WO2020178156A1 - Tolerance reduction for v-cut - Google Patents

Tolerance reduction for v-cut Download PDF

Info

Publication number
WO2020178156A1
WO2020178156A1 PCT/EP2020/055226 EP2020055226W WO2020178156A1 WO 2020178156 A1 WO2020178156 A1 WO 2020178156A1 EP 2020055226 W EP2020055226 W EP 2020055226W WO 2020178156 A1 WO2020178156 A1 WO 2020178156A1
Authority
WO
WIPO (PCT)
Prior art keywords
board
groove
panel arrangement
support panel
edge
Prior art date
Application number
PCT/EP2020/055226
Other languages
French (fr)
Inventor
Dirk Pieter Johan Hendrik VAN DEN HEUVEL
Nicolaas Antonie VAN RIJSWIJK
Original Assignee
Signify Holding B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Signify Holding B.V. filed Critical Signify Holding B.V.
Publication of WO2020178156A1 publication Critical patent/WO2020178156A1/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/0909Preformed cutting or breaking line
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Definitions

  • the invention relates to a board panel arrangement comprising a (printed circuit) board and to a functional unit comprising such board, as well as to a lighting system comprising such board.
  • the invention also relates to a method for providing a board.
  • US20110255250A1 describes that electronic devices such as computers, cellular telephones, and other devices typically contain printed circuit boards. Electrical components such as integrated circuits, switches, buttons, input-output port connectors, resistors, capacitors, inductors, and other discrete components may be mounted to a printed circuit board. Rigid printed circuit boards may be formed from materials such as fiberglass- filled epoxy. In typical manufacturing environments, printed circuit boards are cut from large panels of printed circuit board material. Break out tabs may be used to secure the boards during processing. After processing is complete, the tabs may be broken to release the boards from the panel. Portions of the boards where the tabs are broken generally exhibit rough edges.
  • US 2004 / 245012 A1 discloses a set of printed circuit boards which consists of a main board with at least one fragment intended for replacement and at least one replacement board, wherein said main board has openings in the dielectric layer placed along the edge line of the fragment intended for replacement, and between the openings there are bridges, and at least one of said bridges has an electric conductor thereon, and the replacement board has electric conductors in places matching the placement of the electric conductors of said bridges of the main board.
  • JP S63 70489 A discloses a method of manufacturing a plurality of metal base printed wiring boards.
  • a metal base printed wiring board is punched such that a plurality of metal base printed wiring boards are obtained which are connected to a support lead via support lead pieces.
  • the support lead pieces can be cut to obtain a plurality of individual metal base printed wiring boards.
  • US 2012 / 056210 A1 discloses a light emitting apparatus capable of increasing the number of substrates formed from one multi-surface pattern substrate and capable of reducing the manufacturing cost.
  • the light emitting apparatus includes a belt-like substrate, a light emitting element mounted on the substrate, and a luminous flux control member mounted on the substrate.
  • the substrate has a pair of fracture surfaces formed at predetermined intervals along a lengthwise direction and formed at both ends in a widthwise direction between luminous flux control members neighboring each other along the lengthwise direction, wherein dimensions W1 and W2 in the widthwise direction between the pair of fracture surfaces are less than a dimension in the widthwise direction of the luminous flux control member, and the dimension W2 in the widthwise direction of a part overlapping the luminous flux control member in a plan view is less than the dimension W1 in the widthwise direction between the pair of fracture surfaces.
  • US 2006 / 276058 discloses a method and apparatus for attenuating flexible circuit resonance.
  • the apparatus includes a flexible circuit assembly.
  • the flexible circuit assembly has a flexible circuit having a flexible cable with first and second sides.
  • the flexible circuit assembly also includes a circuit support.
  • the circuit support includes a base having top and bottom surfaces. The bottom surface is attached to the first side of the flexible cable.
  • the circuit support also includes a support wall extending substantially
  • the support wall has a first face, which is substantially oriented towards the top surface of the base.
  • the first side of the flexible cable is attached to the first face and also faces a second face of the support wall to thereby reverse a direction in which the flexible cable faces.
  • PCBs may generally be built as part of a multi board (also:“(full) panel” or“array” or“board panel arrangement”) comprising a plurality of PCBs.
  • the PCBs may be integrated in a support panel (an outer layer).
  • the multi board may be generally configured such that the PCBs are detachable, i.e., a PCBs may be separable from an adjacent PCB, and a PCB may be separable from a support panel.
  • V-groove panelization may comprise providing a V-cut (also“V-shaped edge” or“V-groove”) on the multi board along the outer edge of a PCB, i.e., between two PCBs, or between a PCB and a support panel.
  • V-groove panelization may comprise providing a V-cut along the outer edge of a PCB both on the top side and on the bottom side of the multi board.
  • the V-cut may be provided such that the multi panel remains mechanically stable, for example, a sufficient height of the multi board may be left between the top side and the bottom side edge).
  • the V- cut may be provided such that a PCB may be detached (also:“depaneled”) at the V-cut, especially broken out, or especially cut out, for example by using a“pizza cutter” machine.
  • the PCB may comprise a rough edge where the V-cut used to be.
  • the rough edge a left-over from breaking/cutting, may have an inconsistent size for PCBs provided via the same method, even for otherwise identical PCBs.
  • the downstream process may be restricted by a required tolerance due to dimensional inconsistencies of the PCBs, i.e., the current method of breaking (or cutting) a multi board with a V-cut may result in (the need for) a high dimensional tolerance, such as a dimensional tolerance of about 0.6 mm.
  • some processes may benefit from, or even demand, a tighter dimensional tolerance.
  • some processes may require a dimensional tolerance of about 0.3 mm, such as about 0.2 mm, especially about 0.1 mm.
  • the rough edge at the outline of a prior art PCB may hinder tightly arranging the PCB in an application, such as in a (compact) luminaire.
  • the present invention may have as object to overcome or ameliorate at least one of the disadvantages of the prior art, or to provide a useful alternative.
  • the invention may provide a board panel arrangement comprising a support panel arrangement and a board detachably integrated in the support panel arrangement.
  • the board may comprise a board edge comprising board extremities.
  • the board extremities may define a board outline of the board.
  • the board edge may comprise a first edge part and a second edge part.
  • the board may be configured separated from the support panel arrangement.
  • the board and the support panel arrangement may be physically connected via a panel bridge.
  • the panel bridge may comprise a groove for (physically) separating the board and the support panel arrangement along the groove, especially by breaking and/or cutting along the groove.
  • the groove may be configured recessed relative to the board outline.
  • the board panel (lighting) arrangement may provide the benefit that the groove is arranged within the board outline of the board.
  • the (single) board (which can be used in lamp or a luminaire) may have a straight and accurate board outline (after (physical) separation from the support panel arrangement), which may be beneficial for further applications (e.g. better fit in the application) /processes.
  • the invention may provide a solution to reduce the (need for) (dimensional) tolerance for boards provided via grooves in a board panel arrangement.
  • the invention may be beneficial in any application where a manufacturing process comprises (physical) separation of a board from a support panel arrangement, such as for a manufacturing process involving multi board PCBs, for example for drivers, led modules, electronic modules, sensors, etc.
  • the board panel arrangement may comprise a support panel arrangement and a board.
  • the board panel arrangement may have a plate-like shape, i.e., the board panel arrangement may have an arrangement width and an arrangement length substantially larger than an arrangement height 13 ⁇ 4.
  • the board may have a plate-like shape, i.e., the board may have a board width, especially a board width parallel to the arrangement width, and a board length, especially a board length parallel to the arrangement length, substantially larger than a board height l , especially a board height l parallel to the arrangement height 13 ⁇ 4.
  • the board height lu may be about equal to the arrangement height 13 ⁇ 4.
  • the board may have a board height l selected from the range of 0.25 to 6 mm, such as selected from the range of 0.5 to 3 mm.
  • the board may have a board height lu selected from the group consisting of 1 mm and 1.6 mm, especially 1 mm, or especially 1.6 mm.
  • the board may have a top board face and a (parallel) bottom board face separated by the board height lu, and a plurality of board side faces (essentially) perpendicular to the top board face and to the bottom board face.
  • the board may have a cross-section, especially a cross-section perpendicular to the top (bottom) board face, approximating a rectangular shape.
  • the term“in a plane” and similar terms refer(s) to a cross-sectional plane perpendicular to the (arrangement or board) height, and in general parallel to a bottom face and parallel to a top face of the board, and in general perpendicular to one or more edges of the board.
  • the bottom board face and top board face may define the board height.
  • the phrase “board height” and similar phrases refer to the height of the board, especially of the PCB, only.
  • the board panel arrangement may comprise a board detachably integrated in a support panel arrangement.
  • the phrase“the board integrated in the support panel arrangement” may herein refer to the support panel arrangement (at least partially) surrounding the board, especially (at least partially) surrounding the board along the board side faces.
  • the board may be arranged within the confines of the support panel arrangement.
  • the board panel arrangement may comprise a plurality of boards, especially a plurality of boards arranged in a (2D) grid along the arrangement width and the arrangement length of the board panel arrangement.
  • Each of the plurality of boards may be detachably integrated in a (respective) support panel arrangement.
  • the (respective) support panel arrangement may comprise one or more other boards of the plurality of boards.
  • the board panel arrangement may comprise a board and a
  • the (respective) support panel arrangement wherein the (respective) support panel arrangement comprises the remainder of the board panel arrangement (except for the (respective) board).
  • the support panel arrangement may comprise one or more boards.
  • the support panel arrangement may comprise the remainder of the board panel arrangement with respect to the (to be detached) board.
  • the support panel arrangement may comprise a support panel, i.e., a section of the board panel arrangement not comprised by any one of the plurality of boards.
  • the support panel arrangement may comprise a (dedicated) support panel and one or more boards.
  • the support panel may comprise the outer edge of the board panel arrangement, i.e., the support panel may have a frame-like shape, especially comprising the border of the board panel arrangement along the board sides.
  • the board may comprise a board edge comprising board extremities.
  • the board edge may (essentially) be parallel with the board height, i.e., the board edge may run along the side faces.
  • the board edge may further run along one or more grooves.
  • the board extremities may comprise all points that are the farthest in one or more directions, especially with respect for the values in the remaining directions.
  • the board may resemble a cuboid, especially a plate, and the extremities comprise the comers of the cuboid.
  • the board extremities may define a board outline of the board.
  • the board outline may be defined by the set of straight lines spanning between the board extremities without passing through the board.
  • the board outline may comprise the convex hull of the board.
  • a +-shaped board may have a +-shaped board edge and a ⁇ - shaped outline.
  • the board may have a shape approximating a cuboid, and the board outline may comprise a cuboid.
  • the outline may be defined by outline edges which are parallel to the height of the board height or the board panel arrangement height.
  • the plurality of board side faces may especially be side faces of the board outline.
  • the board may have a shape approximating a cuboid, such as approximating a plate, and may have a board outline having a shape of a cuboid, wherein the board has four side faces matching the cuboid defined by the board outline.
  • the board may comprise a rigid board or a semi-rigid board, especially a rigid board.
  • the board may comprise a semi-rigid board. This may apply to all boards in the board panel arrangement.
  • the board may comprise a metal, especially a metal selected from the group comprising copper aluminum, tin, iron, silver and lead, more especially a metal selected from the group comprising copper and aluminum.
  • the board may have a thermal conductivity of at least 200 W/(m*K), especially at least 250 W/(m*K), such as at least 300 W/(m*K).
  • the board may comprise a printed circuit board.
  • the board may comprise one or more of a CEM-1 PCE, a CEM-3 PCE, a FR-1 PCE, a FR-2 PCB, a FR-3 PCB, a FR-4 PCB, and aluminum metal core PCB, especially one or more of a CEM-1 PCB, a CEM-3 PCB, a FR-1 PCB, and a FR4 PCB and an aluminum metal core PCB, more especially one or more of a CEM-1 PCB, a CEM-3 PCB, a FR-1 PCB.
  • the board edge may comprise a first edge part and a second edge part. Especially, over the first edge part the board may be configured (physically) separated from the support panel arrangement, especially separated by gas, such as by air.
  • the physical separation may e.g. be an elongated (slit) through hole, of e.g. at least a 1 mm width.
  • the board and the support panel arrangement may be physically connected via a panel bridge.
  • the board and the support panel arrangement may be configured (physically) separated except for the panel bridge, similarly as to how two opposite shores along a river may be separated except for a connecting bridge.
  • the phrase“a panel bridge” may refer to one or more panel bridges.
  • the panel bridge may comprise a groove.
  • the groove may be configured for (physically) separating the board and the support panel arrangement along the groove.
  • the term“groove” may also refer to a plurality of grooves, especially a plurality of grooves arranged on a (single) panel bridge.
  • the groove may comprise a V-groove, a U-groove, or any other groove shape suitable for separating the board and the support panel arrangement at the groove.
  • the groove may comprise a V-groove or a U-groove, especially a V-groove, or especially a U-groove.
  • the groove is not a through hole, whereby a physical connection between the board and the support panel arrangement is maintained (until separation of the board from the support panel arrangement).
  • the groove may comprise a cut into the panel bridge, especially a top cut into the top face (or:“top side”) of the panel bridge or a bottom cut into the bottom face (or:“bottom side”) of the panel bridge (essentially parallel to the top board side and the bottom board side).
  • the groove may comprise a single cut, especially a single top cut, or especially a single bottom cut.
  • the cut may comprise a V-shaped cut or a U-shaped cut, or any other cut shape suitable for separating the board and the support panel arrangement at the groove.
  • the cut may comprise a V-shaped cut or a U-shaped cut, especially a V-shaped cut, or especially a U-shaped cut.
  • the top cut may a V-shaped cut or a U-shaped cut, especially a V-shaped cut, or especially a U- shaped cut.
  • the bottom cut may a V-shaped cut or a U-shaped cut, especially a V-shaped cut, or especially a U-shaped cut.
  • the groove may comprise groove a top (V-shaped) cut into the top face (or:“top side”) of the panel bridge and a bottom (V-shaped) cut into the bottom face (or:“bottom side”) of the panel bridge (essentially parallel to the top board side and the bottom board side).
  • the top (V-shaped) cut and the bottom (V- shaped) cut may essentially be mirror-imaged.
  • the top (V- shaped) cut and the bottom (V-shaped) cut may be different, such as arranged at a different angle (see further below) or with a different depth (also see further below).
  • the groove bottom (deepest point) of the top (V-shaped) cut and the groove bottom of the bottom (V-shaped) cut may be essentially parallel, especially the groove bottom of the top (V-shaped) cut may be arranged directly above the groove bottom of the bottom (V- shaped) cut.
  • the groove may provide a relatively weak point in the panel bridge such that the board and the support panel arrangement may be (physically) separated at the groove, especially along the groove.
  • the groove may comprise a top (V-shaped) cut and a bottom (V-shaped) cut.
  • the groove may also comprise a single (V-shaped) cut, such as especially only a top (V-shaped) cut, or especially only a bottom (V- shaped) cut. For instance, by applying a torque to the board relative to the support panel arrangement, the board may be broken away.
