PL359888A1 - Zestaw płytek z obwodami drukowanymi - Google Patents

Zestaw płytek z obwodami drukowanymi

Info

Publication number
PL359888A1
PL359888A1 PL03359888A PL35988803A PL359888A1 PL 359888 A1 PL359888 A1 PL 359888A1 PL 03359888 A PL03359888 A PL 03359888A PL 35988803 A PL35988803 A PL 35988803A PL 359888 A1 PL359888 A1 PL 359888A1
Authority
PL
Poland
Prior art keywords
stationary board
board
replaceable
reserve
stationary
Prior art date
Application number
PL03359888A
Other languages
English (en)
Other versions
PL200759B1 (pl
Inventor
Zbigniew Wabiszczewicz
Original Assignee
Advanced Digital Broadcast Ltd.
Advanced Digital Broadcast Polska Sp.z o.o.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Digital Broadcast Ltd., Advanced Digital Broadcast Polska Sp.z o.o. filed Critical Advanced Digital Broadcast Ltd.
Priority to PL359888A priority Critical patent/PL200759B1/pl
Priority to US10/827,904 priority patent/US7008236B2/en
Publication of PL359888A1 publication Critical patent/PL359888A1/pl
Publication of PL200759B1 publication Critical patent/PL200759B1/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49721—Repairing with disassembling
    • Y10T29/4973—Replacing of defective part

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Networks Using Active Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

W skład zestawu wchodzi płytka stacjonarna (61) oraz c najmniej jedna płytka rezerwowa-wymienialna (62). Płytka stacjonarna zawiera jeden fragment lub kilka fragmentów, które w zależności od potrzeb są zastępowane płytkami rezerwowo-wymienialnymi. Fragmenty płytki stacjonarnej są wymieniane, gdy umieszczone na nich elektryczne elementy czynne lub bierne uległy uszkodzeniu, bądź gdy zachodzi potrzeba zamiany funkcji elektrycznej realizowanej dotychczas przez jakiś fragment płytki stacjonarnej. Do galwanicznego połączenia ścieżek przewodzących (63) na obrzeżu płytki stacjonarnej (61) ze ścieżkami przewodzącymi (65) płytki rezerwowej ľwymienialnej (62) służą w kształcie kołka (66).
PL359888A 2003-04-25 2003-04-25 Zestaw płytek z obwodami drukowanymi PL200759B1 (pl)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PL359888A PL200759B1 (pl) 2003-04-25 2003-04-25 Zestaw płytek z obwodami drukowanymi
US10/827,904 US7008236B2 (en) 2003-04-25 2004-04-20 Set of printed circuit boards comprising replacement board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL359888A PL200759B1 (pl) 2003-04-25 2003-04-25 Zestaw płytek z obwodami drukowanymi

Publications (2)

Publication Number Publication Date
PL359888A1 true PL359888A1 (pl) 2004-11-02
PL200759B1 PL200759B1 (pl) 2009-02-27

Family

ID=33488053

Family Applications (1)

Application Number Title Priority Date Filing Date
PL359888A PL200759B1 (pl) 2003-04-25 2003-04-25 Zestaw płytek z obwodami drukowanymi

Country Status (2)

Country Link
US (1) US7008236B2 (pl)
PL (1) PL200759B1 (pl)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7143492B2 (en) * 2004-04-27 2006-12-05 Shiou Shenq Technology Co., Ltd. Printed circuit board defective area transplant repair method
US20070137886A1 (en) * 2005-12-21 2007-06-21 Chen-Hsiang Yen Method for partial replacement of a circuit board
JP4740765B2 (ja) * 2006-02-24 2011-08-03 エルピーダメモリ株式会社 半導体装置及びその製造方法
TW200908846A (en) * 2007-08-08 2009-02-16 Asustek Comp Inc Printed circuit board
US8698004B2 (en) * 2008-10-27 2014-04-15 Ibiden Co., Ltd. Multi-piece board and fabrication method thereof
US8995144B1 (en) * 2010-06-22 2015-03-31 Marvell International Ltd. On board wireless module architecture
TWI461127B (zh) * 2012-12-25 2014-11-11 Univ Nat Taipei Technology 電子裝置及其製法
JP2014165210A (ja) * 2013-02-21 2014-09-08 Fujitsu Component Ltd モジュール基板
US9554476B2 (en) * 2014-08-14 2017-01-24 Continental Automotive Systems, Inc. Compliant staple pin for connecting multiple printed circuit boards
CN107770956A (zh) * 2016-08-16 2018-03-06 光宝电子(广州)有限公司 电路板结构
WO2020178156A1 (en) 2019-03-01 2020-09-10 Signify Holding B.V. Tolerance reduction for v-cut
MX2022010810A (es) 2020-03-04 2022-09-27 Ka Group Ag Sensores de localizacion estructural para un modulo de sensor que utiliza un montaje de placa de circuito impreso.

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3131140A (en) * 1961-04-13 1964-04-28 Ashland Oil Inc Process for producing an improved asphalt
NL135260B (pl) * 1963-08-16 1900-01-01
US3333225A (en) * 1964-06-29 1967-07-25 Ibm Connector
US3591834A (en) * 1969-12-22 1971-07-06 Ibm Circuit board connecting means
US3765076A (en) 1971-11-16 1973-10-16 Western Electric Co Printed circuit board and a method of repairing contacts on a printed circuit board
DE2261130A1 (de) * 1972-12-14 1974-06-20 Loewe Opta Gmbh Elektrisches baugruppenchassis
US4216523A (en) * 1977-12-02 1980-08-05 Rca Corporation Modular printed circuit board
US4816789A (en) * 1986-05-19 1989-03-28 United Technologies Corporation Solderless, pushdown connectors for RF and DC
US5031073A (en) * 1990-05-02 1991-07-09 Hewlett-Packard Company Fault-isolating apparatus and method for connecting circuitry
US5270673A (en) * 1992-07-24 1993-12-14 Hewlett-Packard Company Surface mount microcircuit hybrid
US5263868A (en) * 1993-03-08 1993-11-23 The Whitaker Corporation Flexible circuit interface for coplanar printed circuit boards
AT399616B (de) * 1993-04-01 1995-06-26 Koninkl Philips Electronics Nv Gerät mit mindestens einer an einer leiterplatte fix angebrachten batterie
GB2283863A (en) * 1993-11-16 1995-05-17 Ibm Direct chip attach module
DE9417299U1 (de) * 1994-10-27 1995-03-02 Siemens AG, 80333 München Stromversorgungsmodul zur Bestückung einer Baugruppenleiterplatte
DE19756345C2 (de) * 1997-12-18 1999-12-30 Telefunken Microelectron Anordnung zur Kontaktierung von Leiterplatten
US6215671B1 (en) * 1998-12-10 2001-04-10 Garmin Corporation Method and apparatus for connecting circuit boards
US6481098B1 (en) 2001-07-05 2002-11-19 Shou-Chih Lin Chen Method of manufacturing circuit boards

Also Published As

Publication number Publication date
PL200759B1 (pl) 2009-02-27
US20040245012A1 (en) 2004-12-09
US7008236B2 (en) 2006-03-07

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