PT2625711E - Processo de fabrico de um circuito - Google Patents

Processo de fabrico de um circuito Download PDF

Info

Publication number
PT2625711E
PT2625711E PT117798025T PT11779802T PT2625711E PT 2625711 E PT2625711 E PT 2625711E PT 117798025 T PT117798025 T PT 117798025T PT 11779802 T PT11779802 T PT 11779802T PT 2625711 E PT2625711 E PT 2625711E
Authority
PT
Portugal
Prior art keywords
manufacturing
circuit
Prior art date
Application number
PT117798025T
Other languages
English (en)
Inventor
Thierry Parra
Ayad Ghannam
David Bourrier
Monique Dilhan
Christophe Viallon
Original Assignee
Centre Nat Rech Scient
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre Nat Rech Scient filed Critical Centre Nat Rech Scient
Publication of PT2625711E publication Critical patent/PT2625711E/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H01L21/76846—Layer combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76885—By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H01L23/53238—Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • H01L23/53295—Stacked insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
    • H01L21/76873—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroplating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/2401—Structure
    • H01L2224/24011—Deposited, e.g. MCM-D type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24226—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
PT117798025T 2010-10-05 2011-10-05 Processo de fabrico de um circuito PT2625711E (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1058076A FR2965659B1 (fr) 2010-10-05 2010-10-05 Procédé de fabrication d'un circuit intégré

Publications (1)

Publication Number Publication Date
PT2625711E true PT2625711E (pt) 2015-07-31

Family

ID=44063306

Family Applications (1)

Application Number Title Priority Date Filing Date
PT117798025T PT2625711E (pt) 2010-10-05 2011-10-05 Processo de fabrico de um circuito

Country Status (6)

Country Link
US (1) US20130192065A1 (pt)
EP (1) EP2625711B1 (pt)
JP (1) JP5982381B2 (pt)
FR (1) FR2965659B1 (pt)
PT (1) PT2625711E (pt)
WO (1) WO2012045981A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3041147B1 (fr) 2015-09-14 2018-02-02 3Dis Tech Procede d'integration d'au moins une interconnexion 3d pour la fabrication de circuit integre
FR3057993B1 (fr) 2016-10-25 2019-04-19 3Dis Technologies Systeme electronique comportant une puce electronique formant boitier et procede de fabrication
FR3070091B1 (fr) 2017-08-08 2020-02-07 3Dis Technologies Systeme electronique comprenant une couche de redistribution inferieure et procede de fabrication d'un tel systeme electronique
FR3070090B1 (fr) 2017-08-08 2020-02-07 3Dis Technologies Systeme electronique et procede de fabrication d'un systeme electronique par utilisation d'un element sacrificiel