  • the groove may comprise a (V-shaped) cut arranged at an angle (between the legs of the V) selected from the range of 5° - 150°, especially from the range of 10° - 120°, such as from the range of 20° - 90°, especially from the range of 30° - 60°.
  • the groove may comprise a top (V-shaped) cut and a bottom (V- shaped) cut, each arranged at an angle (between the legs of the V) independently selected from the range of 5° - 150°, especially from the range of 10° - 120°, such as from the range of 20° - 90°, especially from the range of 30° - 60°, more especially wherein the angle of the top (V-shaped) cut is (about) equal to the angle of the bottom (V-shaped) cut.
  • the groove is configured recessed relative to a recess opening.
  • the recess opening may have a recess opening length in the range from 1 to 8 mm. More preferably, the recess opening length is in the range from 2 to 7 mm. Most preferably, the recess opening length is in the range from 3 to 6 mm.
  • the obtained effect is improved safety. The reason is that such a configuration allows that a (adult) person cannot touch the left-over rough / sharp edge and/or reduces the chance that a (adult) person touches the left over rough / sharp edge e.g. during assembly / usage of the board.
  • the recess opening length may be defined as the (minimum) length between two neighboring first edge parts measured at the board outline.
  • a third distance between the board outline and the groove is preferably at least 0.5 times the recess opening length. More preferably, the third distance between the board outline and the groove is preferably at least 0.7 times the recess opening length. Most preferably, the third distance between the board outline and the groove is preferably at least 0.9 times the recess opening length.
  • the obtained effect is further improved safety. The reason is that such a configuration allows that a (adult) person cannot touch the left-over rough / sharp edge and/or further reduces the chance that a (adult) person touches the left over rough / sharp edge e.g. during assembly / usage of the board.
  • the groove length may be larger than the recess opening length.
  • the groove length may be smaller than the recess opening length.
  • the groove has a groove length, wherein the groove is configured recessed relative to a recess opening, the recess opening has a recess opening length, wherein the groove length is in a range from 0.7 to 1 times the recess opening length. More preferably, the groove length is in a range from 0.8 to 1 times the recess opening length. Most preferably, the groove length is in a range from 0.85 to 1 times the recess opening length. The obtained effect is improved mechanical integrity / stability.
  • the recess opening length may be defined as the (minimum) length between two neighboring first edge parts measured at the board outline.
  • the groove has a groove length, wherein the groove is configured recessed relative to a recess opening, the recess opening having a recess opening length, wherein the groove length is larger than the recess opening length.
  • the board comprises an electrically conductive board track which is electrically connected to the solid state light source.
  • the support panel arrangement comprises an electrically conductive support panel arrangement track.
  • the electrically conductive board track and electrically conductive support panel arrangement track are electrically connected when the board is mechanically connected to the support panel arrangement.
  • the board panel arranged preferably comprises a plurality of boards.
  • the plurality of boards may have an electrically conductive board track.
  • the electrically conductive board tracks of a plurality of boards may be connected to the electrically conductive support panel arrangement track.
  • the obtained effect is improved testing.
  • the reason is that testing of the functional component(s) / solid state light source(s) (on a plurality of boards) may be done via the electrically conductive support panel arrangement track.
  • the groove may only be arranged bottom side of the PCB.
  • the board comprises at least two indentations, wherein the at least two indentations are arranged on either side of the panel bridge.
  • the indentations comprise a (slit) through hole and/or slit (indentations).
  • the panel bridge may have a first height hi (parallel to the arrangement height), especially wherein the first height hi is the largest height of the panel bridge, wherein the panel bridge has a smallest second height h2 at the groove, wherein 0.05 ⁇ h 2 /hi ⁇ 0.8, such as 0.1 ⁇ h 2 /hi ⁇ 0.6, especially 0.25 ⁇ h 2 /hi ⁇ 0.45.
  • a weaker mechanical connection may be (partially) desired, as this facilitates separating the board from the support panel arrangement.
  • the mechanical connection may need to be sufficient that the board and the support panel arrangement do not separate unintentionally.
  • different second heights h2 may be suitable for different (board panel arrangement) materials, and the person skilled in the art will select a second height h2 suitable for the used (board panel arrangement) materials.
  • the first height hi may be about equal to the board height hi. In further embodiments, the first height hi may be about equal to the arrangement height h3.
  • the second height h2 may (essentially) be the height of the remaining material of the panel bridge at the groove, i.e., the second height h2 may be the first height hi minus the depth of the groove.
  • the groove(s) comprises a top cut and a bottom cut
  • h2 may (essentially) be the first height hi minus the depth of the depth of the top cut and minus the depth of the bottom cut.
  • the groove may be configured such that the board may be
  • the board may comprise a rough edge where the groove used to be, especially directly below and/or above the groove bottom(s).
  • the rough edge (and the slanted plane, see further below) may especially be arranged where the second edge part was arranged prior to (physical) separation.
  • the term“second edge part” refers to the part of the board physically connected to the support panel arrangement prior to (physical) separation, as well as to the same part of the board after (physical) separation of the board from the support panel.
  • the groove especially the groove bottom, may be configured recessed relative to the board outline, especially at least 0.1 mm recessed relative to the board outline, such as at least 0.15 mm, especially at least 0.2 mm, such as at least 0.25 mm, especially at least 0.3 mm, such as at least 0.45 mm, especially at least 0.55 mm, such as at least 0.6 mm, especially at least 0.65 mm, such as at least 0.8 mm.
  • the groove may be configured such that a rough edge resulting from (physically) separating the board and the support panel arrangement at the groove does not comprise any of the board extremities, i.e., the rough edge falls within the board outline.
  • the groove may comprise a groove bottom, wherein the groove bottom is at least 0.1 mm recessed relative to the board outline, such as at least 0.15 mm recessed, especially at least 0.2 mm recessed, such as at least 0.25 mm recessed, especially at least 0.3 mm recessed, such as at least 0.45 mm recessed, especially at least 0.55 mm recessed, such as at least 0.6 mm recessed, especially at least 0.65 mm recessed, such as at least 0.8 mm recessed, especially at least 1 mm recessed, such as at least 2 mm recessed, especially at least 4 mm recessed, like at least 5 mm, such as up to 20 mm recessed, or even more.
  • the groove bottom is at least 0.1 mm recessed relative to the board outline, such as at least 0.15 mm recessed, especially at least 0.2 mm recessed, such as at least 0.25 mm recessed, especially at least 0.3 mm recessed, such as at least 0.45 mm recessed, especially at least 0.55 mm
  • the groove, especially the groove bottom may be configured recessed relative to the board outline for a substantial proportion, such as especially 80% or more, of the board length (or board width).
  • the groove, especially the groove bottom may be 20 mm recessed relative to the board outline.
  • Such embodiment may, for example, be beneficial if a socket is desired in the board such that the board can be arranged adjacent to or around a protruding element.
  • the groove, especially the groove bottom may be configured at most 20 mm recessed relative to the board outline.
  • the recession especially refers to the recession relative to the board outline in the plane of the board panel arrangement.
  • the groove may be considered a recession relative to e.g. the first side face or the second side face of the board, and perpendicular to the plane of the board panel arrangement.
  • the groove may have a groove length (LI) of at least 1 mm, such as at least 2 mm, especially at least 3 mm, such as at least 5 mm, especially at least 10 mm, such as at least 15 mm, especially at least 25 mm.
  • the groove length (LI) of the groove may be approximately the same as the length of the second edge part.
  • a longer second edge part, and thus a longer physical connection between the board and the support panel arrangement, may provide a better mechanical connection of the board to the support panel arrangement.
  • a longer groove length (LI) which may be approximately the same as the length of the second edge part, may provide a better mechanical connection of the board to the support panel arrangement.
  • a longer groove may also have a deeper (V-shaped) cut as the (weight on the) mechanical connection is spread out along a longer distance.
  • a long groove with a deep (V-shaped) cut may be mechanically well connected in the support panel arrangement, while being easy to break in one direction.
  • the groove may especially be arranged along a straight line.
  • the groove may be arranged along a straight line (approximately) parallel to a board dimension, such as board width or a board length.
  • the (V-shaped) cut may have a groove length (LI) equal to or smaller than the length of the parallel board dimension L2 (the length of the parallel board dimension) minus 1 mm, i.e. LI ⁇ L2 - 1 mm, especially LI ⁇ L2 - 2 mm, such as LI ⁇ L2 3 mm.
  • the panel bridge may comprise part of the board. Further, the panel bridge may comprise part of the support panel arrangement. Essentially, the panel bridge may comprise a physical connection between the board and the support panel arrangement, especially wherein the groove (bottom) indicates the border between the board and the support panel arrangement. Essentially, any part of the panel bridge that is connected to the board after separation of the board and the support panel arrangement at the groove, is also part of the board.
  • the board, panel bridge, and (respective) support panel arrangement may be from the same material, as they may be made from a single mother board. For that reason, the height may also be essentially the same (except for the groove, which has a smaller height).
  • the board may comprise a (slit) indentation arranged adjacent to the panel bridge, especially wherein the (slit) indentation stretches along the board height, i.e., the indentation comprises a through hole.
  • the board may comprise (at least) two indentations, wherein the (at least) two indentations are arranged on either side of the panel bridge.
  • the indentations may especially be in line with the groove, especially along a straight line defined by the groove.
  • the indentation may be provided by milling (by a point cutter).
  • the board may be physically connected to the support panel arrangement via a panel bridge at a first side of the board, wherein the first side comprises two indentations (especially stretching along the board height), wherein the panel bridge is arranged between the two indentations, and wherein the groove runs between the two indentations.
  • the indentation may especially connect to a through hole in the support panel arrangement.
  • the indentation may be elongated along a direction perpendicular to the board height lu.
  • the through hole may comprise a rounded edge(s).
  • the top (V-shaped) cut and the bottom (V-shaped) cut may have different groove depths, i.e., one of the cuts may be deeper into the panel bridge than the other cut.
  • the top (V-shaped) cut and the bottom (V-shaped) cut may have the same groove depth.
  • the first edge part may have a length of at least 0.5 mm, such as at least 1 mm.
  • the first edge part may round a comer of the board, especially an extremity, and have a length of at least 0.5 mm, such as at least 1 mm, at each side of the comer.
  • the second edge part may have a length of at least 1 mm, such as at least 2 mm.
  • second edge part may also refer to a plurality of second edge parts.
  • first edge part may also refer to a plurality of first edge parts.
  • the plurality of first edge parts and the plurality of second edge parts may be arranged altematingly.
  • the board may comprise n first edge parts and n second edge parts, especially wherein over n first edge parts the board is configured separated from the support panel arrangement, and especially wherein over (each ol) n second edge parts the board and the support panel arrangement are physically connected via a (respective) panel bridge, especially via (at least) n (respective) panel bridges, wherein n>2, and wherein the first edge parts and second edge parts are configured altematingly, especially wherein n > 3, more especially wherein n > 4, such as n > 6.
  • (a first set ol) one or more of the (k) side faces of the board may be devoid of a second edge part, i.e., the board is not physically connected to the support panel arrangement at the one or more of the side faces.
  • one or more of the (k) side faces may (each) comprise a plurality of second edge parts, i.e., the board may comprise a side face comprising a plurality of second edge parts, wherein over each of the plurality of the second edge parts the board is physically connected to a support panel arrangement.
  • the length of the first edge part may be larger than the length of the second edge part.
  • the sum of the lengths of the plurality of first edge parts SI (the sum of the lengths of the plurality of first edge parts) may be larger than or equal to the sum of the lengths of the plurality of second edge parts S2 (the sum of the lengths of the plurality of second edge parts), especially SI > S2, such as SI > 1.5*S2, especially SI > 2*S2, such as SI > 3*S2.
  • the board panel arrangement may comprise a plurality of boards. Each board may be arranged adjacent to one or more other boards and/or to a support panel in the support panel arrangement. Hence, one or more boards may also be part of the support panel arrangement for one or more other boards.
  • the board panel arrangement may comprise a plurality of boards, each detachably integrated in the (respective) support panel arrangement, wherein for each board applies that over the first edge part the board is configured separated from the support panel arrangement, and wherein over the second edge part the board and support panel arrangement are physically connected via the panel bridge, wherein the panel bridge comprises the groove for (physically) separating the board and the support panel arrangement along the groove, wherein the groove is configured recessed relative to the board outline.
  • two adjacently arranged boards in the board panel arrangement may be physically connected via a panel bridge, especially wherein the panel bridge comprises two grooves for (physically) separating the board from the (respective) support panel arrangement along the grooves, wherein one groove is configured recessed relative to the board outline of a first of the two adjacently arranged boards, and wherein one groove is configured recessed relative to the board outline of a second of the two adjacently arranged boards.
  • the board may comprise a printed circuit board
  • the board panel arrangement may further comprise a functional component functionally coupled to the board, especially wherein the board comprises a printed circuit board.
  • the functional component may comprise a solid state light source.
  • the term“functional component” may also refer to a plurality of (different) functional components.
  • a PCB may comprise an insulating layer arranged between a substrate and a conductive layer.
  • a printed circuit board may be any type of circuit board.
  • conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate (shortly indicated as“track” or“conductive track”).
  • An (electronic) component such as a solid stage light source, may generally be soldered onto the PCB to both electrically connect and mechanically fasten it to the PCB.
  • a basic PCB may consist of a flat sheet of insulating material and a layer of copper foil, laminated to the substrate. Chemical etching divides the copper into separate conducting lines called tracks or circuit traces, pads for connections, vias to pass connections between layers of copper, and features such as solid conductive areas for EM shielding or other purposes.
  • the tracks function as wires fixed in place, and are insulated from each other by air and the board substrate material.
  • the surface of a PCB may have a coating that protects the copper from corrosion and reduces the chances of solder shorts between traces or undesired electrical contact with stray bare wires. For its function in helping to prevent solder shorts, the coating is called solder resist.
  • the shape of a PCB may in general be plate-like.
  • the PCB may have a length and a width and a height, wherein an aspect ratio of the length and the height is at least 5, like in the range of 5-5000, like 10-2500, and wherein an aspect ratio of the width and the height is at least 2, such as an aspect ratio of at least 5, like in the range of 5-5000, like 10-2500.
  • the terms“length”,“width”, and“height” may also refer to“largest length”,“largest width”, and“largest height”, respectively.
  • the PCB may especially have a rectangular cross-section (such as a square cross-section).
  • the height (or thickness) of the PCB may in embodiments be selected from the range of 0.2-10 mm, such as 0.5-5 mm, like 1-2 mm.
  • the width of the PCB may in embodiments be selected from the range of 5-200 mm, such as 5-50 mm.
  • the length of a single printed circuit board area may in embodiments e.g. be selected from the range of 10-50 mm, such as 15-40 mm.
  • the length of the PCB, including a plurality of (connected) PCB areas may in embodiments e.g. be selected from the range of 20-2000 mm, such as 20-1500 mm. Other dimensions may be possible as well.
  • the functional component may comprise an electronic component, especially an electronic component selected from the group comprising a solid state light source, a driver, an electronic module, or a sensor.
