PT1253216E - Metodo e aparelhagem para tratamento sequencial por plasma - Google Patents
Metodo e aparelhagem para tratamento sequencial por plasmaInfo
- Publication number
- PT1253216E PT1253216E PT01401101T PT01401101T PT1253216E PT 1253216 E PT1253216 E PT 1253216E PT 01401101 T PT01401101 T PT 01401101T PT 01401101 T PT01401101 T PT 01401101T PT 1253216 E PT1253216 E PT 1253216E
- Authority
- PT
- Portugal
- Prior art keywords
- ionisation energy
- substrate
- energy sources
- sequential treatment
- plasma
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32394—Treating interior parts of workpieces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/515—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using pulsed discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Radiation-Therapy Devices (AREA)
- Drying Of Semiconductors (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01401101A EP1253216B1 (en) | 2001-04-27 | 2001-04-27 | Method and apparatus for sequential plasma treatment |
Publications (1)
Publication Number | Publication Date |
---|---|
PT1253216E true PT1253216E (pt) | 2004-04-30 |
Family
ID=8182707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PT01401101T PT1253216E (pt) | 2001-04-27 | 2001-04-27 | Metodo e aparelhagem para tratamento sequencial por plasma |
Country Status (13)
Country | Link |
---|---|
US (1) | US7618686B2 (pt) |
EP (1) | EP1253216B1 (pt) |
JP (1) | JP2004533316A (pt) |
KR (1) | KR20040007516A (pt) |
AT (1) | ATE254192T1 (pt) |
CA (1) | CA2444766C (pt) |
DE (1) | DE60101209T2 (pt) |
DK (1) | DK1253216T3 (pt) |
ES (1) | ES2208530T3 (pt) |
NO (1) | NO20034750L (pt) |
PT (1) | PT1253216E (pt) |
TW (1) | TW593464B (pt) |
WO (1) | WO2002088420A1 (pt) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10358505B4 (de) * | 2003-12-13 | 2007-10-11 | Roth & Rau Ag | Plasmaquelle zur Erzeugung eines induktiv gekoppelten Plasmas |
EP1662546A1 (en) | 2004-11-25 | 2006-05-31 | The European Community, represented by the European Commission | Inductively coupled plasma processing apparatus |
JP4682946B2 (ja) * | 2006-07-25 | 2011-05-11 | パナソニック株式会社 | プラズマ処理方法及び装置 |
JP4682917B2 (ja) * | 2006-05-30 | 2011-05-11 | パナソニック株式会社 | 大気圧プラズマ発生方法及び装置 |
TW200816880A (en) * | 2006-05-30 | 2008-04-01 | Matsushita Electric Ind Co Ltd | Atmospheric pressure plasma generating method, plasma processing method and component mounting method using same, and device using these methods |
DE102007035403A1 (de) * | 2007-07-26 | 2009-01-29 | Linde Ag | Verfahren zum thermischen Trennen |
RU2523773C2 (ru) | 2009-05-13 | 2014-07-20 | СиО2 Медикал Продактс, Инк., | Способ по выделению газа для инспектирования поверхности с покрытием |
WO2013170052A1 (en) | 2012-05-09 | 2013-11-14 | Sio2 Medical Products, Inc. | Saccharide protective coating for pharmaceutical package |
US9458536B2 (en) | 2009-07-02 | 2016-10-04 | Sio2 Medical Products, Inc. | PECVD coating methods for capped syringes, cartridges and other articles |
US11624115B2 (en) | 2010-05-12 | 2023-04-11 | Sio2 Medical Products, Inc. | Syringe with PECVD lubrication |
JP5429124B2 (ja) * | 2010-09-29 | 2014-02-26 | パナソニック株式会社 | プラズマ処理方法及び装置 |
