RU2017134518A3 - - Google Patents
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- Publication number
- RU2017134518A3 RU2017134518A3 RU2017134518A RU2017134518A RU2017134518A3 RU 2017134518 A3 RU2017134518 A3 RU 2017134518A3 RU 2017134518 A RU2017134518 A RU 2017134518A RU 2017134518 A RU2017134518 A RU 2017134518A RU 2017134518 A3 RU2017134518 A3 RU 2017134518A3
- Authority
- RU
- Russia
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/70—Completely encapsulating inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/118—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15159352.2 | 2015-03-17 | ||
| EP15159352 | 2015-03-17 | ||
| PCT/EP2016/054282 WO2016146374A1 (en) | 2015-03-17 | 2016-03-01 | Making 3d printed shapes with interconnects and embedded components. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RU2017134518A RU2017134518A (ru) | 2019-04-05 |
| RU2017134518A3 true RU2017134518A3 (ru) | 2019-07-17 |
Family
ID=52774115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2017134518A RU2017134518A (ru) | 2015-03-17 | 2016-03-01 | Изготовление трехмерных печатных форм с межсоединениями и встроенными компонентами |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20180050486A1 (ru) |
| EP (1) | EP3271161B1 (ru) |
| JP (2) | JP6956010B2 (ru) |
| CN (1) | CN107405826A (ru) |
| RU (1) | RU2017134518A (ru) |
| WO (1) | WO2016146374A1 (ru) |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9156680B2 (en) * | 2012-10-26 | 2015-10-13 | Analog Devices, Inc. | Packages and methods for packaging |
| DE102016005596A1 (de) * | 2015-10-15 | 2017-04-20 | Kiefel Gmbh | Befüllvorrichtung zum befüllen eines medizinischen beutels, verfahren zum herstellen einer derartigen befüllvorrichtung sowie anlage zum herstellen von mit fluiden befüllten medizinischen beuteln |
| EP3216690B1 (en) * | 2016-03-07 | 2018-11-07 | Airbus Operations GmbH | Method for manufacturing a lining panel |
| EP3541602A4 (en) * | 2016-11-17 | 2020-10-28 | Orbotech Ltd. | 3D HYBRID PRINTING FROM MULTIPLE MATERIALS |
| RU2640063C1 (ru) * | 2016-12-12 | 2017-12-26 | Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг Росссии) | Способ изготовления полимерного изделия на трехмерном принтере |
| US11318537B2 (en) | 2017-01-31 | 2022-05-03 | Hewlett-Packard Development Company, L.P. | Microwave sensing in additive manufacturing |
| WO2018143904A1 (ru) * | 2017-02-02 | 2018-08-09 | Олег Юрьевич ХАЛИП | Способ изготовления из жидкого фотополимера, отверждаемого актиничным излучением, трехмерного изделия, содержащего функциональный элемент, и устройство для его осуществления |
| DE102017202000A1 (de) * | 2017-02-08 | 2018-08-09 | Technische Universität Dresden | Verfahren und Vorrichtung zum Einbetten mindestens eines elektronischen Bauelements in einen Träger |
| KR102230528B1 (ko) * | 2017-02-14 | 2021-03-22 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 내장형 감지 디바이스를 갖는 3d 인쇄물 |
| US11691339B2 (en) | 2017-02-15 | 2023-07-04 | Hewlett-Packard Development Company, L.P. | Product framing |
| GB201703137D0 (en) * | 2017-02-27 | 2017-04-12 | Univ Sheffield | Methods and systems for producing three dimensional objects |
| US20180253081A1 (en) * | 2017-03-01 | 2018-09-06 | Wal-Mart Stores, Inc. | Systems, Devices, and Methods for Forming Three-Dimensional Products with Embedded RFID Elements |