  • the electronic component may comprise a solid state light source.
  • the invention may further provide the board after (physical) separation from the support panel arrangement.
  • the invention may further provide a functional unit comprising (i) a board and (ii) a functional component functionally coupled to the board.
  • the board may comprise a printed circuit board.
  • the board may comprise a board edge comprising board extremities, especially wherein the board extremities define a board outline of the printed circuit board.
  • the board may comprise a first face, especially the top board face, and a second face, especially the bottom board face.
  • the board edge may bridge the first face and the second face.
  • the board edge may comprise a first edge part and a second edge part, wherein the second edge part comprises a slanted plane configured non-perpendicular to the first face and the second face, especially wherein the second edge part is configured recessed relative to the board outline.
  • the functional component comprises an electronic component, especially an electronic component selected from the group comprising a solid state light source, a driver, an electronic module, or a sensor.
  • the electronic component may comprise a solid state light source.
  • the slanted plane may correspond to one of the legs of the groove, i.e., after (physical) separation of the board and the support panel arrangement, the board may comprise part of the groove, especially one leg of the V, and may comprise a rough edge along the second edge part.
  • the invention may further provide a method for providing a board panel arrangement and/or a board.
  • the invention may further provide a method of providing a board
  • the invention may further provide a method of providing a board panel arrangement.
  • the method may comprise providing a board panel arrangement comprising a support panel arrangement and a board, especially wherein the board comprises a board edge comprising board extremities.
  • the board extremities may define a board outline of the board.
  • the board edge may comprise a first edge part and a second edge part. Especially, over a first edge part the board may be configured separated from the board panel arrangement. Further especially, over a second edge part the board and the support panel arrangement may be physically connected via a panel bridge.
  • the method may further comprise generating a groove in the panel bridge, especially at a position in the panel bridge such that the groove is configured recessed relative to the board outline.
  • the groove may be (configured) for (physically) separating the board and the support panel arrangement along the groove.
  • the method may comprise milling the groove into the panel bridge. In further embodiments, the method may comprise milling the groove into the panel bridge by a point cutter.
  • the first edge part of the board configured separated from the board panel arrangement may be obtainable by milling a through hole in the support panel arrangement.
  • the method may comprise milling a through hole in the support panel arrangement to provide the first edge part of the board, i.e., to separate the board from the board panel arrangement at a first edge part.
  • the method may further comprise (physically) separating the board and the support panel arrangement along the groove. In further embodiments, the method may comprise (physically) separating the board and the support panel arrangement by breaking along the groove, especially by using a (dedicated) panel breaking machine. In further embodiments, the method may comprise (physically) separating the board and the support panel arrangement by cutting along the groove, especially by using a (dedicated) cutter.
  • the method may further comprise (providing) a functional component functionally coupled to the board, wherein the board comprises a printed circuit board.
  • the functional component may comprise an electronic component, especially an electronic component selected from the group comprising a solid state light source, a driver, an electronic module, or a sensor.
  • the electronic component may comprise a solid state light source.
  • the invention may provide a method of customizing a printed circuit board as described herein, wherein the method comprises breaking (or cutting) two adjacent boards, along the groove in between them, apart. This may be done by applying a force. For instance a torque may be applied. Alternatively or additionally, also a cutting means may be applied.
  • the invention provides a method of disconnecting a board, especially a PCB, from a support panel arrangement, especially from a board, more especially from a PCB (thus especially leading to at least two PCB parts).
  • the invention may further provide an electronic system, especially a lighting system, comprising the functional unit as described herein or obtainable according to the method described herein.
  • the electronic system may further comprise or be functionally coupled to a control system, especially a control system configured to control the electronic system, more especially a control system configured to control one or more parts of the electronic system.
  • the electronic system may comprise a lighting system comprising a luminaire, wherein the control system is configured to control the luminaire.
  • the electronic component may include an active or a passive electronic component.
  • An active electronic component may be any type of circuit component with the ability to electrically control electron flow (electricity controlling electricity). Examples thereof are diodes, especially light emitting diodes (LED). LEDs are herein also indicated with the more general term solid state lighting devices or solid state light sources.
  • the electronic component comprises an active electronic component.
  • the electronic component comprises a solid state light source.
  • active electronic components may include power sources, such as a battery, a piezo-electric device, an integrated circuit (IC), and a transistor.
  • the electronic component may include a passive electronic component. Components incapable of controlling current by means of another electrical signal are called passive devices. Resistors, capacitors, inductors, transformers, etc. can be considered passive devices. In an
  • the electronic component may include an RFID (Radio-frequency
  • a RFID chip may be passive or active.
  • the electronic component may include one or more of a solid state light source (such as a LED), a RFID chip, and an IC.
  • a solid state light source such as a LED
  • a RFID chip may be passive or active.
  • the electronic component may include one or more of a solid state light source (such as a LED), a RFID chip, and an IC.
  • the term“electronic component” may also refer to a plurality of alike or a plurality of different electronic components.
  • an embodiment describing the board panel arrangement with respect to the panel bridge may further relate to the method for providing a board.
  • an embodiment of the method for providing a board describing the board may further relate to the board as such.
  • the lighting system may be part of or may be applied in e.g. office lighting systems, household application systems, shop lighting systems, home lighting systems, accent lighting systems, spot lighting systems, theater lighting systems, fiber-optics application systems, projection systems, self-lit display systems, pixelated display systems, segmented display systems, warning sign systems, medical lighting application systems, indicator sign systems, decorative lighting systems, portable systems, automotive applications, (outdoor) road lighting systems, urban lighting systems, green house lighting systems, horticulture lighting, or LCD backlighting.
  • office lighting systems household application systems, shop lighting systems, home lighting systems, accent lighting systems, spot lighting systems, theater lighting systems, fiber-optics application systems, projection systems, self-lit display systems, pixelated display systems, segmented display systems, warning sign systems, medical lighting application systems, indicator sign systems, decorative lighting systems, portable systems, automotive applications, (outdoor) road lighting systems, urban lighting systems, green house lighting systems, horticulture lighting, or LCD backlighting.
  • the lighting system may be used as backlighting unit in an LCD display device.
  • the invention provides also a LCD display device comprising the lighting unit as defined herein, configured as backlighting unit.
  • the invention also provides in a further aspect a liquid crystal display device comprising a back lighting unit, wherein the back lighting unit comprises one or more lighting devices as defined herein.
  • the term“light source” may refer to a semiconductor light-emitting device, such as a light emitting diode (LEDs), a resonant cavity light emitting diode (RCLED), a vertical cavity laser diode (VCSELs), an edge emitting laser, etc..
  • the term“light source” may also refer to an organic light-emitting diode, such as a passive-matrix (P MOLED) or an active-matrix (AMOLED).
  • the light source comprises a solid state light source (such as a LED or laser diode).
  • the light source comprises a LED (light emitting diode).
  • the term LED may also refer to a plurality of LEDs.
  • the term“light source” may in embodiments also refer to a so-called chips-on-board (COB) light source.
  • COB chips-on-board
  • the term“COB” especially refers to LED chips in the form of a semiconductor chip that is neither encased nor connected but directly mounted onto a substrate, such as a PCB.
  • a substrate such as a PCB.
  • a plurality of semiconductor light sources may be configured on the same substrate.
  • a COB is a multi LED chip configured together as a single lighting module.
  • the term“light source” may also relate to a plurality of (essentially identical (or different)) light sources, such as 2-2000 solid state light sources.
  • the light source may comprise one or more micro-optical elements (array of micro lenses) downstream of a single solid state light source, such as a LED, or downstream of a plurality of solid state light sources (i.e. e.g. shared by multiple LEDs).
  • the light source may comprise a LED with on-chip optics.
  • the light source comprises a pixelated single LEDs (with or without optics) (offering in embodiments on-chip beam steering).
  • “visible”,“visible light” or“visible emission” and similar terms refer to light having one or more wavelengths in the range of about 380-780 nm.
  • controlling and similar terms especially refer at least to determining the behavior or supervising the running of an element. Hence, herein “controlling” and similar terms may e.g. refer to imposing behavior to the element
  • control system may also be indicated as“controller”.
  • the control system and the element may thus at least temporarily, or permanently, functionally be coupled.
  • the element may comprise the control system.
  • the control system and element may not be physically coupled. Control can be done via wired and/or wireless control.
  • the term“control system” may also refer to a plurality of different control systems, which especially are functionally coupled, and of which e.g. one control system may be a master control system and one or more others may be slave control systems.
  • a control system may comprise or may be functionally coupled to a user interface.
  • the system, or apparatus, or device may execute an action in a“mode” or “operation mode” or“mode of operation”. Likewise, in a method an action or stage, or step may be executed in a“mode” or“operation mode” or“mode of operation”.
  • the term“mode” may also be indicated as“controlling mode”. This does not exclude that the system, or apparatus, or device may also be adapted for providing another controlling mode, or a plurality of other controlling modes. Likewise, this may not exclude that before executing the mode and/or after executing the mode one or more other modes may be executed.
  • a control system may be available, that is adapted to provide at least the controlling mode.
  • the choice of such modes may especially be executed via a user interface, though other options, like executing a mode in dependence of a sensor signal or a (time) scheme, may also be possible.
  • the operation mode may in embodiments also refer to a system, or apparatus, or device, that can only operate in a single operation mode (i.e.“on”, without further tunability).
  • control system may control in dependence of one or more of an input signal of a user interface, a sensor signal (of a sensor), and a timer.
  • timer may refer to a clock and/or a predetermined time scheme.
  • Fig. 1A schematically depicts a single board as may be known in the prior art
  • Fig. IB schematically depicts an embodiment of the board panel arrangement 1 and an embodiment of the method
  • Fig. 2 schematically depicts an embodiment of the panel bridge 102
  • Fig. 3 schematically depicts an embodiment of the board panel arrangement 1, an embodiment of the method and an embodiment of the functional unit 2;
  • Fig. 4 schematically depicts an embodiment of the electronic system 5.
  • Fig. 5A and B schematically depict embodiments of the board panel arrangement 1 and an embodiment of the method.
  • Fig. 6A and B schematically depict embodiments of the board panel arrangement 1 and an embodiment of the method.
  • Fig. 7A and B schematically depict embodiments of the board panel arrangement 1 and an embodiment of the method.
  • Fig. 1 A schematically depicts a single board as may be known in the prior art.
  • the single board comprises a board 200 detachably integrated in a support panel arrangement 100 comprising a support panel 101.
  • the board 200 and the support panel arrangement 100 are physically connected via a panel bridge 102.
  • a groove 105 is applied over the whole width of the board and the support panel 101.
  • the right side of Fig. 1A schematically depicts the situation after (physical) separation of the board 200 from the support panel arrangement 100:
  • the board edge comprises a left-over rough edge 239where the groove 105 used to be, which partially defines the board edge 230 and the board outline 236.
  • Fig. IB schematically depicts an embodiment of the board panel arrangement 1 according to the invention.
  • the board panel arrangement 1 comprises a support panel arrangement 100 and a board 200 detachably integrated in the support panel arrangement 100.
  • the support panel arrangement 100 comprises a support panel 101.
  • the board 200 comprises a board edge 230 comprising board extremities 235, wherein the board extremities
  • the board outline 235 define a board outline 236 of the board 200.
  • the board outline For visualization purposes, the board outline
  • the board 200 is configured (physically) separated from the support panel arrangement 100.
  • the board 200 is configured separated from the support panel arrangement 100 by a gas, such as by air.
  • a second edge part 232 the board 200 and the support panel arrangement 100 are physically connected via a panel bridge 102.
  • the panel bridge 102 comprises a groove 105 for (physically) separating the board 200 and the support panel 100 along the groove 105, especially wherein the groove 105 is configured recessed relative to the board outline 236.
  • the board edge 230 is indented near the panel bridge 102, such that the groove may be arranged recessed relative to the board outline 236.
  • the board 200 comprises a (slit) indentation 1232 arranged adjacent to the panel bridge 102, especially wherein the (slit) indentation 1232 stretches along the board height 200, i.e. the indentation may comprise a through hole 1231.
  • the board 200 may comprise (at least) two indentations 1232, wherein the (at least) two indentations 1232 are arranged on either side of the panel bridge 102.
  • the indentations 1232 may especially be (arranged) in line with the groove 105, especially along a straight line defined by the groove 105 as in the depicted embodiment.
  • the board 200 is physically connected to the support panel arrangement 100 via a panel bridge 102, wherein the panel bridge 102 is arranged between two indentations 1232, and especially wherein the groove 105 runs between the two indentations 1232.
  • the indentation 1232 may especially connect to a (elongated) through hole 1231 in the support panel arrangement 100.
  • the indentation 1232 is elongated along a direction perpendicular to the board height h4, especially perpendicular to the side face of the board 200 physically connected to the support panel arrangement 100 via the panel bridge 102.
  • the board 200 comprises a first face 201, especially a top board face, and a second face 202, especially a bottom board face, especially wherein the board edge 230 bridges the first face 201 and the second face 202.
  • the right side of Fig. IB schematically depicts the situation after (physical) separation of the board 200 from the support panel arrangement 100:
  • the board edge comprises a left-over rough edge 239 where the groove 105 used to be. However, all the board extremities 235 are located outside of the rough edge 239. Hence, although the rough edge 239 contributes to defining the board edge 230, the rough edge 239 does not contribute to defining the board outline 236.
  • the groove is arranged along a straight line.
  • the groove 105 may have a groove length LI of at least 3 mm, such as at least 5 mm, especially at least 10 mm, such as at least 15 mm, especially at least 25 mm.
  • the groove length LI of the groove may be approximately the same as the length of the second edge part.
  • the panel bridge 102 has a constant width (parallel to the groove) about equal to the groove length LI. In further embodiments, the width of the panel bridge 102 may also vary over the length of the panel bridge 102.
  • the board 200 has a board height hi
  • the board panel arrangement 1 has an arrangement height I13.
  • the board height I14 and the arrangement height I13 may be about equal.
  • Fig. IB further depicts an embodiment of the method of providing a board 200, the method comprising: - providing a board panel arrangement 1 comprising a support panel arrangement 100 and a board 200, wherein the board 200 comprises a board edge 230 comprising board extremities 235, wherein the board extremities 235 define a board outline 236 of the board 200, wherein over a first edge part 231 the board 200 is configured
  • the method may further comprise (physically) separating the board 200 and the support panel arrangement 100 along the groove 105, especially by breaking and/or cutting along the groove 105, as represented by the arrow between the left side and the right side of Fig. IB.
  • the method may comprise milling the groove 105 into the panel bridge 102. In further embodiments, the method may comprise milling the groove 105 into the panel bridge 102 by a point cutter.
  • the first edge part 231 of the board 200 configured separated from the support panel arrangement 100 is obtainable by milling a (slit) through hole 1231 in the support panel arrangement 100.
  • the method may comprise milling a (slit) through hole 1231 in the support panel arrangement 100 to provide the first edge part 231 of the board 200.
  • Fig. 2 schematically depicts a side view of an embodiment of the panel bridge 102.
