PT2679335T - Liga para soldadura - Google Patents
Liga para soldaduraInfo
- Publication number
- PT2679335T PT2679335T PT128586781T PT12858678T PT2679335T PT 2679335 T PT2679335 T PT 2679335T PT 128586781 T PT128586781 T PT 128586781T PT 12858678 T PT12858678 T PT 12858678T PT 2679335 T PT2679335 T PT 2679335T
- Authority
- PT
- Portugal
- Prior art keywords
- solder alloy
- solder
- alloy
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/059668 WO2013153595A1 (ja) | 2012-04-09 | 2012-04-09 | はんだ合金 |
EP12858678.1A EP2679335B1 (en) | 2012-04-09 | 2012-04-09 | Solder alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
PT2679335T true PT2679335T (pt) | 2017-07-26 |
Family
ID=47693021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PT128586781T PT2679335T (pt) | 2012-04-09 | 2012-04-09 | Liga para soldadura |
Country Status (8)
Country | Link |
---|---|
US (1) | US8932519B2 (pt) |
EP (1) | EP2679335B1 (pt) |
JP (1) | JP5131412B1 (pt) |
KR (2) | KR20130124516A (pt) |
CN (1) | CN103476540B (pt) |
PT (1) | PT2679335T (pt) |
TW (1) | TWI441704B (pt) |
WO (1) | WO2013153595A1 (pt) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104625464A (zh) * | 2014-12-23 | 2015-05-20 | 苏州龙腾万里化工科技有限公司 | 一种新型无铅锡棒 |
CN109175573A (zh) * | 2018-09-12 | 2019-01-11 | 南昌大学 | 一种Cu-Ni合金化基板与无铅钎料的焊点及其制备方法 |
CN109175572A (zh) * | 2018-09-12 | 2019-01-11 | 南昌大学 | 一种双相基板与无铅钎料的焊点及其制备工艺 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6231691B1 (en) | 1997-02-10 | 2001-05-15 | Iowa State University Research Foundation, Inc. | Lead-free solder |
JP3544904B2 (ja) | 1999-09-29 | 2004-07-21 | 株式会社トッパンNecサーキットソリューションズ | はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法 |
JP4152596B2 (ja) | 2001-02-09 | 2008-09-17 | 新日鉄マテリアルズ株式会社 | ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
US20030021718A1 (en) * | 2001-06-28 | 2003-01-30 | Osamu Munekata | Lead-free solder alloy |
JP2004154845A (ja) | 2002-11-08 | 2004-06-03 | Hitachi Ltd | 電子装置接続用はんだとはんだボール及びそれを用いた電子装置 |
JP2005040847A (ja) | 2003-07-25 | 2005-02-17 | Hitachi Metals Ltd | はんだボールの製造方法 |
US20050100474A1 (en) * | 2003-11-06 | 2005-05-12 | Benlih Huang | Anti-tombstoning lead free alloys for surface mount reflow soldering |
KR100999331B1 (ko) * | 2005-06-03 | 2010-12-08 | 센주긴조쿠고교 가부시키가이샤 | 납프리 땜납 합금 |
JP2009506203A (ja) * | 2005-08-24 | 2009-02-12 | フライズ メタルズ インコーポレイテッド | 半田合金 |
JP5019764B2 (ja) * | 2006-03-09 | 2012-09-05 | 新日鉄マテリアルズ株式会社 | 鉛フリーハンダ合金、ハンダボール及び電子部材 |
US8562906B2 (en) * | 2006-03-09 | 2013-10-22 | Nippon Steel & Sumikin Materials Co., Ltd. | Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member |
JP2007237251A (ja) * | 2006-03-09 | 2007-09-20 | Nippon Steel Materials Co Ltd | 鉛フリーハンダ合金、ハンダボール及び電子部材 |