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02257643A (ja) * 1989-03-29 1990-10-18 Mitsubishi Electric Corp 半導体装置及びその製造方法
JPH08172161A (ja) * 1994-12-16 1996-07-02 Hitachi Ltd インダクタ素子とその製法およびそれを用いたモノリシックマイクロ波集積回路素子
US6197181B1 (en) * 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
US7405149B1 (en) * 1998-12-21 2008-07-29 Megica Corporation Post passivation method for semiconductor chip or wafer
US7416971B2 (en) * 2004-09-23 2008-08-26 Megica Corporation Top layers of metal for integrated circuits
JP2000216184A (ja) * 1999-01-25 2000-08-04 Sanyo Electric Co Ltd 半導体装置およびその製造方法
JP3820329B2 (ja) * 1999-09-14 2006-09-13 株式会社ルネサステクノロジ 半導体基板のめっき方法
JP4083968B2 (ja) * 2000-11-02 2008-04-30 株式会社東芝 半導体装置の製造方法
JP2004281538A (ja) * 2003-03-13 2004-10-07 Seiko Epson Corp 電子装置及びその製造方法、回路基板並びに電子機器
EP1598449B1 (en) * 2004-04-26 2010-08-04 Rohm and Haas Electronic Materials, L.L.C. Improved plating method
JP4717411B2 (ja) * 2004-10-18 2011-07-06 株式会社フジクラ 半導体装置
US7425499B2 (en) * 2004-08-24 2008-09-16 Micron Technology, Inc. Methods for forming interconnects in vias and microelectronic workpieces including such interconnects
JP2006228927A (ja) * 2005-02-17 2006-08-31 Fujikura Ltd 半導体装置
US20060225605A1 (en) * 2005-04-11 2006-10-12 Kloeckener James R Aqueous coating compositions and process for treating metal plated substrates
US7468545B2 (en) * 2005-05-06 2008-12-23 Megica Corporation Post passivation structure for a semiconductor device and packaging process for same
JP2007059878A (ja) * 2005-07-27 2007-03-08 Seiko Epson Corp 半導体装置、及び発振器
US7262134B2 (en) * 2005-09-01 2007-08-28 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7629249B2 (en) * 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
US7582966B2 (en) * 2006-09-06 2009-09-01 Megica Corporation Semiconductor chip and method for fabricating the same
KR100800161B1 (ko) * 2006-09-30 2008-02-01 주식회사 하이닉스반도체 관통 실리콘 비아 형성방법
JP2009032929A (ja) * 2007-07-27 2009-02-12 Sanyo Electric Co Ltd 半導体装置及びその製造方法
TWI368286B (en) * 2007-08-27 2012-07-11 Megica Corp Chip assembly
US9059083B2 (en) * 2007-09-14 2015-06-16 Infineon Technologies Ag Semiconductor device
JP5868574B2 (ja) * 2010-03-15 2016-02-24 富士通株式会社 半導体装置及びその製造方法

Also Published As

Publication number Publication date
FR2965659A1 (fr) 2012-04-06
FR2965659B1 (fr) 2013-11-29
US20130192065A1 (en) 2013-08-01
JP2013543661A (ja) 2013-12-05
WO2012045981A1 (fr) 2012-04-12
EP2625711A1 (fr) 2013-08-14
JP5982381B2 (ja) 2016-08-31
EP2625711B1 (fr) 2015-03-25

Similar Documents

Publication Publication Date Title
HK1181030A1 (zh) 透光性硬質基板層叠體的製造方法
ZA201304601B (en) Method for manufacturing a package
EP2544515A4 (en) METHOD FOR PRODUCING A METAL-COATED SUBSTRATE
EP2552873A4 (en) PREPARATION FOR HEXAFLUOR-2-BUTEN
EP2600390A4 (en) CHIP-MAKING PROCESS
EP2595180A4 (en) ETCHING METHOD
GB201010439D0 (en) A method
IL223583A (en) A method for the production of quinoline-3-carboxamides
EP2546286A4 (en) METHOD FOR MANUFACTURING WATER ABSORBING RESIN
EP2600397A4 (en) METHOD FOR PRODUCING INTERCONNECTION
PL2652812T3 (pl) Sposób wytwarzania urządzenia oled
TWI563144B (en) Method for manufacturing functional sheet
GB2485831B (en) A method of manufacturing a component
PL2530164T3 (pl) Sposób wytwarzania pirypiropenu
EP2537654A4 (en) METHOD FOR THE PRODUCTION OF A WAVELY STRUCTURED OBJECT
EP2475517A4 (en) METHOD FOR PRODUCING A BOARD
EP2543502A4 (en) METHOD FOR PRODUCING TABLETS
EP2754508A4 (en) METHOD FOR PRODUCING A SEAMLESS METAL TUBE
EP2540714A4 (en) PROCESS FOR PREPARING AN EPISULPHIDE COMPOUND
EP2546191A4 (en) METHOD FOR PRODUCING A METAL NANOBAND
GB0921896D0 (en) A method of manufacturing a component
PL2476684T3 (pl) Sposób wytwarzania alkilofosforanów
EP2542031A4 (en) METHOD OF MANUFACTURING LIGHT-EMITTING DEVICES
EP2576240A4 (en) METHOD FOR MANUFACTURING SURFACE ELEMENT
EP2581191A4 (en) CHIP PROCESS