PL3775936T3 - Elektrooptyczna płytka drukowana obwodu elektronicznego do stykania się z fotonicznymi układami scalonymi - Google Patents

Elektrooptyczna płytka drukowana obwodu elektronicznego do stykania się z fotonicznymi układami scalonymi

Info

Publication number
PL3775936T3
PL3775936T3 PL19717459.2T PL19717459T PL3775936T3 PL 3775936 T3 PL3775936 T3 PL 3775936T3 PL 19717459 T PL19717459 T PL 19717459T PL 3775936 T3 PL3775936 T3 PL 3775936T3
Authority
PL
Poland
Prior art keywords
electro
contacting
circuit board
integrated circuits
optical circuit
Prior art date
Application number
PL19717459.2T
Other languages
English (en)
Inventor
Philipp Huebner
Stefan Richter
Original Assignee
Carl Zeiss Smt Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss Smt Gmbh filed Critical Carl Zeiss Smt Gmbh
Publication of PL3775936T3 publication Critical patent/PL3775936T3/pl

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/07—Non contact-making probes
    • G01R1/071—Non contact-making probes containing electro-optic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Liquid Crystal (AREA)
  • Optical Integrated Circuits (AREA)
PL19717459.2T 2018-04-09 2019-04-08 Elektrooptyczna płytka drukowana obwodu elektronicznego do stykania się z fotonicznymi układami scalonymi PL3775936T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018108283.5A DE102018108283A1 (de) 2018-04-09 2018-04-09 Elektro-optische Leiterplatte zur Kontaktierung von photonischen integrierten Schaltungen
PCT/EP2019/058777 WO2019197320A1 (en) 2018-04-09 2019-04-08 Electro-optical circuit board for contacting photonic integrated circuits

Publications (1)

Publication Number Publication Date
PL3775936T3 true PL3775936T3 (pl) 2024-04-29

Family

ID=66175408

Family Applications (1)

Application Number Title Priority Date Filing Date
PL19717459.2T PL3775936T3 (pl) 2018-04-09 2019-04-08 Elektrooptyczna płytka drukowana obwodu elektronicznego do stykania się z fotonicznymi układami scalonymi

Country Status (7)

Country Link
US (1) US11946950B2 (pl)
EP (1) EP3775936B1 (pl)
CN (2) CN118209764A (pl)
DE (1) DE102018108283A1 (pl)
PL (1) PL3775936T3 (pl)
TW (1) TWI816773B (pl)
WO (1) WO2019197320A1 (pl)

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US11734556B2 (en) 2019-01-14 2023-08-22 Lightelligence PTE. Ltd. Optoelectronic computing systems
EP4049048A1 (de) 2019-10-25 2022-08-31 JENOPTIK Optical Systems GmbH Wafer-level-testverfahren für opto-elektronische chips
US11243230B2 (en) * 2019-12-30 2022-02-08 Juniper Networks, Inc. Compact opto-electric probe
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US11411644B2 (en) 2020-07-30 2022-08-09 Openlight Photonics, Inc. Multi-lane optical-electrical device testing using automated testing equipment
US11747396B2 (en) 2020-07-30 2023-09-05 Openlight Photonics, Inc. Optical interconnections for hybrid testing using automated testing equipment
US20220034750A1 (en) * 2020-07-31 2022-02-03 Juniper Networks, Inc. Hybrid automated testing equipment for testing of optical-electrical devices
US11960122B2 (en) * 2021-03-22 2024-04-16 Taiwan Semiconductor Manufacturing Company, Ltd. Devices, systems, and methods for optical signal processing
WO2022204277A1 (en) * 2021-03-23 2022-09-29 Nielson Scientific Llc Cryogenic probe card
EP4323784A1 (de) 2021-04-16 2024-02-21 JENOPTIK Optical Systems GmbH Wafer-level-testverfahren für opto-elektronische chips
CN117203536B (zh) * 2021-04-16 2024-06-07 业纳光学系统有限公司 光电芯片的晶圆级测试方法
DE102021110102B4 (de) 2021-04-16 2024-05-23 Jenoptik Optical Systems Gmbh Wafer-Level-Testverfahren für opto-elektronische Chips
CN116299902B (zh) * 2021-07-01 2024-05-28 上海曦智科技有限公司 封装结构及其封装方法
DE102022103611A1 (de) 2022-02-16 2023-08-17 Carl Zeiss Smt Gmbh Vorrichtungen, testkarten und verfahren zum testen von photonischen integrierten schaltungen sowie photonische integrierte schaltungen
WO2023243019A1 (ja) * 2022-06-15 2023-12-21 日本電信電話株式会社 光半導体集積回路

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US7554347B2 (en) * 2002-03-19 2009-06-30 Georgia Tech Research Corporation High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use
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Also Published As

Publication number Publication date
WO2019197320A1 (en) 2019-10-17
TWI816773B (zh) 2023-10-01
CN118209764A (zh) 2024-06-18
TW201945748A (zh) 2019-12-01
EP3775936B1 (en) 2023-12-13
CN111919124A (zh) 2020-11-10
US11946950B2 (en) 2024-04-02
DE102018108283A1 (de) 2019-10-10
EP3775936C0 (en) 2023-12-13
US20210033643A1 (en) 2021-02-04
EP3775936A1 (en) 2021-02-17
CN111919124B (zh) 2024-04-02

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