US9878101B2 (en) | 2010-11-12 | 2018-01-30 | Sio2 Medical Products, Inc. | Cyclic olefin polymer vessels and vessel coating methods |
US9272095B2 (en) | 2011-04-01 | 2016-03-01 | Sio2 Medical Products, Inc. | Vessels, contact surfaces, and coating and inspection apparatus and methods |
JP6095678B2 (ja) | 2011-11-11 | 2017-03-15 | エスアイオーツー・メディカル・プロダクツ・インコーポレイテッド | 薬剤パッケージ用の不動態化、pH保護又は滑性皮膜、被覆プロセス及び装置 |
US11116695B2 (en) | 2011-11-11 | 2021-09-14 | Sio2 Medical Products, Inc. | Blood sample collection tube |
US9554968B2 (en) | 2013-03-11 | 2017-01-31 | Sio2 Medical Products, Inc. | Trilayer coated pharmaceutical packaging |
DE102012109251A1 (de) * | 2012-09-28 | 2014-04-03 | Osram Gmbh | Vorrichtung und Verfahren zur Beschichtung von Substraten |
JP6509734B2 (ja) | 2012-11-01 | 2019-05-08 | エスアイオーツー・メディカル・プロダクツ・インコーポレイテッド | 皮膜検査方法 |
JP6093552B2 (ja) * | 2012-11-08 | 2017-03-08 | 日精エー・エス・ビー機械株式会社 | 樹脂容器用コーティング装置 |
WO2014078666A1 (en) | 2012-11-16 | 2014-05-22 | Sio2 Medical Products, Inc. | Method and apparatus for detecting rapid barrier coating integrity characteristics |
US9764093B2 (en) | 2012-11-30 | 2017-09-19 | Sio2 Medical Products, Inc. | Controlling the uniformity of PECVD deposition |
WO2014085348A2 (en) | 2012-11-30 | 2014-06-05 | Sio2 Medical Products, Inc. | Controlling the uniformity of pecvd deposition on medical syringes, cartridges, and the like |
CN103037609B (zh) * | 2013-01-10 | 2014-12-31 | 哈尔滨工业大学 | 射流等离子体电子能量调节器 |
CN103060778B (zh) * | 2013-01-23 | 2015-03-11 | 深圳市劲拓自动化设备股份有限公司 | 平板式pecvd装置 |
EP2961858B1 (en) | 2013-03-01 | 2022-09-07 | Si02 Medical Products, Inc. | Coated syringe. |
US10060851B2 (en) | 2013-03-05 | 2018-08-28 | Plexense, Inc. | Surface plasmon detection apparatuses and methods |
US9937099B2 (en) | 2013-03-11 | 2018-04-10 | Sio2 Medical Products, Inc. | Trilayer coated pharmaceutical packaging with low oxygen transmission rate |
US20160017490A1 (en) | 2013-03-15 | 2016-01-21 | Sio2 Medical Products, Inc. | Coating method |
KR101592241B1 (ko) | 2013-04-15 | 2016-02-05 | (주)플렉센스 | 나노 입자 어레이의 제조 방법, 표면 플라즈몬 공명 기반의 센서, 및 이를 이용한 분석 방법 |
WO2015148471A1 (en) | 2014-03-28 | 2015-10-01 | Sio2 Medical Products, Inc. | Antistatic coatings for plastic vessels |
EP3233303A4 (en) * | 2014-12-15 | 2018-08-22 | Plexense, Inc. | Surface plasmon detection apparatuses and methods |
US11077233B2 (en) | 2015-08-18 | 2021-08-03 | Sio2 Medical Products, Inc. | Pharmaceutical and other packaging with low oxygen transmission rate |
US20170316921A1 (en) * | 2016-04-29 | 2017-11-02 | Retro-Semi Technologies, Llc | Vhf z-coil plasma source |
US10510575B2 (en) * | 2017-09-20 | 2019-12-17 | Applied Materials, Inc. | Substrate support with multiple embedded electrodes |
US10555412B2 (en) | 2018-05-10 | 2020-02-04 | Applied Materials, Inc. | Method of controlling ion energy distribution using a pulse generator with a current-return output stage |
US11476145B2 (en) | 2018-11-20 | 2022-10-18 | Applied Materials, Inc. | Automatic ESC bias compensation when using pulsed DC bias |
KR20210107716A (ko) | 2019-01-22 | 2021-09-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 펄스 전압 파형을 제어하기 위한 피드백 루프 |
US11508554B2 (en) | 2019-01-24 | 2022-11-22 | Applied Materials, Inc. | High voltage filter assembly |
