PL382903A1 - Urządzenie do obróbki płaskich, kruchych podłoży - Google Patents

Urządzenie do obróbki płaskich, kruchych podłoży

Info

Publication number
PL382903A1
PL382903A1 PL382903A PL38290307A PL382903A1 PL 382903 A1 PL382903 A1 PL 382903A1 PL 382903 A PL382903 A PL 382903A PL 38290307 A PL38290307 A PL 38290307A PL 382903 A1 PL382903 A1 PL 382903A1
Authority
PL
Poland
Prior art keywords
breakeable
flat
processing unit
bases processing
bases
Prior art date
Application number
PL382903A
Other languages
English (en)
Inventor
Thomas Kosikowski
Original Assignee
Hollmuller Maschinenbau Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hollmuller Maschinenbau Gmbh filed Critical Hollmuller Maschinenbau Gmbh
Publication of PL382903A1 publication Critical patent/PL382903A1/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroplating Methods And Accessories (AREA)
PL382903A 2006-07-19 2007-07-11 Urządzenie do obróbki płaskich, kruchych podłoży PL382903A1 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006033354A DE102006033354B4 (de) 2006-07-19 2006-07-19 Vorrichtung zum Behandeln von flachen, zerbrechlichen Substraten

Publications (1)

Publication Number Publication Date
PL382903A1 true PL382903A1 (pl) 2008-01-21

Family

ID=38859143

Family Applications (1)

Application Number Title Priority Date Filing Date
PL382903A PL382903A1 (pl) 2006-07-19 2007-07-11 Urządzenie do obróbki płaskich, kruchych podłoży

Country Status (5)

Country Link
JP (1) JP5080157B2 (pl)
CN (1) CN101110350B (pl)
DE (1) DE102006033354B4 (pl)
PL (1) PL382903A1 (pl)
TW (1) TW200812888A (pl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006049488A1 (de) * 2006-10-17 2008-04-30 Höllmüller Maschinenbau GmbH Vorrichtung zum Behandeln von flachen, zerbrechlichen Substraten
JP5652700B2 (ja) * 2010-02-09 2015-01-14 富士電機株式会社 可撓性基板の位置制御装置
CN103985630A (zh) * 2014-06-03 2014-08-13 天津源天晟科技发展有限公司 液体内吸附传输方法
DE102017215605A1 (de) * 2017-09-05 2019-03-07 Thyssenkrupp Ag Transportvorrichtung und Verfahren zur deren Betrieb
JP7198039B2 (ja) * 2018-10-22 2022-12-28 株式会社Ｓｃｒｅｅｎフェバックス 基板搬送装置およびこの基板搬送装置を備えた基板処理装置
CN113044576B (zh) * 2021-06-02 2021-08-13 江苏维宏智能科技有限公司 一种玻璃输送装置及输送方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5881997A (ja) * 1981-11-07 1983-05-17 Hideo Tsubaki 水平搬送式自動メツキ装置
JPS62108563A (ja) * 1985-11-06 1987-05-19 Mitsubishi Electric Corp めつき処理装置
DE3639594C1 (en) * 1986-11-20 1987-12-03 Siemens Ag Brush machine
DE3737855A1 (de) * 1987-11-05 1989-05-18 Siemens Ag Vorrichtung zum transport flaechenhafter gegenstaende
DE4121079A1 (de) * 1991-06-26 1993-01-07 Schmid Gmbh & Co Geb Vorrichtung zum behandeln von plattenfoermigen gegenstaenden
US5209464A (en) * 1992-03-23 1993-05-11 Eastman Kodak Company Bottom scuff sheet feeder
JP2000355413A (ja) * 1999-06-17 2000-12-26 Tokai Rubber Ind Ltd 急傾斜ベルトコンベヤ装置（包込型）
JP3960087B2 (ja) * 2001-05-30 2007-08-15 東京エレクトロン株式会社 搬送装置
EP1354830B1 (de) * 2002-04-15 2004-04-28 Rena Sondermaschinen GmbH Transportrollen, Niederhalter und Transportsystem für flaches Transportgut
DE112004002879A5 (de) * 2004-03-22 2007-05-24 Rena Sondermaschinen Gmbh Verfahren zur Behandlung von Substratoberflächen

Also Published As

Publication number Publication date
DE102006033354A1 (de) 2008-01-31
CN101110350A (zh) 2008-01-23
JP5080157B2 (ja) 2012-11-21
CN101110350B (zh) 2011-07-13
JP2008028394A (ja) 2008-02-07
TW200812888A (en) 2008-03-16
DE102006033354B4 (de) 2012-01-12

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Legal Events

Date Code Title Description
VOID Decisions declaring the decisions on the grant of the patents lapsed