  • the panel bridge 102 comprises a groove 105, especially a V-groove.
  • the groove comprises a top cut 108, especially a top V-shaped cut, and a bottom cut 109, especially a bottom V-shaped cut.
  • Each of the top (V-shaped) cut 108 and the bottom (V-shaped) cut 109 comprises a respective groove bottom 106.
  • the top (V-shaped) cut 108 has the legs of the V arranged at an angle on
  • the bottom (V-shaped) cut 109 has the legs of the V arranged at an angle on. In the depicted embodiment, on is about equal to on.
  • the two (V-shaped) cuts may have about the same groove depth (The depth of the groove bottom relative to the top (or bottom) face of the panel bridge 102.
  • either groove depth may be larger than the other.
  • the groove bottom 106 may be at least 0.2 mm recessed relative to the board outline 236.
  • the panel bridge 102 has a first (maximal) height hi, and the panel bridge 102 has a smallest second height h2 at the groove 105.
  • i hi may be about 0.33.
  • the groove comprises a first cut or top cut 108 and a second cut or bottom cut 109, and h2 may (essentially) be the first height hi minus the depth of the depth of the top cut 108 and minus the depth of the bottom cut 109.
  • the depth of the top cut 108 may be about 0.33*hi.
  • the depth of the bottom cut 109 may be about 0.33*hi.
  • the board 200 may comprise a slanted plane 238.
  • the board 200 comprises a first face 201, especially a top board face, and a second face 202, especially a bottom board face, especially wherein the board edge 230 bridges the first face 201 and the second face 202.
  • the second edge part 232 comprises a slanted plane 238 configured non-perpendicular to the first face 201 and the second face 202.
  • the slanted plane 238 may essentially be a left-over from the groove 105 after (physical) separation.
  • the second edge part 232 may comprise a rough edge 239, especially arranged above and/or below where the groove bottom 106 of the groove 105 used to be.
  • the panel bridge 102 comprised a groove 105 comprising a top (V-shaped) cut 108 and a bottom (V-shaped) cut 109, and the rough edge is arranged below where the groove bottom 106 of the top (V-shaped) cut 108 used to be and above where the groove bottom 106 of the bottom (V-shaped) cut 109 used to be.
  • the panel bridge 102 comprises part of the support panel arrangement 100 and part of the board 200. Essentially, the panel bridge 102 comprises a physical connection between the board 200 and the support panel arrangement 100, especially wherein the groove 105 (or the groove bottomO 106) indicates the border between the board 200 and the support panel arrangement 100.
  • Fig. 3 schematically depicts an embodiment of the board panel arrangement 1 comprising a plurality of boards 200, each detachably integrated in the (respective) support panel arrangement 100.
  • a first support panel arrangementlOOa for a first board200a may comprise the support panel 101, and the other boards200b,200c,200d.
  • a second support panel arrangement (not indicated with a reference number for visualization purposes) for a second board 200b may comprise the support panel 101, the first board 200a, and the remainder of the other boards 200c, 200d.
  • the panel bridge 102 comprises the groove 105 for (physically) separating the board 200 and the support panel arrangement 100 by breaking along the groove 105, wherein the groove 105 is configured recessed relative to the board outline 236.
  • first edge parts 231 the board 200 is configured separated from the support panel arrangement 100, and over n second edge parts 232 the board 200 and the support panel arrangement 100 are physically connected via a panel bridge 102, wherein n>2, and wherein the first edge parts 231 and second edge parts 232 are configured altematingly.
  • the board(s) 200 has 4 first edge parts
  • the panel bridges 102 located between two adjacent boards 200 comprise two grooves 105, one of which is configured recessed relative to the board outline 236 of one of the two adjacent boards 200, and the other of which is configured recessed relative to the board outline 236 of the other of the two adjacent boards 200.
  • the board panel arrangement 1 further comprises a functional component 300 functionally coupled to the board 200, wherein the board 200 comprises a printed circuit board (PCB) 310.
  • the functional component 300 may comprise an electronic component. More especially, the functional component may comprise a solid state light source.
  • Fig. 3 further schematically depicts an embodiment of the method according to the invention, wherein the method further comprises a functional component 300 functionally coupled to the board 200, wherein the board 200 comprises a printed circuit board 310.
  • the functional component 310 may comprise a solid state light source.
  • the method may comprise providing, especially arranging, a functional component 300 functionally coupled to the board.
  • the functional unit 2 may comprise (i) a board 200 and (ii) a functional component 300 functionally coupled to the board 200.
  • the board 200 may comprise a printed circuit board 310.
  • the board 200 may comprise a board edge 230 comprising board extremities 235, especially wherein the board extremities 235 define an board outline 236 of the printed circuit board 310, especially wherein the board
  • the 200 comprises a first face 201 and a second face 202, especially wherein the board edge 230 bridges the first face 201 and the second face 202, especially wherein the board edge 230 comprises a first edge part 231 and a second edge part 232, especially wherein the second edge part 232 comprises a slanted plane 238 configured non-perpendicular to the first face
  • the functional component 300 may comprise an electronic component, especially a solid state light source.
  • the groove 105 is configured recessed relative to the board outline 236.
  • the groove 105, especially the groove bottom 106 may be at least 0.1 mm recessed relative to the board outline 236, i.e., in embodiments, a third distance L3 between the board outline 236 and the groove 105, especially the groove bottom 106, may be at least 0.1 mm, such as at least 0.15 mm, especially at least 0.2 mm, such as at least 0.25 mm, especially at least 0.3 mm, such as at least 0.45 mm, especially at least 0.55 mm, such as at least 0.6 mm, especially at least 0.65 mm, such as at least 0.8 mm, especially at least 1 mm, such as at least 2 mm, especially at least 4 mm.
  • the third distance L3 between the board outline 236 and the groove 105, especially the groove bottom 106 may be at most 20 mm.
  • each of the boards 200 has a board outline 236 approximating a cuboid, or as depicted, has an in-plane board outline 236 approximating a square.
  • each of the boards 200 may have a top board face, a bottom board face, and four board side faces.
  • Fig. 4 schematically depicts an embodiment of the electronic system 5 according to the invention.
  • the electronic system 5 may comprise the functional unit 2.
  • the electronic system 5 comprises a luminaire 7 comprising the functional unit 2 comprising a functional component 300.
  • the functional unit 2 may be functionally coupled to a light source 10, especially a solid state light source.
  • the light source 10 provides light source light 11.
  • the electronic system 5 may further comprise a control system 6 configured to control the electronic system 5.
  • the control system 6 may especially be configured to control the luminaire 7.
  • Fig. 5A and B schematically depict embodiments of the board panel arrangement 1 and an embodiment of the method.
  • the groove 105 is configured recessed relative to a recess opening 1001.
  • the recess opening 1001 has a recess opening length L4.
  • the recess opening length L4 may be in the range from 1 to 8 mm. More preferably, the recess opening length L4 is in the range from 2 to 7 mm. Most preferably, the recess opening length L4 is in the range from 3 to 6 mm. The obtained effect is improved safety.
  • the recess opening length L4 may be defined as the (minimum) length between two neighboring first edge parts 231 measured at the board outline 236.
  • the recess opening 1001 is located between the two neighboring first edge parts 231.
  • a third distance L3 between the board outline 236 and the groove 105 is preferably at least 0.5 times the recess opening length L4. More preferably, the third distance L3 between the board outline 236 and the groove 105 is preferably at least 0.7 times the recess opening length L4.
  • the third distance L3 between the board outline 236 and the groove 105 is preferably at least 0.9 times the recess opening length L4.
  • the obtained effect is further improved safety.
  • the reason is that such a configuration allows that a (adult) person cannot touch the left-over rough / sharp edge and/or further reduces the chance that a (adult) person touches the left-over rough / sharp edge e.g. during assembly / usage of the board.
  • the groove length LI may be larger than the recess opening length L4.
  • the groove length LI may be smaller than the recess opening length L4.
  • the groove 105 has a groove length LI, wherein the groove 105 is configured recessed relative to a recess opening 1001, the recess opening 1001 has a recess opening length L4, wherein the groove length LI is in a range from 0.7 to 1 times the recess opening length L4. More preferably, the groove length LI is in a range from 0.8 to 1 times the recess opening length L4. Most preferably, the groove length LI is in a range from 0.85 to 1 times the recess opening length L4.
  • Fig. 6A and B schematically depict embodiments of the board panel arrangement 1 and an embodiment of the method.
  • the groove 105 has a groove length LI, wherein the groove 105 is configured recessed relative to a recess opening 1001, the recess opening 1001 having a recess opening length L4, wherein the groove length LI is larger than the recess opening length L4.
  • the obtained effect is even further improved safety and a better mechanical connection of the board to the support panel arrangement.
  • Fig. 7A and B schematically depict embodiments of the board panel arrangement 1 and an embodiment of the method.
  • the board 200 comprises an electrically conductive board track 1002 being electrically connected to the solid state light source.
  • the support panel arrangement 100 comprises an electrically conductive support panel arrangement track 1003.
  • the electrically conductive board track 1002 and electrically conductive support panel arrangement track 1003 are electrically connected when the board 100 is mechanically connected to the support panel arrangement 100.
  • the terms“substantially” or“essentially” herein, and similar terms, will be understood by the person skilled in the art.
  • the terms“substantially” or“essentially” may also include embodiments with“entirely”,“completely”,“ah”, etc. Hence, in embodiments the adjective substantially or essentially may also be removed.
  • the term “substantially” or the term“essentially” may also relate to 90% or higher, such as 95% or higher, especially 99% or higher, even more especially 99.5% or higher, including 100%.
  • the term“and/or” especially relates to one or more of the items mentioned before and after“and/or”.
  • a phrase“item 1 and/or item 2” and similar phrases may relate to one or more of item 1 and item 2.
  • the term “comprising” may in an embodiment refer to "consisting of but may in another embodiment also refer to "containing at least the defined species and optionally one or more other species”.
  • the invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer.
  • a device claim, or an apparatus claim, or a system claim enumerating several means, several of these means may be embodied by one and the same item of hardware.
  • the mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
  • the invention also provides a control system that may control the device, apparatus, or system, or that may execute the herein described method or process. Yet further, the invention also provides a computer program product, when running on a computer which is functionally coupled to or comprised by the device, apparatus, or system, controls one or more controllable elements of such device, apparatus, or system.
  • the invention further applies to a device, apparatus, or system comprising one or more of the characterizing features described in the description and/or shown in the attached drawings.
  • the invention further pertains to a method or process comprising one or more of the characterizing features described in the description and/or shown in the attached drawings.

Abstract

The invention provides a board panel arrangement (1) comprising a support panel arrangement (100) and a board (200) detachably integrated in the support panel arrangement (100), wherein the board (200) comprises a board edge (230) comprising board extremities (235), wherein the board extremities (235) define a board outline (236) of the board (200), wherein over a first edge part (231) the board (200) is configured separated from the support panel arrangement (100), and wherein over a second edge part (232) the board (200) and the support panel arrangement (100) are physically connected via a panel bridge (102), wherein the panel bridge (102) comprises a groove (105) for separating the board (200) and the support panel (100) along the groove (105), wherein the groove (105) is configured recessed relative to the board outline (236). The board panel arrangement (1) further comprises a functional component (300) functionally coupled to the board (200), wherein the board (200) comprises a printed circuit board (310) and wherein the functional component (300) comprises a solid state light source.

Description

TOLERANCE REDUCTION FOR V-CUT
FIELD OF THE INVENTION
The invention relates to a board panel arrangement comprising a (printed circuit) board and to a functional unit comprising such board, as well as to a lighting system comprising such board. The invention also relates to a method for providing a board.
BACKGROUND OF THE INVENTION
Printed circuit boards with electrical components are known in the art.
US20110255250A1, for instance, describes that electronic devices such as computers, cellular telephones, and other devices typically contain printed circuit boards. Electrical components such as integrated circuits, switches, buttons, input-output port connectors, resistors, capacitors, inductors, and other discrete components may be mounted to a printed circuit board. Rigid printed circuit boards may be formed from materials such as fiberglass- filled epoxy. In typical manufacturing environments, printed circuit boards are cut from large panels of printed circuit board material. Break out tabs may be used to secure the boards during processing. After processing is complete, the tabs may be broken to release the boards from the panel. Portions of the boards where the tabs are broken generally exhibit rough edges.
US 2004 / 245012 A1 discloses a set of printed circuit boards which consists of a main board with at least one fragment intended for replacement and at least one replacement board, wherein said main board has openings in the dielectric layer placed along the edge line of the fragment intended for replacement, and between the openings there are bridges, and at least one of said bridges has an electric conductor thereon, and the replacement board has electric conductors in places matching the placement of the electric conductors of said bridges of the main board.
JP S63 70489 A discloses a method of manufacturing a plurality of metal base printed wiring boards. A metal base printed wiring board is punched such that a plurality of metal base printed wiring boards are obtained which are connected to a support lead via support lead pieces. The support lead pieces can be cut to obtain a plurality of individual metal base printed wiring boards. US 2012 / 056210 A1 discloses a light emitting apparatus capable of increasing the number of substrates formed from one multi-surface pattern substrate and capable of reducing the manufacturing cost. The light emitting apparatus includes a belt-like substrate, a light emitting element mounted on the substrate, and a luminous flux control member mounted on the substrate. The substrate has a pair of fracture surfaces formed at predetermined intervals along a lengthwise direction and formed at both ends in a widthwise direction between luminous flux control members neighboring each other along the lengthwise direction, wherein dimensions W1 and W2 in the widthwise direction between the pair of fracture surfaces are less than a dimension in the widthwise direction of the luminous flux control member, and the dimension W2 in the widthwise direction of a part overlapping the luminous flux control member in a plan view is less than the dimension W1 in the widthwise direction between the pair of fracture surfaces.
US 2006 / 276058 discloses a method and apparatus for attenuating flexible circuit resonance. The apparatus includes a flexible circuit assembly. The flexible circuit assembly has a flexible circuit having a flexible cable with first and second sides. The flexible circuit assembly also includes a circuit support. The circuit support includes a base having top and bottom surfaces. The bottom surface is attached to the first side of the flexible cable. The circuit support also includes a support wall extending substantially
perpendicularly relative to the top surface of the base. The support wall has a first face, which is substantially oriented towards the top surface of the base. The first side of the flexible cable is attached to the first face and also faces a second face of the support wall to thereby reverse a direction in which the flexible cable faces.
SUMMARY OF THE INVENTION
Printed circuit boards (PCBs) may generally be built as part of a multi board (also:“(full) panel” or“array” or“board panel arrangement”) comprising a plurality of PCBs. The PCBs may be integrated in a support panel (an outer layer). The multi board may be generally configured such that the PCBs are detachable, i.e., a PCBs may be separable from an adjacent PCB, and a PCB may be separable from a support panel.