US11462389B2 (en) | 2020-07-31 | 2022-10-04 | Applied Materials, Inc. | Pulsed-voltage hardware assembly for use in a plasma processing system |
US11901157B2 (en) | 2020-11-16 | 2024-02-13 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
US11798790B2 (en) | 2020-11-16 | 2023-10-24 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
US11495470B1 (en) | 2021-04-16 | 2022-11-08 | Applied Materials, Inc. | Method of enhancing etching selectivity using a pulsed plasma |
US11948780B2 (en) | 2021-05-12 | 2024-04-02 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11791138B2 (en) | 2021-05-12 | 2023-10-17 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11967483B2 (en) | 2021-06-02 | 2024-04-23 | Applied Materials, Inc. | Plasma excitation with ion energy control |
US20220399185A1 (en) | 2021-06-09 | 2022-12-15 | Applied Materials, Inc. | Plasma chamber and chamber component cleaning methods |
US11810760B2 (en) | 2021-06-16 | 2023-11-07 | Applied Materials, Inc. | Apparatus and method of ion current compensation |
US11569066B2 (en) | 2021-06-23 | 2023-01-31 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
US11776788B2 (en) | 2021-06-28 | 2023-10-03 | Applied Materials, Inc. | Pulsed voltage boost for substrate processing |
US11476090B1 (en) | 2021-08-24 | 2022-10-18 | Applied Materials, Inc. | Voltage pulse time-domain multiplexing |
US11694876B2 (en) | 2021-12-08 | 2023-07-04 | Applied Materials, Inc. | Apparatus and method for delivering a plurality of waveform signals during plasma processing |
US11972924B2 (en) | 2022-06-08 | 2024-04-30 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1603949A (en) * | 1978-05-30 | 1981-12-02 | Standard Telephones Cables Ltd | Plasma deposit |
US4692347A (en) * | 1983-07-07 | 1987-09-08 | The Curators Of The University Of Missouri | Method of interiorly coating tubing |
DE3574997D1 (de) * | 1984-03-03 | 1990-02-01 | Stc Plc | Pulsierendes plasmaverfahren. |
US4879140A (en) * | 1988-11-21 | 1989-11-07 | Deposition Sciences, Inc. | Method for making pigment flakes |
FR2661762B1 (fr) * | 1990-05-03 | 1992-07-31 | Storck Jean | Procede et dispositif de transaction entre un premier et au moins un deuxieme supports de donnees et support a cette fin. |
DE4034211C1 (en) * | 1990-10-27 | 1991-11-14 | Schott Glaswerke, 6500 Mainz, De | Coating interior of pipe-glass tube - comprises coupling HF energy to tube using resonator to deliver pulsed microwave discharges |
AU5914994A (en) * | 1993-04-21 | 1994-10-27 | Bend Research, Inc. | Plasma polymerization and surface modification inside hollow micro-substrates |
US6022602A (en) * | 1994-01-26 | 2000-02-08 | Neomecs Incorporated | Plasma modification of lumen surface of tubing |
US5593550A (en) * | 1994-05-06 | 1997-01-14 | Medtronic, Inc. | Plasma process for reducing friction within the lumen of polymeric tubing |
US5521351A (en) * | 1994-08-30 | 1996-05-28 | Wisconsin Alumni Research Foundation | Method and apparatus for plasma surface treatment of the interior of hollow forms |
DE4437050A1 (de) * | 1994-10-17 | 1996-04-18 | Leybold Ag | Vorrichtung zum Behandeln von Oberflächen von Hohlkörpern, insbesondere von Innenflächen von Kraftstofftanks |