| EP3379324A1 (en) * | 2017-03-24 | 2018-09-26 | Luxexcel Holding B.V. | Printed three-dimensional optical component with embedded functional foil and corresponding manufacturing method |
| EP3544788A4 (en) * | 2017-04-18 | 2020-07-22 | Hewlett-Packard Development Company, L.P. | INCREASED ELECTRICAL CONDUCTIVITY AT SELECTED LOCATIONS OF A 3D OBJECT |
| WO2018199943A1 (en) * | 2017-04-26 | 2018-11-01 | Hewlett-Packard Development Company, L.P. | Printing conductive elements |
| CN107081899B (zh) * | 2017-05-10 | 2019-08-13 | 山东大学 | 一种基于3d打印的天线生产方法 |
| WO2019006168A1 (en) * | 2017-06-28 | 2019-01-03 | Evapco, Inc | COLLECTOR FOR HEAT EXCHANGERS MADE BY ADDITIVE MANUFACTURING |
| DE102017211659A1 (de) * | 2017-07-07 | 2019-01-10 | Bayerische Motoren Werke Aktiengesellschaft | Beleuchtungseinheit für ein Fahrzeug und Verfahren zu dessen Herstellung |
| EP3664989B1 (en) * | 2017-08-11 | 2021-05-05 | Signify Holding B.V. | Method for manufacturing a 3d item having an electrically conductive coil |
| DE102017221664A1 (de) * | 2017-12-01 | 2019-06-06 | Volkswagen Aktiengesellschaft | Verfahren und Vorrichtung zur generativen Fertigung eines Werkstücks durch Schmelzschichtung mit struktureller Verstärkung durch Ausspritzen kanalartiger Hohlstrukturen |
| US10595440B2 (en) | 2018-03-02 | 2020-03-17 | Northrop Grumman Systems Corporation | Thermal gasket with high transverse thermal conductivity |
| US11911825B2 (en) | 2018-03-13 | 2024-02-27 | Hewlett-Packard Development Company, L.P. | Fusing electronic components into three-dimensional objects via additive manufacturing processes |
| US11338501B2 (en) * | 2018-04-03 | 2022-05-24 | University Of Massachusetts | Fabrication of circuit elements using additive techniques |
| EP3552806A1 (en) | 2018-04-09 | 2019-10-16 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Method of apparatus for forming an object by means of additive manufacturing |
| EP3562285A1 (de) * | 2018-04-25 | 2019-10-30 | Siemens Aktiengesellschaft | Verbinden elektrischer bauelemente |
| US11498269B2 (en) | 2018-04-30 | 2022-11-15 | Hewlett-Packard Development Company, L.P. | Post-print processing of three dimensional (3D) printed objects |
| WO2019212480A1 (en) | 2018-04-30 | 2019-11-07 | Hewlett-Packard Development Company, L.P. | A 3d printing computer application 3d printing using the same |
| EP3572217A1 (en) | 2018-05-24 | 2019-11-27 | Fundació Institut de Ciències Fotòniques | A method, a system and a package for producing an electrically conductive composite |
| JP6533886B1 (ja) * | 2018-07-11 | 2019-06-19 | 信安 牧 | ３ｄプリンタ用いた部材の製造方法 |
| CN110843206A (zh) * | 2018-07-25 | 2020-02-28 | 中国科学院金属研究所 | 一种三维电子器件的制备方法和应用 |
| EP3599622A1 (en) | 2018-07-27 | 2020-01-29 | Fundació Institut de Ciències Fotòniques | A method, a system and a package for producing a magnetic composite |
| US10894365B2 (en) | 2018-08-22 | 2021-01-19 | Nxp B.V. | Method for embedding an integrated circuit into a 3D-printed object |
| US20210170688A1 (en) * | 2018-08-27 | 2021-06-10 | Hewlett-Packard Development Company, L.P. | Modules of three-dimensional (3d) printers |
| EP3627570A1 (de) * | 2018-09-18 | 2020-03-25 | Heraeus Additive Manufacturing GmbH | Wärmetauscher für halbleiterbauelemente |