Multiple methods for PCB detachment may be known in the prior art. One of these methods may be“V -groove” (also: V-score) panelization. V-groove panelization may comprise providing a V-cut (also“V-shaped edge” or“V-groove”) on the multi board along the outer edge of a PCB, i.e., between two PCBs, or between a PCB and a support panel. Especially, V-groove panelization may comprise providing a V-cut along the outer edge of a PCB both on the top side and on the bottom side of the multi board. The V-cut may be provided such that the multi panel remains mechanically stable, for example, a sufficient height of the multi board may be left between the top side and the bottom side edge). The V- cut may be provided such that a PCB may be detached (also:“depaneled”) at the V-cut, especially broken out, or especially cut out, for example by using a“pizza cutter” machine.
After detachment of a PCB from the multi board at a V-cut, the PCB may comprise a rough edge where the V-cut used to be. In particular, the rough edge, a left-over from breaking/cutting, may have an inconsistent size for PCBs provided via the same method, even for otherwise identical PCBs. Hence, the downstream process may be restricted by a required tolerance due to dimensional inconsistencies of the PCBs, i.e., the current method of breaking (or cutting) a multi board with a V-cut may result in (the need for) a high dimensional tolerance, such as a dimensional tolerance of about 0.6 mm.
However, some processes may benefit from, or even demand, a tighter dimensional tolerance. For example, some processes may require a dimensional tolerance of about 0.3 mm, such as about 0.2 mm, especially about 0.1 mm.
Further, the rough edge at the outline of a prior art PCB may hinder tightly arranging the PCB in an application, such as in a (compact) luminaire.
Hence, it is an aspect of the invention to provide an alternative board panel arrangement, which preferably further at least partly obviates one or more of above-described drawbacks. The present invention may have as object to overcome or ameliorate at least one of the disadvantages of the prior art, or to provide a useful alternative.
Hence, in a first aspect, the invention may provide a board panel arrangement comprising a support panel arrangement and a board detachably integrated in the support panel arrangement. The board may comprise a board edge comprising board extremities. The board extremities may define a board outline of the board. In embodiments, the board edge may comprise a first edge part and a second edge part. Especially, over the first edge part the board may be configured separated from the support panel arrangement. Further especially, over the second edge part the board and the support panel arrangement may be physically connected via a panel bridge. The panel bridge may comprise a groove for (physically) separating the board and the support panel arrangement along the groove, especially by breaking and/or cutting along the groove. Especially, the groove may be configured recessed relative to the board outline.
The board panel (lighting) arrangement according to the invention may provide the benefit that the groove is arranged within the board outline of the board. Hence, the (single) board (which can be used in lamp or a luminaire) may have a straight and accurate board outline (after (physical) separation from the support panel arrangement), which may be beneficial for further applications (e.g. better fit in the application) /processes. Thereby, the invention may provide a solution to reduce the (need for) (dimensional) tolerance for boards provided via grooves in a board panel arrangement. The invention may be beneficial in any application where a manufacturing process comprises (physical) separation of a board from a support panel arrangement, such as for a manufacturing process involving multi board PCBs, for example for drivers, led modules, electronic modules, sensors, etc.
The board panel arrangement may comprise a support panel arrangement and a board. In embodiments, the board panel arrangement may have a plate-like shape, i.e., the board panel arrangement may have an arrangement width and an arrangement length substantially larger than an arrangement height 1¾.
Similarly, in further embodiments, the board may have a plate-like shape, i.e., the board may have a board width, especially a board width parallel to the arrangement width, and a board length, especially a board length parallel to the arrangement length, substantially larger than a board height l , especially a board height l parallel to the arrangement height 1¾. In further embodiments, the board height lu may be about equal to the arrangement height 1¾. In specific embodiments, the board may have a board height l selected from the range of 0.25 to 6 mm, such as selected from the range of 0.5 to 3 mm. In further specific embodiments, the board may have a board height lu selected from the group consisting of 1 mm and 1.6 mm, especially 1 mm, or especially 1.6 mm.
In further embodiments, the board may have a top board face and a (parallel) bottom board face separated by the board height lu, and a plurality of board side faces (essentially) perpendicular to the top board face and to the bottom board face. In further embodiments, the board may have a cross-section, especially a cross-section perpendicular to the top (bottom) board face, approximating a rectangular shape.
Herein, the term“in a plane” and similar terms, refer(s) to a cross-sectional plane perpendicular to the (arrangement or board) height, and in general parallel to a bottom face and parallel to a top face of the board, and in general perpendicular to one or more edges of the board. The bottom board face and top board face may define the board height.
Electronic components (see further below) may not be included in the height; the phrase “board height” and similar phrases refer to the height of the board, especially of the PCB, only. Especially, the board panel arrangement may comprise a board detachably integrated in a support panel arrangement. The phrase“the board integrated in the support panel arrangement” may herein refer to the support panel arrangement (at least partially) surrounding the board, especially (at least partially) surrounding the board along the board side faces. Hence, the board may be arranged within the confines of the support panel arrangement.
In embodiments, the board panel arrangement may comprise a plurality of boards, especially a plurality of boards arranged in a (2D) grid along the arrangement width and the arrangement length of the board panel arrangement. Each of the plurality of boards may be detachably integrated in a (respective) support panel arrangement. The (respective) support panel arrangement may comprise one or more other boards of the plurality of boards. Hence, in embodiments, the board panel arrangement may comprise a board and a
(respective) support panel arrangement, wherein the (respective) support panel arrangement comprises the remainder of the board panel arrangement (except for the (respective) board). Hence, the support panel arrangement may comprise one or more boards. Essentially, the support panel arrangement may comprise the remainder of the board panel arrangement with respect to the (to be detached) board.
In further embodiments, the support panel arrangement may comprise a support panel, i.e., a section of the board panel arrangement not comprised by any one of the plurality of boards. Hence, the support panel arrangement may comprise a (dedicated) support panel and one or more boards. In specific embodiments, the support panel may comprise the outer edge of the board panel arrangement, i.e., the support panel may have a frame-like shape, especially comprising the border of the board panel arrangement along the board sides.
The board may comprise a board edge comprising board extremities. The board edge may (essentially) be parallel with the board height, i.e., the board edge may run along the side faces. The board edge may further run along one or more grooves. The board extremities may comprise all points that are the farthest in one or more directions, especially with respect for the values in the remaining directions. For example, in embodiments, the board may resemble a cuboid, especially a plate, and the extremities comprise the comers of the cuboid.
In embodiments, the board extremities may define a board outline of the board. Especially, the board outline may be defined by the set of straight lines spanning between the board extremities without passing through the board. In further embodiments, the board outline may comprise the convex hull of the board.
For example, a +-shaped board may have a +-shaped board edge and a ¨- shaped outline. In general, however, the board may have a shape approximating a cuboid, and the board outline may comprise a cuboid.
The outline may be defined by outline edges which are parallel to the height of the board height or the board panel arrangement height.
In embodiments, the plurality of board side faces may especially be side faces of the board outline. Hence, in specific embodiments, the board may have a shape approximating a cuboid, such as approximating a plate, and may have a board outline having a shape of a cuboid, wherein the board has four side faces matching the cuboid defined by the board outline.
In embodiments, the board may comprise a rigid board or a semi-rigid board, especially a rigid board. In other embodiments, the board may comprise a semi-rigid board. This may apply to all boards in the board panel arrangement.
In embodiments, the board may comprise a metal, especially a metal selected from the group comprising copper aluminum, tin, iron, silver and lead, more especially a metal selected from the group comprising copper and aluminum.
In further embodiments, the board may have a thermal conductivity of at least 200 W/(m*K), especially at least 250 W/(m*K), such as at least 300 W/(m*K).
In specific embodiments, the board may comprise a printed circuit board. Especially, the board may comprise one or more of a CEM-1 PCE, a CEM-3 PCE, a FR-1 PCE, a FR-2 PCB, a FR-3 PCB, a FR-4 PCB, and aluminum metal core PCB, especially one or more of a CEM-1 PCB, a CEM-3 PCB, a FR-1 PCB, and a FR4 PCB and an aluminum metal core PCB, more especially one or more of a CEM-1 PCB, a CEM-3 PCB, a FR-1 PCB.
In embodiments, the board edge may comprise a first edge part and a second edge part. Especially, over the first edge part the board may be configured (physically) separated from the support panel arrangement, especially separated by gas, such as by air.
The physical separation may e.g. be an elongated (slit) through hole, of e.g. at least a 1 mm width.
Further especially, over the second edge part the board and the support panel arrangement may be physically connected via a panel bridge. Hence, the board and the support panel arrangement may be configured (physically) separated except for the panel bridge, similarly as to how two opposite shores along a river may be separated except for a connecting bridge. The phrase“a panel bridge” may refer to one or more panel bridges.
In further embodiments, the panel bridge may comprise a groove. The groove may be configured for (physically) separating the board and the support panel arrangement along the groove. The term“groove” may also refer to a plurality of grooves, especially a plurality of grooves arranged on a (single) panel bridge.
In further embodiments, the groove may comprise a V-groove, a U-groove, or any other groove shape suitable for separating the board and the support panel arrangement at the groove. In further embodiments, the groove may comprise a V-groove or a U-groove, especially a V-groove, or especially a U-groove. Especially, the groove is not a through hole, whereby a physical connection between the board and the support panel arrangement is maintained (until separation of the board from the support panel arrangement).
In further embodiments, the groove may comprise a cut into the panel bridge, especially a top cut into the top face (or:“top side”) of the panel bridge or a bottom cut into the bottom face (or:“bottom side”) of the panel bridge (essentially parallel to the top board side and the bottom board side). Hence, in further embodiments, the groove may comprise a single cut, especially a single top cut, or especially a single bottom cut.
In further embodiments, the cut may comprise a V-shaped cut or a U-shaped cut, or any other cut shape suitable for separating the board and the support panel arrangement at the groove. Especially, the cut may comprise a V-shaped cut or a U-shaped cut, especially a V-shaped cut, or especially a U-shaped cut. In further embodiments, the top cut may a V-shaped cut or a U-shaped cut, especially a V-shaped cut, or especially a U- shaped cut. In further embodiments, the bottom cut may a V-shaped cut or a U-shaped cut, especially a V-shaped cut, or especially a U-shaped cut.
In further embodiments, the groove may comprise groove a top (V-shaped) cut into the top face (or:“top side”) of the panel bridge and a bottom (V-shaped) cut into the bottom face (or:“bottom side”) of the panel bridge (essentially parallel to the top board side and the bottom board side). In embodiments, the top (V-shaped) cut and the bottom (V- shaped) cut may essentially be mirror-imaged. However, in further embodiments the top (V- shaped) cut and the bottom (V-shaped) cut may be different, such as arranged at a different angle (see further below) or with a different depth (also see further below). In general, however, the groove bottom (deepest point) of the top (V-shaped) cut and the groove bottom of the bottom (V-shaped) cut may be essentially parallel, especially the groove bottom of the top (V-shaped) cut may be arranged directly above the groove bottom of the bottom (V- shaped) cut. The groove may provide a relatively weak point in the panel bridge such that the board and the support panel arrangement may be (physically) separated at the groove, especially along the groove. In general, the groove may comprise a top (V-shaped) cut and a bottom (V-shaped) cut. However, in embodiments, the groove may also comprise a single (V-shaped) cut, such as especially only a top (V-shaped) cut, or especially only a bottom (V- shaped) cut. For instance, by applying a torque to the board relative to the support panel arrangement, the board may be broken away.
In embodiments, the groove may comprise a (V-shaped) cut arranged at an angle (between the legs of the V) selected from the range of 5° - 150°, especially from the range of 10° - 120°, such as from the range of 20° - 90°, especially from the range of 30° - 60°. In further embodiments, the groove may comprise a top (V-shaped) cut and a bottom (V- shaped) cut, each arranged at an angle (between the legs of the V) independently selected from the range of 5° - 150°, especially from the range of 10° - 120°, such as from the range of 20° - 90°, especially from the range of 30° - 60°, more especially wherein the angle of the top (V-shaped) cut is (about) equal to the angle of the bottom (V-shaped) cut.
In further embodiments, the groove is configured recessed relative to a recess opening. The recess opening may have a recess opening length in the range from 1 to 8 mm. More preferably, the recess opening length is in the range from 2 to 7 mm. Most preferably, the recess opening length is in the range from 3 to 6 mm. The obtained effect is improved safety. The reason is that such a configuration allows that a (adult) person cannot touch the left-over rough / sharp edge and/or reduces the chance that a (adult) person touches the left over rough / sharp edge e.g. during assembly / usage of the board. The recess opening length may be defined as the (minimum) length between two neighboring first edge parts measured at the board outline. The recess opening is located between the two neighboring first edge parts. A third distance between the board outline and the groove is preferably at least 0.5 times the recess opening length. More preferably, the third distance between the board outline and the groove is preferably at least 0.7 times the recess opening length. Most preferably, the third distance between the board outline and the groove is preferably at least 0.9 times the recess opening length. The obtained effect is further improved safety. The reason is that such a configuration allows that a (adult) person cannot touch the left-over rough / sharp edge and/or further reduces the chance that a (adult) person touches the left over rough / sharp edge e.g. during assembly / usage of the board. The groove length may be larger than the recess opening length. The groove length may be smaller than the recess opening length. In further embodiments, the groove has a groove length, wherein the groove is configured recessed relative to a recess opening, the recess opening has a recess opening length, wherein the groove length is in a range from 0.7 to 1 times the recess opening length. More preferably, the groove length is in a range from 0.8 to 1 times the recess opening length. Most preferably, the groove length is in a range from 0.85 to 1 times the recess opening length. The obtained effect is improved mechanical integrity / stability. The recess opening length may be defined as the (minimum) length between two neighboring first edge parts measured at the board outline.
In further embodiments, the groove has a groove length, wherein the groove is configured recessed relative to a recess opening, the recess opening having a recess opening length, wherein the groove length is larger than the recess opening length. The obtained effect is even further improved safety and a better mechanical connection of the board to the support panel arrangement. The recess opening length may be defined as the (minimum) length between two neighboring first edge parts measured at the board outline.
In further embodiments, the board comprises an electrically conductive board track which is electrically connected to the solid state light source. The support panel arrangement comprises an electrically conductive support panel arrangement track. The electrically conductive board track and electrically conductive support panel arrangement track are electrically connected when the board is mechanically connected to the support panel arrangement. The board panel arranged preferably comprises a plurality of boards. The plurality of boards may have an electrically conductive board track. The electrically conductive board tracks of a plurality of boards may be connected to the electrically conductive support panel arrangement track. The obtained effect is improved testing. The reason is that testing of the functional component(s) / solid state light source(s) (on a plurality of boards) may be done via the electrically conductive support panel arrangement track. For this purpose, e.g. the groove may only be arranged bottom side of the PCB.
In further embodiments, the board comprises at least two indentations, wherein the at least two indentations are arranged on either side of the panel bridge.
In further embodiments, the indentations comprise a (slit) through hole and/or slit (indentations).