JP5142999B2 (ja) * | 2006-07-05 | 2013-02-13 | 富士電機株式会社 | クリームはんだ及び電子部品のはんだ付け方法 |
CN102029479A (zh) * | 2010-12-29 | 2011-04-27 | 广州有色金属研究院 | 一种低银无铅焊料合金及其制备方法和装置 |
TWI464031B (zh) * | 2011-12-14 | 2014-12-11 | Univ Yuan Ze | 抑制柯肯達爾孔洞形成於銲料與銅銲墊之間的方法 |
-
2012
- 2012-04-09 EP EP12858678.1A patent/EP2679335B1/en active Active
- 2012-04-09 KR KR1020137016630A patent/KR20130124516A/ko active Application Filing
- 2012-04-09 JP JP2012533171A patent/JP5131412B1/ja active Active
- 2012-04-09 KR KR1020147028285A patent/KR101590289B1/ko active IP Right Grant
- 2012-04-09 US US13/261,681 patent/US8932519B2/en active Active
- 2012-04-09 WO PCT/JP2012/059668 patent/WO2013153595A1/ja active Application Filing
- 2012-04-09 CN CN201280004441.8A patent/CN103476540B/zh active Active
- 2012-04-09 PT PT128586781T patent/PT2679335T/pt unknown
-
2013
- 2013-02-06 TW TW102104555A patent/TWI441704B/zh active
Also Published As
Publication number | Publication date |
---|---|
US8932519B2 (en) | 2015-01-13 |
TWI441704B (zh) | 2014-06-21 |
EP2679335A1 (en) | 2014-01-01 |
EP2679335A4 (en) | 2014-12-03 |
KR101590289B1 (ko) | 2016-02-01 |
WO2013153595A1 (ja) | 2013-10-17 |
CN103476540A (zh) | 2013-12-25 |
US20130343809A1 (en) | 2013-12-26 |
KR20130124516A (ko) | 2013-11-14 |
JPWO2013153595A1 (ja) | 2015-12-17 |
JP5131412B1 (ja) | 2013-01-30 |
EP2679335B1 (en) | 2017-06-14 |
CN103476540B (zh) | 2015-11-25 |
KR20140130750A (ko) | 2014-11-11 |
TW201350250A (zh) | 2013-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB201502723D0 (en) | Solder alloy | |
EP2860272A4 (en) | ALLOY ON NICKEL BASE | |
EP2883649A4 (en) | LEAD FREE HIGH TEMPERATURE SOLDERING | |
HK1210504A1 (en) | Discoloration-resistant gold alloy | |
HRP20182112T1 (hr) | Legura za lemljenje bez olova | |
EP2689885A4 (en) | LEAD FREE BRAZING ALLOY | |
IL227758A0 (en) | Copper-nickel-zinc-manganese alloy | |
EP2814995A4 (en) | TITANIUM ALLOYS | |
HK1204779A1 (en) | Lead-free solder ball | |
EP2937432A4 (en) | LEAD FREE WELDING ALLOY | |
PL2945772T3 (pl) | Stopy lutownicze | |
EP2719497A4 (en) | Solder Paste | |
SG11201505623XA (en) | Pb-FREE SOLDER ALLOY | |
EP2825002A4 (en) | METALLIC SHEET FIXED TO A SUPPORT | |
PL3031566T3 (pl) | Bezołowiowy stop lutowniczy | |
SG2013044755A (en) | Silver-gold-palladium alloy bumping wire | |
EP2883971A4 (en) | COPPER ALLOY AS FASTENER | |
EP2698225A4 (en) | LEAD-FREE MEASUREMENT ALLOY | |
EP2940175A4 (en) | SHOCK ALLOY | |
GB201312000D0 (en) | Alloy | |
EP2695701A4 (en) | solder alloy | |
EP2716401A4 (en) | LEAD-FREE SOLDER ALLOY WITH HIGH TEMPERATURE | |
EP2803741A4 (en) | ALLOY STEEL | |
PL2617858T3 (pl) | Stop austenityczny | |
SG11201600900SA (en) | Lead-free solder alloy |