| CN109669236A (zh) * | 2018-11-27 | 2019-04-23 | 苏州席正通信科技有限公司 | 一种三维光波导制作方法 |
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| CN113226713B (zh) * | 2019-01-15 | 2023-06-20 | 惠普发展公司，有限责任合伙企业 | 增材制造系统、用于产生三维物体的方法和介质 |
| US11699272B2 (en) | 2019-03-29 | 2023-07-11 | Hewlett-Packard Development Company, L.P. | Generating fluidic components |
| US20220019193A1 (en) * | 2019-04-12 | 2022-01-20 | Hewlett-Packard Development Company, L.P. | Accelerometer-based object pose determination |
| CN112136212B (zh) * | 2019-04-24 | 2022-07-29 | 深圳市汇顶科技股份有限公司 | 芯片互联装置、集成桥结构的基板及其制备方法 |
| US11699942B2 (en) | 2019-05-23 | 2023-07-11 | GM Global Technology Operations LLC | Hybrid additive manufacturing assisted prototyping for making electro-mechanical components |
| WO2020242451A1 (en) * | 2019-05-28 | 2020-12-03 | Hewlett-Packard Development Company, L.P. | Interrupted additive manufacturing |
| US11587839B2 (en) | 2019-06-27 | 2023-02-21 | Analog Devices, Inc. | Device with chemical reaction chamber |
| EP3996898B1 (en) | 2019-07-09 | 2023-09-06 | Signify Holding B.V. | Printing structures with openings in a side surface |
| CN110366306A (zh) * | 2019-07-16 | 2019-10-22 | 湖北理工学院 | 一种导热塑料电路板及其制作方法 |
| CN110625923B (zh) * | 2019-08-26 | 2022-07-12 | 青岛科技大学 | 导电高分子复合材料及其3d打印成型方法 |
| CN110695355B (zh) * | 2019-10-09 | 2021-09-10 | 中国航空工业集团公司洛阳电光设备研究所 | 控制铝合金薄壁件在3d打印过程中发生翘曲变形的工艺方法 |
| US11981087B2 (en) * | 2019-12-10 | 2024-05-14 | Hewlett-Packard Development Company, L.P. | Three-dimensional (3D) printed objects with fracture channels |
| US11465354B2 (en) * | 2020-01-06 | 2022-10-11 | The Boeing Company | Fabrication of additive manufacturing parts |
| DE102020130987A1 (de) | 2020-01-24 | 2021-07-29 | Schaeffler Technologies AG & Co. KG | Verfahren zur Herstellung eines Bauteils eines Elektromotors, Elektromotorbauteil und Elektromotor |
| EP4097385A4 (en) * | 2020-01-28 | 2023-07-05 | RN Technologies, LLC | ADDITIVE FABRICATION OF DEVICE FROM SETS OF VOXEL ELEMENTS WITH DISCRETIZED COMPONENTS |
| US11446864B2 (en) | 2020-03-11 | 2022-09-20 | Palo Alto Research Center Incorporated | Additive manufacturing compositions and methods for the same |
| DE102020113047A1 (de) | 2020-05-14 | 2021-11-18 | Schaeffler Technologies AG & Co. KG | Elektromotorbauteil und Verfahren zur Herstellung eines Elektromotorbauteils eines Axialflussmotors |
| DE102020209968A1 (de) | 2020-08-06 | 2022-02-10 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer elektrischen und einer mechanischen Verbindung |
| US11734895B2 (en) | 2020-12-14 | 2023-08-22 | Toyota Motor North America, Inc. | Systems and methods for enabling precise object interaction within an augmented reality environment |
| DE102021000576A1 (de) | 2021-02-04 | 2022-08-04 | Bundesrepublik Deutschland, vertr. durch das Bundesministerium der Verteidigung, vertr. durch das Bundesamt für Ausrüstung, Informationstechnik und Nutzung der Bundeswehr | Verfahren zur Herstellung eines Bauteils mit elektrisch leitenden Schichten |
| US20240109246A1 (en) * | 2021-02-19 | 2024-04-04 | Hewlett-Packard Development Company, L.P. | Plastically deformable 3d objects with heat channels |
| JP7367746B2 (ja) | 2021-11-12 | 2023-10-24 | Ｊｆｅスチール株式会社 | 遅れ破壊評価用の治具、せん断端面の遅れ破壊評価方法、及び試験片 |