In further embodiments, the panel bridge may have a first height hi (parallel to the arrangement height), especially wherein the first height hi is the largest height of the panel bridge, wherein the panel bridge has a smallest second height h2 at the groove, wherein 0.05<h2/hi<0.8, such as 0.1<h2/hi<0.6, especially 0.25<h2/hi<0.45. The smaller the second height h2 is, the weaker the mechanical connection between the board and the support panel arrangement may be. A weaker mechanical connection may be (partially) desired, as this facilitates separating the board from the support panel arrangement. However, the mechanical connection may need to be sufficient that the board and the support panel arrangement do not separate unintentionally. It will be clear to the person skilled in the art that different second heights h2 may be suitable for different (board panel arrangement) materials, and the person skilled in the art will select a second height h2 suitable for the used (board panel arrangement) materials.
In embodiments, the first height hi may be about equal to the board height hi. In further embodiments, the first height hi may be about equal to the arrangement height h3.
The second height h2 may (essentially) be the height of the remaining material of the panel bridge at the groove, i.e., the second height h2 may be the first height hi minus the depth of the groove. In embodiments wherein the groove(s) comprises a top cut and a bottom cut, h2 may (essentially) be the first height hi minus the depth of the depth of the top cut and minus the depth of the bottom cut.
Especially, the groove may be configured such that the board may be
(physically) separated (also:“detached”) (from the support panel arrangement) at the groove, especially broken out at the groove, or especially cut out at the groove. After (physical) separation (also: detachment or depanelization) of the board from the support panel arrangement, the board may comprise a rough edge where the groove used to be, especially directly below and/or above the groove bottom(s).
In embodiments, the rough edge (and the slanted plane, see further below) may especially be arranged where the second edge part was arranged prior to (physical) separation. Hence, herein, the term“second edge part” refers to the part of the board physically connected to the support panel arrangement prior to (physical) separation, as well as to the same part of the board after (physical) separation of the board from the support panel.
In further embodiments, the groove, especially the groove bottom, may be configured recessed relative to the board outline, especially at least 0.1 mm recessed relative to the board outline, such as at least 0.15 mm, especially at least 0.2 mm, such as at least 0.25 mm, especially at least 0.3 mm, such as at least 0.45 mm, especially at least 0.55 mm, such as at least 0.6 mm, especially at least 0.65 mm, such as at least 0.8 mm. Especially, the groove may be configured such that a rough edge resulting from (physically) separating the board and the support panel arrangement at the groove does not comprise any of the board extremities, i.e., the rough edge falls within the board outline. Hence, in specific
embodiments, the groove may comprise a groove bottom, wherein the groove bottom is at least 0.1 mm recessed relative to the board outline, such as at least 0.15 mm recessed, especially at least 0.2 mm recessed, such as at least 0.25 mm recessed, especially at least 0.3 mm recessed, such as at least 0.45 mm recessed, especially at least 0.55 mm recessed, such as at least 0.6 mm recessed, especially at least 0.65 mm recessed, such as at least 0.8 mm recessed, especially at least 1 mm recessed, such as at least 2 mm recessed, especially at least 4 mm recessed, like at least 5 mm, such as up to 20 mm recessed, or even more.
In principle, there may be no maximal recess distance, i.e., the groove, especially the groove bottom, may be configured recessed relative to the board outline for a substantial proportion, such as especially 80% or more, of the board length (or board width). For example, in an embodiment, the groove, especially the groove bottom, may be 20 mm recessed relative to the board outline. Such embodiment may, for example, be beneficial if a socket is desired in the board such that the board can be arranged adjacent to or around a protruding element. In specific embodiment, the groove, especially the groove bottom, may be configured at most 20 mm recessed relative to the board outline.
Hence, the recession especially refers to the recession relative to the board outline in the plane of the board panel arrangement. In contrast, the groove may be considered a recession relative to e.g. the first side face or the second side face of the board, and perpendicular to the plane of the board panel arrangement.
In specific embodiments, the groove may have a groove length (LI) of at least 1 mm, such as at least 2 mm, especially at least 3 mm, such as at least 5 mm, especially at least 10 mm, such as at least 15 mm, especially at least 25 mm. In general, the groove length (LI) of the groove may be approximately the same as the length of the second edge part. A longer second edge part, and thus a longer physical connection between the board and the support panel arrangement, may provide a better mechanical connection of the board to the support panel arrangement. Hence, a longer groove length (LI), which may be approximately the same as the length of the second edge part, may provide a better mechanical connection of the board to the support panel arrangement. Similarly, a longer groove may also have a deeper (V-shaped) cut as the (weight on the) mechanical connection is spread out along a longer distance. Hence, a long groove with a deep (V-shaped) cut may be mechanically well connected in the support panel arrangement, while being easy to break in one direction.
In embodiments, the groove may especially be arranged along a straight line. Especially, the groove may be arranged along a straight line (approximately) parallel to a board dimension, such as board width or a board length. In embodiments, the (V-shaped) cut may have a groove length (LI) equal to or smaller than the length of the parallel board dimension L2 (the length of the parallel board dimension) minus 1 mm, i.e. LI < L2 - 1 mm, especially LI < L2 - 2 mm, such as LI < L2 3 mm.
In embodiments, the panel bridge may comprise part of the board. Further, the panel bridge may comprise part of the support panel arrangement. Essentially, the panel bridge may comprise a physical connection between the board and the support panel arrangement, especially wherein the groove (bottom) indicates the border between the board and the support panel arrangement. Essentially, any part of the panel bridge that is connected to the board after separation of the board and the support panel arrangement at the groove, is also part of the board.
Essentially, the board, panel bridge, and (respective) support panel arrangement may be from the same material, as they may be made from a single mother board. For that reason, the height may also be essentially the same (except for the groove, which has a smaller height).
In further embodiments, the board may comprise a (slit) indentation arranged adjacent to the panel bridge, especially wherein the (slit) indentation stretches along the board height, i.e., the indentation comprises a through hole. Especially, the board may comprise (at least) two indentations, wherein the (at least) two indentations are arranged on either side of the panel bridge. The indentations may especially be in line with the groove, especially along a straight line defined by the groove. The indentation may be provided by milling (by a point cutter). For example, the board may be physically connected to the support panel arrangement via a panel bridge at a first side of the board, wherein the first side comprises two indentations (especially stretching along the board height), wherein the panel bridge is arranged between the two indentations, and wherein the groove runs between the two indentations. The indentation may especially connect to a through hole in the support panel arrangement. In embodiments, the indentation may be elongated along a direction perpendicular to the board height lu. The through hole may comprise a rounded edge(s). The obtained effect of the (slit) indentations (comprising through holes) is easy and reliable separation of the board and support panel arrangement. The separation (breaking) of the board and support panel arrangement is especially easy and reliable in case through holes are used e.g. by rounded edges of the through holes.
In embodiments wherein the groove comprises a top (V-shaped) cut and a bottom (V-shaped) cut, the top (V-shaped) cut and the bottom (V-shaped) cut may have different groove depths, i.e., one of the cuts may be deeper into the panel bridge than the other cut. Especially, the top (V-shaped) cut and the bottom (V-shaped) cut may have the same groove depth.
In embodiments, the first edge part may have a length of at least 0.5 mm, such as at least 1 mm. In specific embodiments, the first edge part may round a comer of the board, especially an extremity, and have a length of at least 0.5 mm, such as at least 1 mm, at each side of the comer.
In further embodiments, the second edge part may have a length of at least 1 mm, such as at least 2 mm.
The term“second edge part” may also refer to a plurality of second edge parts. Similarly, the term“first edge part” may also refer to a plurality of first edge parts.
Especially, the plurality of first edge parts and the plurality of second edge parts may be arranged altematingly.
Hence, in specific embodiments, the board may comprise n first edge parts and n second edge parts, especially wherein over n first edge parts the board is configured separated from the support panel arrangement, and especially wherein over (each ol) n second edge parts the board and the support panel arrangement are physically connected via a (respective) panel bridge, especially via (at least) n (respective) panel bridges, wherein n>2, and wherein the first edge parts and second edge parts are configured altematingly, especially wherein n > 3, more especially wherein n > 4, such as n > 6.
In further embodiments, the board may have k side faces and may be physically connected to the support panel arrangement via n panel bridges, wherein in embodiments n=k/2, especially wherein half of the total number of k side faces are physically connected to the support panel arrangement via a panel bridge.
In further embodiments, (a first set ol) one or more of the (k) side faces of the board may be devoid of a second edge part, i.e., the board is not physically connected to the support panel arrangement at the one or more of the side faces.
In further embodiments, (a second set ol) one or more of the (k) side faces may (each) comprise a plurality of second edge parts, i.e., the board may comprise a side face comprising a plurality of second edge parts, wherein over each of the plurality of the second edge parts the board is physically connected to a support panel arrangement.
In embodiments, the length of the first edge part may be larger than the length of the second edge part. In specific embodiments, the sum of the lengths of the plurality of first edge parts SI (the sum of the lengths of the plurality of first edge parts) may be larger than or equal to the sum of the lengths of the plurality of second edge parts S2 (the sum of the lengths of the plurality of second edge parts), especially SI > S2, such as SI > 1.5*S2, especially SI > 2*S2, such as SI > 3*S2.
In embodiments, the board panel arrangement may comprise a plurality of boards. Each board may be arranged adjacent to one or more other boards and/or to a support panel in the support panel arrangement. Hence, one or more boards may also be part of the support panel arrangement for one or more other boards. In specific embodiments, the board panel arrangement may comprise a plurality of boards, each detachably integrated in the (respective) support panel arrangement, wherein for each board applies that over the first edge part the board is configured separated from the support panel arrangement, and wherein over the second edge part the board and support panel arrangement are physically connected via the panel bridge, wherein the panel bridge comprises the groove for (physically) separating the board and the support panel arrangement along the groove, wherein the groove is configured recessed relative to the board outline. Hence, two adjacently arranged boards in the board panel arrangement may be physically connected via a panel bridge, especially wherein the panel bridge comprises two grooves for (physically) separating the board from the (respective) support panel arrangement along the grooves, wherein one groove is configured recessed relative to the board outline of a first of the two adjacently arranged boards, and wherein one groove is configured recessed relative to the board outline of a second of the two adjacently arranged boards.
In specific embodiments, the board may comprise a printed circuit board
(PCB).
In further embodiments, the board panel arrangement may further comprise a functional component functionally coupled to the board, especially wherein the board comprises a printed circuit board. In yet further embodiments, the functional component may comprise a solid state light source. The term“functional component” may also refer to a plurality of (different) functional components.
In embodiments, a PCB may comprise an insulating layer arranged between a substrate and a conductive layer. As known in the art, a printed circuit board may
mechanically support and electrically connect electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate (shortly indicated as“track” or“conductive track”). An (electronic) component, such as a solid stage light source, may generally be soldered onto the PCB to both electrically connect and mechanically fasten it to the PCB. For instance, a basic PCB may consist of a flat sheet of insulating material and a layer of copper foil, laminated to the substrate. Chemical etching divides the copper into separate conducting lines called tracks or circuit traces, pads for connections, vias to pass connections between layers of copper, and features such as solid conductive areas for EM shielding or other purposes. The tracks function as wires fixed in place, and are insulated from each other by air and the board substrate material. The surface of a PCB may have a coating that protects the copper from corrosion and reduces the chances of solder shorts between traces or undesired electrical contact with stray bare wires. For its function in helping to prevent solder shorts, the coating is called solder resist.
Hence, the shape of a PCB may in general be plate-like. Especially, in embodiments the PCB may have a length and a width and a height, wherein an aspect ratio of the length and the height is at least 5, like in the range of 5-5000, like 10-2500, and wherein an aspect ratio of the width and the height is at least 2, such as an aspect ratio of at least 5, like in the range of 5-5000, like 10-2500. The terms“length”,“width”, and“height” may also refer to“largest length”,“largest width”, and“largest height”, respectively. The PCB may especially have a rectangular cross-section (such as a square cross-section).
The height (or thickness) of the PCB may in embodiments be selected from the range of 0.2-10 mm, such as 0.5-5 mm, like 1-2 mm. The width of the PCB may in embodiments be selected from the range of 5-200 mm, such as 5-50 mm. The length of a single printed circuit board area may in embodiments e.g. be selected from the range of 10-50 mm, such as 15-40 mm. The length of the PCB, including a plurality of (connected) PCB areas, may in embodiments e.g. be selected from the range of 20-2000 mm, such as 20-1500 mm. Other dimensions may be possible as well.
In further embodiments, the functional component may comprise an electronic component, especially an electronic component selected from the group comprising a solid state light source, a driver, an electronic module, or a sensor. Especially, the electronic component may comprise a solid state light source.
The invention may further provide the board after (physical) separation from the support panel arrangement. Hence, in a second aspect, the invention may further provide a functional unit comprising (i) a board and (ii) a functional component functionally coupled to the board. Especially, the board may comprise a printed circuit board. Further, the board may comprise a board edge comprising board extremities, especially wherein the board extremities define a board outline of the printed circuit board. In embodiments, the board may comprise a first face, especially the top board face, and a second face, especially the bottom board face. Especially, the board edge may bridge the first face and the second face. In further embodiments, the board edge may comprise a first edge part and a second edge part, wherein the second edge part comprises a slanted plane configured non-perpendicular to the first face and the second face, especially wherein the second edge part is configured recessed relative to the board outline.
In further embodiments, the functional component comprises an electronic component, especially an electronic component selected from the group comprising a solid state light source, a driver, an electronic module, or a sensor. Especially, the electronic component may comprise a solid state light source.
In embodiments, the slanted plane may correspond to one of the legs of the groove, i.e., after (physical) separation of the board and the support panel arrangement, the board may comprise part of the groove, especially one leg of the V, and may comprise a rough edge along the second edge part.
In a further aspect, the invention may further provide a method for providing a board panel arrangement and/or a board. Hence, the invention may further provide a method of providing a board, and, the invention may further provide a method of providing a board panel arrangement. The method may comprise providing a board panel arrangement comprising a support panel arrangement and a board, especially wherein the board comprises a board edge comprising board extremities. In embodiment, the board extremities may define a board outline of the board. The board edge may comprise a first edge part and a second edge part. Especially, over a first edge part the board may be configured separated from the board panel arrangement. Further especially, over a second edge part the board and the support panel arrangement may be physically connected via a panel bridge. In embodiments, the method may further comprise generating a groove in the panel bridge, especially at a position in the panel bridge such that the groove is configured recessed relative to the board outline. Especially, the groove may be (configured) for (physically) separating the board and the support panel arrangement along the groove.
In embodiments, the method may comprise milling the groove into the panel bridge. In further embodiments, the method may comprise milling the groove into the panel bridge by a point cutter.
In further embodiments, the first edge part of the board configured separated from the board panel arrangement may be obtainable by milling a through hole in the support panel arrangement. Hence, in further embodiments, the method may comprise milling a through hole in the support panel arrangement to provide the first edge part of the board, i.e., to separate the board from the board panel arrangement at a first edge part.
In embodiments, the method may further comprise (physically) separating the board and the support panel arrangement along the groove. In further embodiments, the method may comprise (physically) separating the board and the support panel arrangement by breaking along the groove, especially by using a (dedicated) panel breaking machine. In further embodiments, the method may comprise (physically) separating the board and the support panel arrangement by cutting along the groove, especially by using a (dedicated) cutter.
