PT1253216E - Metodo e aparelhagem para tratamento sequencial por plasma - Google Patents

Metodo e aparelhagem para tratamento sequencial por plasma

Info

Publication number
PT1253216E
PT1253216E PT01401101T PT01401101T PT1253216E PT 1253216 E PT1253216 E PT 1253216E PT 01401101 T PT01401101 T PT 01401101T PT 01401101 T PT01401101 T PT 01401101T PT 1253216 E PT1253216 E PT 1253216E
Authority
PT
Portugal
Prior art keywords
ionisation energy
substrate
energy sources
sequential treatment
plasma
Prior art date
Application number
PT01401101T
Other languages
English (en)
Inventor
Francois Rossi
Pascal Colpo
Original Assignee
Europ Economic Community
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Europ Economic Community filed Critical Europ Economic Community
Publication of PT1253216E publication Critical patent/PT1253216E/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32394—Treating interior parts of workpieces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/515—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using pulsed discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
PT01401101T 2001-04-27 2001-04-27 Metodo e aparelhagem para tratamento sequencial por plasma PT1253216E (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01401101A EP1253216B1 (en) 2001-04-27 2001-04-27 Method and apparatus for sequential plasma treatment

Publications (1)

Publication Number Publication Date
PT1253216E true PT1253216E (pt) 2004-04-30

Family

ID=8182707

Family Applications (1)

Application Number Title Priority Date Filing Date
PT01401101T PT1253216E (pt) 2001-04-27 2001-04-27 Metodo e aparelhagem para tratamento sequencial por plasma

Country Status (13)

Country Link
US (1) US7618686B2 (pt)
EP (1) EP1253216B1 (pt)
JP (1) JP2004533316A (pt)
KR (1) KR20040007516A (pt)
AT (1) ATE254192T1 (pt)
CA (1) CA2444766C (pt)
DE (1) DE60101209T2 (pt)
DK (1) DK1253216T3 (pt)
ES (1) ES2208530T3 (pt)
NO (1) NO20034750L (pt)
PT (1) PT1253216E (pt)
TW (1) TW593464B (pt)
WO (1) WO2002088420A1 (pt)

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KR101592241B1 (ko) 2013-04-15 2016-02-05 (주)플렉센스 나노 입자 어레이의 제조 방법, 표면 플라즈몬 공명 기반의 센서, 및 이를 이용한 분석 방법
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US10555412B2 (en) 2018-05-10 2020-02-04 Applied Materials, Inc. Method of controlling ion energy distribution using a pulse generator with a current-return output stage
US11476145B2 (en) 2018-11-20 2022-10-18 Applied Materials, Inc. Automatic ESC bias compensation when using pulsed DC bias
JP7451540B2 (ja) 2019-01-22 2024-03-18 アプライド マテリアルズ インコーポレイテッド パルス状電圧波形を制御するためのフィードバックループ
US11508554B2 (en) 2019-01-24 2022-11-22 Applied Materials, Inc. High voltage filter assembly
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Also Published As

Publication number Publication date
EP1253216B1 (en) 2003-11-12
TW593464B (en) 2004-06-21
NO20034750D0 (no) 2003-10-23
DE60101209D1 (de) 2003-12-18
NO20034750L (no) 2003-12-22
US7618686B2 (en) 2009-11-17
KR20040007516A (ko) 2004-01-24
DE60101209T2 (de) 2004-09-02
JP2004533316A (ja) 2004-11-04
US20040154541A1 (en) 2004-08-12
CA2444766A1 (en) 2002-11-07
WO2002088420A1 (en) 2002-11-07
ES2208530T3 (es) 2004-06-16
EP1253216A1 (en) 2002-10-30
CA2444766C (en) 2009-07-14
DK1253216T3 (da) 2004-03-22
ATE254192T1 (de) 2003-11-15

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