速度传感器、微型泵、隔膜阀、微型反应器、微混合器、电化学传感器、燃料电池或压电致动器元件和/或传感器元件。
使用根据本发明的方法可以实现从10μm到20μm的层厚度，并且因此相对于常规方法，在部件的厚度上的结构分辨率加倍并且因此横向尺寸上的结构分辨率也加倍。可以以相减结构化的方式和相加结构化的方式形成具有空间分辨率的单层。这例如使得膜或弹性件的高度精确定位的加强成为可能。还可以形成小型化和堆叠的自支撑机械元件，例如具有用于增加的过载保护特性的机械支撑的差压传感器。因此可以使用具有不同壁厚的壁元件。此外，使用根据本发明的方法可以在各个层的电功能单元之间以简单的方式形成通孔。
就此而言，可以补充和组合已知的标准结构，并且可以使用已知的相容材料系统，例如用于集成导电轨线、拉伸传感器和温度传感器或压电传感器的相容材料系统。此外，通过该方法可以优化由陶瓷材料制造部件的成本。
附图说明
下面将参考附图更详细地解释本发明。
附图显示：
图1以举例的方式示出了根据本发明的用于生产在基体上具有膜的部件的方法的实施方式变型；
图2以举例的方式示出了用于生产在基体上具有膜的部件的另一个实施方式变型；
图3示出了用于生产差压传感器的实施方式变型；
图4以举例的方式示出了具有部分增强膜的部件的生产；和
图5以举例的方式示出了具有凸起膜的部件的生产。
具体实施方式
为了使用根据本发明的方法生产部件，将一个或多个牺牲材料层通过丝网印刷或模板印刷以膏体或悬浮体的形式一个位于另一个之上地施加到LTCC或HTCC基体1上，层厚度为10μm-50μm，随后干燥。膏体或悬浮体是利用例如作为溶剂的丙酮、甲基乙基酮(MEK)、MEK/乙醇、MEK/甲苯/环己醇、n-甲基-2-吡咯烷酮(NMP)、水以及例如作为粘合剂的环氧树脂、聚乙烯醇(PVA)、聚乙烯醇缩丁醛(PVB)、聚偏二氟乙烯(PVDF)、海藻酸盐、丙烯酸酯、纤维素、紫外固化系统形成。
图1示出了如何在达到牺牲层结构的预定厚度之后、将由LTCC/HTCC构成的、尺寸小于或等于部件的基底表面的圆形层或方形层3应用为另一种材料。该膏体或悬浮体的陶瓷固体材料(LTCC/HTCC)的体积百分数为30％-65％和粒度范围为0.2μm至5μm。将与基体相容的粘合剂/溶剂混合物(粘合剂：溶剂：丙酮、MEK、MEK/乙醇、MEK/甲苯/环己醇、NMP、水)用作体积百分比为35体积％-70体积％的溶剂/粘合剂混合物，以膏体或悬浮体的形式制备，并通过丝网印刷或模板印刷施加至层厚度为15μm-50μm的层结构上，随后干燥。
导电轨线和电阻器形式的电功能结构通过丝网印刷或模板印刷以膏体或悬浮体的形式依次施加到最后施加的陶瓷层上。出于此目的，形成了具有上述粘合剂-溶剂混合物并具有体积百分数为30体积％-65体积％的功能性颗粒(例如，Ag、AgPd、AgPt、Au、Pt、Ni、Cu；玻璃、RuO2、钌酸盐和0.2μm至5μm范围内的粒径)的膏体或悬浮体。
随后，全部层结构在500℃至1800℃范围内的温度下被烧结。在此去除作为另外的材料的牺牲材料并且形成空洞4。该部件因此可以用作压力传感器或作为隔膜阀。
图2示出了根据本发明的方法的替代实施方式的变型。待填充所需牺牲材料的正方形或圆形区域通过丝网印刷或模板印刷借助于HTCC/LTCC膏体或悬浮体的互补压力施加，或通过基体的激光烧蚀形成。
随后，通过丝网印刷或模板印刷施加按照图1的实施例中形成的膏体或悬浮体形式的作为另外的材料的牺牲材料，其中层厚度为10μm-50μm。将1-3层层厚度为10μm-50μm的LTCC/HTCC悬浮体或膏体施加在牺牲材料上面，并将电功能结构以导电轨线和电阻器的形式施加到所述1-3层，如在根据图1的实施例中所描述的。
随后，层结构在500℃至1800℃范围内的温度下被烧结。在此去除作为另外的材料的牺牲材料并且形成空洞4。
图3以举例的方式示出了差压传感器的生产。通过丝网印刷或模板印刷将膏体或悬浮体形式的另外的牺牲材料层或LTCC/HTCC层相继施加于如图2所述的部件。
随后在500℃-1800℃范围内的温度下烧结，去除作为另外的材料的牺牲材料并且形成两个空洞4。
例如参照图1或图2在实施例中描述的膜也可以被部分地增强。图4示出了，如已经描述的那样，首先将多个层厚度为20μm-50μm的LTCC/HTCC层施加到LTCC/HTCC的基体1。在此，这些层通过丝网印刷或模板印刷施加，使得它们在部件的表面处形成圆形或方形的切口，牺牲材料层2可以作为另外的材料通过模板印刷被引入到切口中。首先将层厚度为10μm-20μm的另外的牺牲材料层施加在一个至两个层3中，该一个至两个层3通过丝网印刷或模板印刷布置在基体上方，所述另外的层在所述多层结构的表面上留下形成的切口。随后通过丝网印刷或模板印刷施加一个至两个层3，使得切口被填充。一个至两个的层厚度为10μm-50μm的LTCC/HTCC层3涂覆在切口的上面。如已经描述的那样，导电轨线和电阻器形式的电功能结构被施加在层3上。
随后在500℃-1800℃范围内的温度下烧结该层结构，由此去除作为另外的材料的牺牲材料。形成了具有在预定位置加强的膜的部件。膜的加强部5用于分配机械应变。该部件可以例如用作压力传感器、力传感器或加速度传感器。
图5以举例的方式示出了凸起膜的制造。
如在图1的实施例中那样，将多个层厚度为10μm-50μm的牺牲材料层通过丝网印刷或模板印刷以膏体或悬浮体的形式施加到LTCC/HTCC基体1上。通过丝网印刷或模板印刷将一至两个层厚度为10μm-20μm的相同牺牲材料的圆形层2以膏体或悬浮体的形式施加到基体1上，从而在层2的限定位置处形成圆形隆起部分(凸起)。一个至两个层厚度为10μm-50μm的LTCC/HTCC层3施加在圆形层2上。如已经描述的那样，导电轨线和电阻器形式的电功能结构被施加在层3上。
随后在500℃-1800℃范围内的温度下烧结该层结构，并且去除作为另外的材料的牺牲材料。形成空洞4。这样的部件可以优选地用作压力传感器。