In embodiments, the method may further comprise (providing) a functional component functionally coupled to the board, wherein the board comprises a printed circuit board. In further embodiments, the functional component may comprise an electronic component, especially an electronic component selected from the group comprising a solid state light source, a driver, an electronic module, or a sensor. Especially, the electronic component may comprise a solid state light source.
In yet a further embodiment, the invention may provide a method of customizing a printed circuit board as described herein, wherein the method comprises breaking (or cutting) two adjacent boards, along the groove in between them, apart. This may be done by applying a force. For instance a torque may be applied. Alternatively or additionally, also a cutting means may be applied. Hence, the invention provides a method of disconnecting a board, especially a PCB, from a support panel arrangement, especially from a board, more especially from a PCB (thus especially leading to at least two PCB parts).
In a further aspect, the invention may further provide an electronic system, especially a lighting system, comprising the functional unit as described herein or obtainable according to the method described herein. In embodiments, the electronic system may further comprise or be functionally coupled to a control system, especially a control system configured to control the electronic system, more especially a control system configured to control one or more parts of the electronic system. For example, in specific embodiments, the electronic system may comprise a lighting system comprising a luminaire, wherein the control system is configured to control the luminaire.
The electronic component may include an active or a passive electronic component. An active electronic component may be any type of circuit component with the ability to electrically control electron flow (electricity controlling electricity). Examples thereof are diodes, especially light emitting diodes (LED). LEDs are herein also indicated with the more general term solid state lighting devices or solid state light sources. Hence, in embodiments the electronic component comprises an active electronic component.
Especially, the electronic component comprises a solid state light source. Other examples of active electronic components may include power sources, such as a battery, a piezo-electric device, an integrated circuit (IC), and a transistor. In yet other embodiments, the electronic component may include a passive electronic component. Components incapable of controlling current by means of another electrical signal are called passive devices. Resistors, capacitors, inductors, transformers, etc. can be considered passive devices. In an
embodiment, the electronic component may include an RFID (Radio-frequency
identification) chip. A RFID chip may be passive or active. Especially, the electronic component may include one or more of a solid state light source (such as a LED), a RFID chip, and an IC. The term“electronic component” may also refer to a plurality of alike or a plurality of different electronic components.
The embodiments described herein are not limited to a single aspect of the invention. For example, an embodiment describing the board panel arrangement with respect to the panel bridge, for example, may further relate to the method for providing a board. Similarly, an embodiment of the method for providing a board describing the board may further relate to the board as such.
The lighting system (also“lighting device”) may be part of or may be applied in e.g. office lighting systems, household application systems, shop lighting systems, home lighting systems, accent lighting systems, spot lighting systems, theater lighting systems, fiber-optics application systems, projection systems, self-lit display systems, pixelated display systems, segmented display systems, warning sign systems, medical lighting application systems, indicator sign systems, decorative lighting systems, portable systems, automotive applications, (outdoor) road lighting systems, urban lighting systems, green house lighting systems, horticulture lighting, or LCD backlighting.
As indicated above, the lighting system (also:“lighting unit”) may be used as backlighting unit in an LCD display device. Hence, the invention provides also a LCD display device comprising the lighting unit as defined herein, configured as backlighting unit. The invention also provides in a further aspect a liquid crystal display device comprising a back lighting unit, wherein the back lighting unit comprises one or more lighting devices as defined herein.
The term“light source” may refer to a semiconductor light-emitting device, such as a light emitting diode (LEDs), a resonant cavity light emitting diode (RCLED), a vertical cavity laser diode (VCSELs), an edge emitting laser, etc.. The term“light source” may also refer to an organic light-emitting diode, such as a passive-matrix (P MOLED) or an active-matrix (AMOLED). In a specific embodiment, the light source comprises a solid state light source (such as a LED or laser diode). In an embodiment, the light source comprises a LED (light emitting diode). The term LED may also refer to a plurality of LEDs. Further, the term“light source” may in embodiments also refer to a so-called chips-on-board (COB) light source. The term“COB” especially refers to LED chips in the form of a semiconductor chip that is neither encased nor connected but directly mounted onto a substrate, such as a PCB. Hence, a plurality of semiconductor light sources may be configured on the same substrate.
In embodiments, a COB is a multi LED chip configured together as a single lighting module. The term“light source” may also relate to a plurality of (essentially identical (or different)) light sources, such as 2-2000 solid state light sources. In embodiments, the light source may comprise one or more micro-optical elements (array of micro lenses) downstream of a single solid state light source, such as a LED, or downstream of a plurality of solid state light sources (i.e. e.g. shared by multiple LEDs). In embodiments, the light source may comprise a LED with on-chip optics. In embodiments, the light source comprises a pixelated single LEDs (with or without optics) (offering in embodiments on-chip beam steering).
The terms“visible”,“visible light” or“visible emission” and similar terms refer to light having one or more wavelengths in the range of about 380-780 nm.
The term“controlling” and similar terms especially refer at least to determining the behavior or supervising the running of an element. Hence, herein “controlling” and similar terms may e.g. refer to imposing behavior to the element
(determining the behavior or supervising the running of an element), etc., such as e.g.
measuring, displaying, actuating, opening, shifting, changing temperature, etc.. Beyond that, the term“controlling” and similar terms may additionally include monitoring. Hence, the term“controlling” and similar terms may include imposing behavior on an element and also imposing behavior on an element and monitoring the element. The controlling of the element can be done with a control system, which may also be indicated as“controller”. The control system and the element may thus at least temporarily, or permanently, functionally be coupled. The element may comprise the control system. In embodiments, the control system and element may not be physically coupled. Control can be done via wired and/or wireless control. The term“control system” may also refer to a plurality of different control systems, which especially are functionally coupled, and of which e.g. one control system may be a master control system and one or more others may be slave control systems. A control system may comprise or may be functionally coupled to a user interface.
The system, or apparatus, or device may execute an action in a“mode” or “operation mode” or“mode of operation”. Likewise, in a method an action or stage, or step may be executed in a“mode” or“operation mode” or“mode of operation”. The term“mode” may also be indicated as“controlling mode”. This does not exclude that the system, or apparatus, or device may also be adapted for providing another controlling mode, or a plurality of other controlling modes. Likewise, this may not exclude that before executing the mode and/or after executing the mode one or more other modes may be executed.
However, in embodiments a control system may be available, that is adapted to provide at least the controlling mode. Would other modes be available, the choice of such modes may especially be executed via a user interface, though other options, like executing a mode in dependence of a sensor signal or a (time) scheme, may also be possible. The operation mode may in embodiments also refer to a system, or apparatus, or device, that can only operate in a single operation mode (i.e.“on”, without further tunability).
Hence, in embodiments, the control system may control in dependence of one or more of an input signal of a user interface, a sensor signal (of a sensor), and a timer. The term“timer” may refer to a clock and/or a predetermined time scheme.
BRIEF DESCRIPTION OF THE DRAWINGS
Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which:
Fig. 1A schematically depicts a single board as may be known in the prior art;
Fig. IB schematically depicts an embodiment of the board panel arrangement 1 and an embodiment of the method;
Fig. 2 schematically depicts an embodiment of the panel bridge 102;
Fig. 3 schematically depicts an embodiment of the board panel arrangement 1, an embodiment of the method and an embodiment of the functional unit 2; and
Fig. 4 schematically depicts an embodiment of the electronic system 5.
Fig. 5A and B schematically depict embodiments of the board panel arrangement 1 and an embodiment of the method.
Fig. 6A and B schematically depict embodiments of the board panel arrangement 1 and an embodiment of the method. Fig. 7A and B schematically depict embodiments of the board panel arrangement 1 and an embodiment of the method.
The schematic drawings are not necessarily to scale.
DETAILED DESCRIPTION OF THE EMBODIMENTS
Fig. 1 A schematically depicts a single board as may be known in the prior art. The single board comprises a board 200 detachably integrated in a support panel arrangement 100 comprising a support panel 101. The board 200 and the support panel arrangement 100 are physically connected via a panel bridge 102. A groove 105 is applied over the whole width of the board and the support panel 101.
The right side of Fig. 1A schematically depicts the situation after (physical) separation of the board 200 from the support panel arrangement 100: The board edge comprises a left-over rough edge 239where the groove 105 used to be, which partially defines the board edge 230 and the board outline 236.
Fig. IB schematically depicts an embodiment of the board panel arrangement 1 according to the invention. The board panel arrangement 1 comprises a support panel arrangement 100 and a board 200 detachably integrated in the support panel arrangement 100. The support panel arrangement 100 comprises a support panel 101. The board 200 comprises a board edge 230 comprising board extremities 235, wherein the board extremities
235 define a board outline 236 of the board 200. For visualization purposes, the board outline
236 is only depicted on the right half of Fig. IB. Over a first edge part 231 the board 200 is configured (physically) separated from the support panel arrangement 100. Especially, the board 200 is configured separated from the support panel arrangement 100 by a gas, such as by air. Over a second edge part 232 the board 200 and the support panel arrangement 100 are physically connected via a panel bridge 102. Especially, the panel bridge 102 comprises a groove 105 for (physically) separating the board 200 and the support panel 100 along the groove 105, especially wherein the groove 105 is configured recessed relative to the board outline 236. In the depicted embodiment, the board edge 230 is indented near the panel bridge 102, such that the groove may be arranged recessed relative to the board outline 236.
In the depicted embodiment, the board 200 comprises a (slit) indentation 1232 arranged adjacent to the panel bridge 102, especially wherein the (slit) indentation 1232 stretches along the board height 200, i.e. the indentation may comprise a through hole 1231. Especially, the board 200 may comprise (at least) two indentations 1232, wherein the (at least) two indentations 1232 are arranged on either side of the panel bridge 102. The indentations 1232 may especially be (arranged) in line with the groove 105, especially along a straight line defined by the groove 105 as in the depicted embodiment. In the depicted embodiment, the board 200 is physically connected to the support panel arrangement 100 via a panel bridge 102, wherein the panel bridge 102 is arranged between two indentations 1232, and especially wherein the groove 105 runs between the two indentations 1232. The indentation 1232 may especially connect to a (elongated) through hole 1231 in the support panel arrangement 100. In the depicted embodiment, the indentation 1232 is elongated along a direction perpendicular to the board height h4, especially perpendicular to the side face of the board 200 physically connected to the support panel arrangement 100 via the panel bridge 102.
In the depicted embodiment, the board 200 comprises a first face 201, especially a top board face, and a second face 202, especially a bottom board face, especially wherein the board edge 230 bridges the first face 201 and the second face 202.
The right side of Fig. IB schematically depicts the situation after (physical) separation of the board 200 from the support panel arrangement 100: The board edge comprises a left-over rough edge 239 where the groove 105 used to be. However, all the board extremities 235 are located outside of the rough edge 239. Hence, although the rough edge 239 contributes to defining the board edge 230, the rough edge 239 does not contribute to defining the board outline 236.
In the depicted embodiment, the groove is arranged along a straight line. Further, the groove 105 may have a groove length LI of at least 3 mm, such as at least 5 mm, especially at least 10 mm, such as at least 15 mm, especially at least 25 mm. In general, the groove length LI of the groove may be approximately the same as the length of the second edge part. In the depicted embodiment, the panel bridge 102 has a constant width (parallel to the groove) about equal to the groove length LI. In further embodiments, the width of the panel bridge 102 may also vary over the length of the panel bridge 102.
In the depicted embodiment, the board 200 has a board height hi, and the board panel arrangement 1 has an arrangement height I13. The board height I14 and the arrangement height I13 may be about equal. Similarly, the board height lu and the
arrangement height I13 may be about equal to the first height hi of the panel bridge 102. Especially, in further embodiments, the board panel arrangement 1 may have about the same height (the arrangement height I13) throughout the board panel arrangement 1, with the exception of the second height I12 at the groove 105. Fig. IB further depicts an embodiment of the method of providing a board 200, the method comprising: - providing a board panel arrangement 1 comprising a support panel arrangement 100 and a board 200, wherein the board 200 comprises a board edge 230 comprising board extremities 235, wherein the board extremities 235 define a board outline 236 of the board 200, wherein over a first edge part 231 the board 200 is configured
(physically) separated from the support panel arrangement 100, and wherein over a second edge part 232 the board 200 and the support panel arrangement 100 are physically connected via a panel bridge 102; - generating a groove 105 in the panel bridge 102 at a position in the panel bridge 102 such that the groove 105 is configured recessed relative to the board outline 236. In embodiments, the method may further comprise (physically) separating the board 200 and the support panel arrangement 100 along the groove 105, especially by breaking and/or cutting along the groove 105, as represented by the arrow between the left side and the right side of Fig. IB.
In embodiments, the method may comprise milling the groove 105 into the panel bridge 102. In further embodiments, the method may comprise milling the groove 105 into the panel bridge 102 by a point cutter.
In embodiments of the board panel arrangement, the first edge part 231 of the board 200 configured separated from the support panel arrangement 100 is obtainable by milling a (slit) through hole 1231 in the support panel arrangement 100. Hence, in further embodiments of the method, the method may comprise milling a (slit) through hole 1231 in the support panel arrangement 100 to provide the first edge part 231 of the board 200.
Fig. 2 schematically depicts a side view of an embodiment of the panel bridge 102. In the depicted embodiment, the panel bridge 102 comprises a groove 105, especially a V-groove. The groove comprises a top cut 108, especially a top V-shaped cut, and a bottom cut 109, especially a bottom V-shaped cut. Each of the top (V-shaped) cut 108 and the bottom (V-shaped) cut 109 comprises a respective groove bottom 106. The top (V-shaped) cut 108 has the legs of the V arranged at an angle on, and the bottom (V-shaped) cut 109 has the legs of the V arranged at an angle on. In the depicted embodiment, on is about equal to on. However, in further embodiments, on and on may be different. Similarly, in the depicted embodiment, the two (V-shaped) cuts may have about the same groove depth (The depth of the groove bottom relative to the top (or bottom) face of the panel bridge 102. However, in further embodiments, either groove depth may be larger than the other.
In further embodiments, the groove bottom 106 may be at least 0.2 mm recessed relative to the board outline 236. In the depicted embodiment, the panel bridge 102 has a first (maximal) height hi, and the panel bridge 102 has a smallest second height h2 at the groove 105. Especially, wherein 0.1<h2/hi<0.6. In the depicted embodiment, i hi may be about 0.33. In the depicted embodiment, the groove comprises a first cut or top cut 108 and a second cut or bottom cut 109, and h2 may (essentially) be the first height hi minus the depth of the depth of the top cut 108 and minus the depth of the bottom cut 109. In this embodiment, the depth of the top cut 108 may be about 0.33*hi. Similarly, the depth of the bottom cut 109 may be about 0.33*hi.