US5653811A (en) * | 1995-07-19 | 1997-08-05 | Chan; Chung | System for the plasma treatment of large area substrates |
US5907221A (en) * | 1995-08-16 | 1999-05-25 | Applied Materials, Inc. | Inductively coupled plasma reactor with an inductive coil antenna having independent loops |
DE19634795C2 (de) * | 1996-08-29 | 1999-11-04 | Schott Glas | Plasma-CVD-Anlage mit einem Array von Mikrowellen-Plasmaelektroden und Plasma-CVD-Verfahren |
DE19643865C2 (de) * | 1996-10-30 | 1999-04-08 | Schott Glas | Plasmaunterstütztes chemisches Abscheidungsverfahren (CVD) mit entfernter Anregung eines Anregungsgases (Remote-Plasma-CVD-Verfahren) zur Beschichtung oder zur Behandlung großflächiger Substrate und Vorrichtung zur Durchführung desselben |
WO1998037259A1 (fr) * | 1997-02-19 | 1998-08-27 | Kirin Beer Kabushiki Kaisha | Procede et appareil pour produire un recipient plastique presentant un pelliculage en carbone |
JP3072269B2 (ja) * | 1997-02-19 | 2000-07-31 | 麒麟麦酒株式会社 | 炭素膜コーティングプラスチック容器の製造装置および製造方法 |
US6051073A (en) * | 1998-02-11 | 2000-04-18 | Silicon Genesis Corporation | Perforated shield for plasma immersion ion implantation |
JP3698887B2 (ja) * | 1998-03-16 | 2005-09-21 | 株式会社アルバック | ダイヤモンド状炭素膜の製造装置 |
DK1089319T3 (da) * | 1999-09-29 | 2009-04-06 | Europ Economic Community | Ensartet gasfordeling i plasmaforarbejdningsindretning med stort areal |
EP1126504A1 (en) * | 2000-02-18 | 2001-08-22 | European Community | Method and apparatus for inductively coupled plasma treatment |
-
2001
- 2001-04-27 EP EP01401101A patent/EP1253216B1/en not_active Expired - Lifetime
- 2001-04-27 ES ES01401101T patent/ES2208530T3/es not_active Expired - Lifetime
- 2001-04-27 DE DE60101209T patent/DE60101209T2/de not_active Expired - Lifetime
- 2001-04-27 PT PT01401101T patent/PT1253216E/pt unknown
- 2001-04-27 DK DK01401101T patent/DK1253216T3/da active
- 2001-04-27 AT AT01401101T patent/ATE254192T1/de active
-
2002
- 2002-04-01 TW TW091106499A patent/TW593464B/zh not_active IP Right Cessation
- 2002-04-24 US US10/475,512 patent/US7618686B2/en not_active Expired - Fee Related
- 2002-04-24 KR KR10-2003-7014098A patent/KR20040007516A/ko not_active Application Discontinuation
- 2002-04-24 JP JP2002585697A patent/JP2004533316A/ja active Pending
- 2002-04-24 CA CA002444766A patent/CA2444766C/en not_active Expired - Fee Related
- 2002-04-24 WO PCT/EP2002/004583 patent/WO2002088420A1/en active Application Filing
-
2003
- 2003-10-23 NO NO20034750A patent/NO20034750L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP1253216A1 (en) | 2002-10-30 |
ATE254192T1 (de) | 2003-11-15 |
NO20034750L (no) | 2003-12-22 |
EP1253216B1 (en) | 2003-11-12 |
WO2002088420A1 (en) | 2002-11-07 |
DK1253216T3 (da) | 2004-03-22 |
US7618686B2 (en) | 2009-11-17 |
ES2208530T3 (es) | 2004-06-16 |
TW593464B (en) | 2004-06-21 |
CA2444766A1 (en) | 2002-11-07 |
JP2004533316A (ja) | 2004-11-04 |
NO20034750D0 (no) | 2003-10-23 |
DE60101209T2 (de) | 2004-09-02 |
US20040154541A1 (en) | 2004-08-12 |
CA2444766C (en) | 2009-07-14 |
KR20040007516A (ko) | 2004-01-24 |
DE60101209D1 (de) | 2003-12-18 |
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