| US20230311406A1 (en) * | 2022-04-01 | 2023-10-05 | Ford Global Technologies, Llc | Additively manufactured object with colored internal channel |
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| US5529471A (en) | 1995-02-03 | 1996-06-25 | University Of Southern California | Additive fabrication apparatus and method |
| JPH11170375A (ja) * | 1997-12-15 | 1999-06-29 | Olympus Optical Co Ltd | 光造形簡易型及びその製作方法 |
| JP2000330468A (ja) | 1999-05-18 | 2000-11-30 | Hitachi Ltd | 模型製作方法および装置 |
| US7229586B2 (en) | 2002-05-07 | 2007-06-12 | Dunlap Earl N | Process for tempering rapid prototype parts |
| US6905645B2 (en) * | 2002-07-03 | 2005-06-14 | Therics, Inc. | Apparatus, systems and methods for use in three-dimensional printing |
| AU2003900180A0 (en) * | 2003-01-16 | 2003-01-30 | Silverbrook Research Pty Ltd | Method and apparatus (dam001) |
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| JP5584019B2 (ja) * | 2010-06-09 | 2014-09-03 | パナソニック株式会社 | 三次元形状造形物の製造方法およびそれから得られる三次元形状造形物 |
| EP2457719A1 (en) | 2010-11-24 | 2012-05-30 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Interconnect structure and method for producing same |
| US20130316040A1 (en) * | 2011-02-18 | 2013-11-28 | Husky Injection Molding Systems Ltd. | Mold-Tool System Includes One-Piece Manifold Assembly having Each Inlet in Fluid Communication with Outlets |
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| US10748867B2 (en) * | 2012-01-04 | 2020-08-18 | Board Of Regents, The University Of Texas System | Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices |
| WO2013163585A1 (en) * | 2012-04-26 | 2013-10-31 | Northeastern University | Device and method to additively fabricate structures containing embedded electronics or sensors |
| WO2013191760A1 (en) | 2012-06-22 | 2013-12-27 | Dow Corning Corporation | Silver-loaded silicone particles and their silver-containing polymer composites |
| CA2915409A1 (en) * | 2013-06-24 | 2014-12-31 | President And Fellows Of Harvard College | Printed three-dimensional (3d) functional part and method of making |
| CN106573412B (zh) * | 2014-07-30 | 2019-11-05 | 松下知识产权经营株式会社 | 三维形状造型物的制造方法及三维形状造型物 |
| JP6435748B2 (ja) * | 2014-09-25 | 2018-12-12 | 日本電気株式会社 | 積層造形部材および積層造形部材の製造方法 |
-
2016
- 2016-03-01 JP JP2017548271A patent/JP6956010B2/ja active Active
- 2016-03-01 CN CN201680016460.0A patent/CN107405826A/zh active Pending
- 2016-03-01 RU RU2017134518A patent/RU2017134518A/ru not_active Application Discontinuation
- 2016-03-01 EP EP16707423.6A patent/EP3271161B1/en active Active
- 2016-03-01 WO PCT/EP2016/054282 patent/WO2016146374A1/en active Application Filing
- 2016-03-01 US US15/557,702 patent/US20180050486A1/en not_active Abandoned
-
2021
- 2021-08-11 JP JP2021131447A patent/JP7117430B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107405826A (zh) | 2017-11-28 |
| JP7117430B2 (ja) | 2022-08-12 |
| JP2021185033A (ja) | 2021-12-09 |
| EP3271161B1 (en) | 2021-11-17 |
| JP6956010B2 (ja) | 2021-10-27 |
| EP3271161A1 (en) | 2018-01-24 |
| WO2016146374A1 (en) | 2016-09-22 |
| JP2018507803A (ja) | 2018-03-22 |
| US20180050486A1 (en) | 2018-02-22 |
| RU2017134518A (ru) | 2019-04-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FA92 | Acknowledgement of application withdrawn (lack of supplementary materials submitted) |
Effective date: 20191028 |