Claims (11)

1.一种由陶瓷材料制造部件的方法，其中，
通过丝网印刷或模板印刷将多个层施加到基体(1)上，在每一种情况下所述层以限定的几何形状、以悬浮体或膏体的形式一个位于另一个上方由陶瓷材料形成，在所述悬浮体或膏体中包括粉状陶瓷材料和至少一种粘合剂，并且在至少一个层(2)内形成至少一个区域，所述至少一个区域具有限定的厚度和几何形状且由另外的材料构成，所述另外的材料能够在热处理中除去并且同样地通过丝网印刷或模板印刷以悬浮体或膏体的形式施加；和
在施加另外的陶瓷层之前，将由导电材料或半导体材料构成的电功能结构施加到和/或形成在陶瓷层中的至少一个陶瓷层上和/或形成在陶瓷层中的至少一个陶瓷层中；和
在热处理中烧结层结构，其中除去所述另外的材料并且形成具有限定的宽度、长度和高度的尺寸的至少一个空洞(4)。
2.根据权利要求1所述的方法，其特征在于，所述陶瓷层由低温共烧陶瓷、高温共烧陶瓷、Al2O3、ZrO2、氧化铝增韧的氧化锆(ATZ)、氧化锆增韧的氧化铝(ZTA)、AlN和/或Si3N4形成。
3.根据前述权利要求中任一项所述的方法，其特征在于，在每一种情况下，所述部件的所述层以限定的顺序、限定的数量和限定的厚度由不同的陶瓷材料形成，所述不同的陶瓷材料在烧结时具有不同的热膨胀系数和/或不同的收缩度并且能够与彼此烧结。
4.根据权利要求1或权利要求2所述的方法，其特征在于，使用环氧树脂、聚乙烯醇(PVA)、聚乙烯醇缩丁醛(PVB)、聚偏二氟乙烯(PVDF)、海藻酸盐、丙烯酸酯、纤维素或者紫外固化系统。
5.根据前述权利要求中任一项所述的方法，其特征在于，所述热处理在500℃至1800℃范围内的温度下进行。
6.根据前述权利要求中任一项所述的方法，其特征在于，通过冲压和/或激光烧蚀，在至少一个层内形成引入具有限定的厚度和几何形状的另外的材料的区域。
7.根据前述权利要求中任一项所述的方法，其特征在于，电功能结构以电极或导电轨线、电阻器和/或线圈和/或电容器装置的形式配置。
8.根据前述权利要求中任一项所述的方法，其特征在于，通道、腔室、膜和/或机械弹性件形成有在所述部件内部形成的空洞(4)。
9.根据前述权利要求中任一项所述的方法，其特征在于，形成具有以局部限定的方式布置并且以限定的方式确定尺寸的增强件和/或凸起的膜。
10.根据前述权利要求中任一项所述的方法，其特征在于，形成厚度在10μm至50μm的范围内、优选地在10μm至20μm的范围内的层。
11.利用根据前述权利要求中任一项所述的方法制造的部件作为压力传感器、力传感器、加速度传感器、微型泵、隔膜阀、微型反应器、微混合器、电化学传感器、或燃料电池和/或压电致动传感元件的用途。
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US11860056B2 (en) 2018-12-21 2024-01-02 Exentis Knowledge Gmbh Shaped body and method for producing a shaped body

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DE102015214997A1 (de) 2017-02-09
WO2017021291A1 (de) 2017-02-09
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RU2018103260A3 (zh) 2019-09-06
US20190134955A1 (en) 2019-05-09
EP3331700B1 (de) 2023-09-06
EP3331700A1 (de) 2018-06-13
RU2018103260A (ru) 2019-09-06

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