After (physical) separation of the board 200 from the support panel 100, depicted on the right side of Fig. 2, the board 200 may comprise a slanted plane 238. The board 200 comprises a first face 201, especially a top board face, and a second face 202, especially a bottom board face, especially wherein the board edge 230 bridges the first face 201 and the second face 202. Especially, in the depicted embodiment, the second edge part 232 comprises a slanted plane 238 configured non-perpendicular to the first face 201 and the second face 202. The slanted plane 238 may essentially be a left-over from the groove 105 after (physical) separation. Further, the second edge part 232 may comprise a rough edge 239, especially arranged above and/or below where the groove bottom 106 of the groove 105 used to be. For example, in the depicted embodiment, the panel bridge 102 comprised a groove 105 comprising a top (V-shaped) cut 108 and a bottom (V-shaped) cut 109, and the rough edge is arranged below where the groove bottom 106 of the top (V-shaped) cut 108 used to be and above where the groove bottom 106 of the bottom (V-shaped) cut 109 used to be.
In the depicted embodiment, the panel bridge 102 comprises part of the support panel arrangement 100 and part of the board 200. Essentially, the panel bridge 102 comprises a physical connection between the board 200 and the support panel arrangement 100, especially wherein the groove 105 (or the groove bottomO 106) indicates the border between the board 200 and the support panel arrangement 100.
Fig. 3 schematically depicts an embodiment of the board panel arrangement 1 comprising a plurality of boards 200, each detachably integrated in the (respective) support panel arrangement 100. For example, a first support panel arrangementlOOa for a first board200a may comprise the support panel 101, and the other boards200b,200c,200d.
Similarly, a second support panel arrangement (not indicated with a reference number for visualization purposes) for a second board 200b may comprise the support panel 101, the first board 200a, and the remainder of the other boards 200c, 200d. For each of the boards 200 applies that over the first edge part 231 the board 200 is configured separated from the (respective) support panel arrangement 100, and that over the second edge part 232 the board 200 and the support panel arrangement 100 are physically connected via the panel bridge 102, especially wherein the panel bridge 102 comprises the groove 105 for (physically) separating the board 200 and the support panel arrangement 100 by breaking along the groove 105, wherein the groove 105 is configured recessed relative to the board outline 236.
In the depicted embodiment, over n first edge parts 231 the board 200 is configured separated from the support panel arrangement 100, and over n second edge parts 232 the board 200 and the support panel arrangement 100 are physically connected via a panel bridge 102, wherein n>2, and wherein the first edge parts 231 and second edge parts 232 are configured altematingly. Specifically, (each ol) the board(s) 200 has 4 first edge parts
231 and 4 second edge parts 232 (n=4) arranged altematingly. Two of the second edge parts
232 face the support panel 101 and two of the second edge parts 232 face the second edge parts 232 of other boards 200. In the depicted embodiment, the panel bridges 102 located between two adjacent boards 200 comprise two grooves 105, one of which is configured recessed relative to the board outline 236 of one of the two adjacent boards 200, and the other of which is configured recessed relative to the board outline 236 of the other of the two adjacent boards 200.
Further, in the depicted embodiment, the board panel arrangement 1 further comprises a functional component 300 functionally coupled to the board 200, wherein the board 200 comprises a printed circuit board (PCB) 310. Especially, the functional component 300 may comprise an electronic component. More especially, the functional component may comprise a solid state light source.
Fig. 3 further schematically depicts an embodiment of the method according to the invention, wherein the method further comprises a functional component 300 functionally coupled to the board 200, wherein the board 200 comprises a printed circuit board 310. Especially, the functional component 310 may comprise a solid state light source. Hence, the method may comprise providing, especially arranging, a functional component 300 functionally coupled to the board.
Separation of the board 200 from the support panel arrangement 100 according to the method of the invention provides an embodiment of the functional unit 2 as depicted in the bottom part of Fig. 3. The functional unit 2 may comprise (i) a board 200 and (ii) a functional component 300 functionally coupled to the board 200. Especially, the board 200 may comprise a printed circuit board 310. In embodiments, the board 200 may comprise a board edge 230 comprising board extremities 235, especially wherein the board extremities 235 define an board outline 236 of the printed circuit board 310, especially wherein the board
200 comprises a first face 201 and a second face 202, especially wherein the board edge 230 bridges the first face 201 and the second face 202, especially wherein the board edge 230 comprises a first edge part 231 and a second edge part 232, especially wherein the second edge part 232 comprises a slanted plane 238 configured non-perpendicular to the first face
201 and the second face 202, especially wherein the second edge part 232 is configured recessed relative to the board outline 236. In further embodiments, the functional component 300 may comprise an electronic component, especially a solid state light source.
In the depicted embodiment, the groove 105 is configured recessed relative to the board outline 236. In further embodiments, the groove 105, especially the groove bottom 106, may be at least 0.1 mm recessed relative to the board outline 236, i.e., in embodiments, a third distance L3 between the board outline 236 and the groove 105, especially the groove bottom 106, may be at least 0.1 mm, such as at least 0.15 mm, especially at least 0.2 mm, such as at least 0.25 mm, especially at least 0.3 mm, such as at least 0.45 mm, especially at least 0.55 mm, such as at least 0.6 mm, especially at least 0.65 mm, such as at least 0.8 mm, especially at least 1 mm, such as at least 2 mm, especially at least 4 mm. In specific (non exclusive) embodiments, the third distance L3 between the board outline 236 and the groove 105, especially the groove bottom 106, may be at most 20 mm.
In the depicted embodiment, each of the boards 200 has a board outline 236 approximating a cuboid, or as depicted, has an in-plane board outline 236 approximating a square. Hence, in the depicted embodiment, each of the boards 200 may have a top board face, a bottom board face, and four board side faces.
Fig. 4 schematically depicts an embodiment of the electronic system 5 according to the invention. The electronic system 5 may comprise the functional unit 2. In the depicted embodiment, the electronic system 5 comprises a luminaire 7 comprising the functional unit 2 comprising a functional component 300. Especially, the functional unit 2 may be functionally coupled to a light source 10, especially a solid state light source. In the depicted embodiment, the light source 10 provides light source light 11. In further embodiments, the electronic system 5 may further comprise a control system 6 configured to control the electronic system 5. In the depicted embodiment, the control system 6 may especially be configured to control the luminaire 7.
Fig. 5A and B schematically depict embodiments of the board panel arrangement 1 and an embodiment of the method. As depicted in Fig. 5A and Fig. 5b, the groove 105 is configured recessed relative to a recess opening 1001. The recess opening 1001 has a recess opening length L4. The recess opening length L4 may be in the range from 1 to 8 mm. More preferably, the recess opening length L4 is in the range from 2 to 7 mm. Most preferably, the recess opening length L4 is in the range from 3 to 6 mm. The obtained effect is improved safety. The reason is that such a configuration allows that a (adult) person cannot touch the left-over rough / sharp edge and/or reduces the chance that a (adult) person touches the left-over rough / sharp edge e.g. during assembly / usage of the board. The recess opening length L4 may be defined as the (minimum) length between two neighboring first edge parts 231 measured at the board outline 236. The recess opening 1001 is located between the two neighboring first edge parts 231. A third distance L3 between the board outline 236 and the groove 105 is preferably at least 0.5 times the recess opening length L4. More preferably, the third distance L3 between the board outline 236 and the groove 105 is preferably at least 0.7 times the recess opening length L4. Most preferably, the third distance L3 between the board outline 236 and the groove 105 is preferably at least 0.9 times the recess opening length L4. The obtained effect is further improved safety. The reason is that such a configuration allows that a (adult) person cannot touch the left-over rough / sharp edge and/or further reduces the chance that a (adult) person touches the left-over rough / sharp edge e.g. during assembly / usage of the board. The groove length LI may be larger than the recess opening length L4. The groove length LI may be smaller than the recess opening length L4.
As depicted in Fig. 5A and B, the groove 105 has a groove length LI, wherein the groove 105 is configured recessed relative to a recess opening 1001, the recess opening 1001 has a recess opening length L4, wherein the groove length LI is in a range from 0.7 to 1 times the recess opening length L4. More preferably, the groove length LI is in a range from 0.8 to 1 times the recess opening length L4. Most preferably, the groove length LI is in a range from 0.85 to 1 times the recess opening length L4.
Fig. 6A and B schematically depict embodiments of the board panel arrangement 1 and an embodiment of the method. As depicted in Fig. 6A and 6B, the groove 105 has a groove length LI, wherein the groove 105 is configured recessed relative to a recess opening 1001, the recess opening 1001 having a recess opening length L4, wherein the groove length LI is larger than the recess opening length L4. The obtained effect is even further improved safety and a better mechanical connection of the board to the support panel arrangement.
Fig. 7A and B schematically depict embodiments of the board panel arrangement 1 and an embodiment of the method. As depicted in Fig. 7A and 6B, the board 200 comprises an electrically conductive board track 1002 being electrically connected to the solid state light source. The support panel arrangement 100 comprises an electrically conductive support panel arrangement track 1003. The electrically conductive board track 1002 and electrically conductive support panel arrangement track 1003 are electrically connected when the board 100 is mechanically connected to the support panel arrangement 100.
The term“plurality” refers to two or more.
The terms“substantially” or“essentially” herein, and similar terms, will be understood by the person skilled in the art. The terms“substantially” or“essentially” may also include embodiments with“entirely”,“completely”,“ah”, etc. Hence, in embodiments the adjective substantially or essentially may also be removed. Where applicable, the term “substantially” or the term“essentially” may also relate to 90% or higher, such as 95% or higher, especially 99% or higher, even more especially 99.5% or higher, including 100%.
The term“comprise” includes also embodiments wherein the term “comprises” means“consists of’.
The term“and/or” especially relates to one or more of the items mentioned before and after“and/or”. For instance, a phrase“item 1 and/or item 2” and similar phrases may relate to one or more of item 1 and item 2. The term "comprising" may in an embodiment refer to "consisting of but may in another embodiment also refer to "containing at least the defined species and optionally one or more other species".
Furthermore, the terms first, second, third and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operation in other sequences than described or illustrated herein. The term“further embodiments” may refer to embodiments comprising the features of the previously discussed embodiments, but may also refer to alternative embodiments.
The devices, apparatus, or systems may herein amongst others be described during operation. As will be clear to the person skilled in the art, the invention is not limited to methods of operation, or devices, apparatus, or systems in operation.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design many alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.
Use of the verb "to comprise" and its conjugations does not exclude the presence of elements or steps other than those stated in a claim. Unless the context clearly requires otherwise, throughout the description and the claims, the words“comprise”, “comprising”, and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to”.
The article "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.
The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In a device claim, or an apparatus claim, or a system claim, enumerating several means, several of these means may be embodied by one and the same item of hardware. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
The invention also provides a control system that may control the device, apparatus, or system, or that may execute the herein described method or process. Yet further, the invention also provides a computer program product, when running on a computer which is functionally coupled to or comprised by the device, apparatus, or system, controls one or more controllable elements of such device, apparatus, or system.
The invention further applies to a device, apparatus, or system comprising one or more of the characterizing features described in the description and/or shown in the attached drawings. The invention further pertains to a method or process comprising one or more of the characterizing features described in the description and/or shown in the attached drawings.
The various aspects discussed in this patent can be combined in order to provide additional advantages. Further, the person skilled in the art will understand that embodiments can be combined, and that also more than two embodiments can be combined. Furthermore, some of the features can form the basis for one or more divisional applications.

Claims

CLAIMS:
1. A board panel arrangement (1) comprising a support panel arrangement (100) and a board (200) detachably integrated in the support panel arrangement (100), wherein the board (200) comprises a board edge (230) comprising board extremities (235), wherein the board extremities (235) define a board outline (236) of the board (200), wherein over a first edge part (231) the board (200) is configured separated from the support panel arrangement (100), and wherein over a second edge part (232) the board (200) and the support panel arrangement (100) are physically connected via a panel bridge (102), wherein the panel bridge (102) comprises a groove (105) for separating the board (200) and the support panel (100) along the groove (105), the board panel arrangement (1) further comprising a functional component (300) functionally coupled to the board (200), wherein the board (200) comprises a printed circuit board (310), wherein the functional component (300) comprises a solid state light source, and wherein the groove (105) is configured recessed relative to the board outline (236).
2. The board panel arrangement (1) according to claim 1, wherein the panel bridge (102) has a first height (hi), wherein the panel bridge (102) has a smallest second height (I12) at the groove (105), wherein 0.1<h2/hi<0.6.
3. The board panel arrangement (1) according to any one of the preceding claims, wherein the groove (105) has a groove length (LI) of at least 10 mm.
4. The board panel arrangement (1) according to any one of the preceding claims, wherein the groove (105) is configured recessed relative to a recess opening (1001), the recess opening (1001) having a recess opening length (L4) in the range from 1 to 8 mm.
5. The board panel arrangement (1) according to claim 4, wherein a third distance (L3) between the board outline (236) and the groove (105) is at least 0.5 times the recess opening length (L4).
6. The board panel arrangement (1) according to any one of the preceding claims, wherein the groove (105) has a groove length (LI), wherein the groove (105) is configured recessed relative to a recess opening (1001), the recess opening (1001) having a recess opening length (L4), wherein the groove length (LI) is in a range from 0.7 to 1 times the recess opening length (L4).
7. The board panel arrangement (1) according to any one of the preceding claims, wherein the board (200) comprises at least two indentations (1232), wherein the at least two indentations (1232) are arranged on either side of the panel bridge (102).
8. The board panel arrangement (1) according to claim 7, wherein the indentations comprise a through hole or a slit.
9. The board panel arrangement (1) according to any one of the preceding claims, wherein the groove (105) comprises a groove bottom (106), wherein the groove bottom (106) is at least 0.2 mm recessed relative to the board outline (236).
10. The board panel arrangement (1) according to claim 9, wherein over n first edge parts (231) the board (200) is configured separated from the support panel arrangement (100), and wherein over n second edge parts (232) the board (200) and the support panel arrangement (100) are physically connected via a panel bridge (102), wherein n>2, wherein the first edge parts (231) and second edge parts (232) are configured altematingly, and wherein the groove bottom (106) is at least 0.6 mm recessed relative to the board outline (236).
11. The board panel arrangement (1) according to any one of the preceding claims, comprising a plurality of boards (200), each detachably integrated in the support panel arrangement (100), wherein for each board (200) applies that over the first edge part (231) the board (200) is configured separated from the support panel arrangement (100), and wherein over the second edge part (232) the board (200) and the support panel arrangement (100) are physically connected via the panel bridge (102), wherein the panel bridge (102) comprises the groove (105) for separating the board (200) and the support panel arrangement (100) by breaking along the groove (105), wherein the groove (105) is configured recessed relative to the board outline (236).
12. A functional unit (2) comprising (i) a board (200) and (ii) a functional component (300) functionally coupled to the board (200), wherein:
the board (200) comprises a printed circuit board (310), wherein the board (200) comprises a board edge (230) comprising board extremities (235), wherein the board extremities (235) define a board outline (236) of the board (200), wherein the board (200) comprises a first face (201) and a second face (202), wherein the board edge (230) bridges the first face (201) and the second face (202), wherein the board edge (230) comprises a first edge part (231) and a second edge part (232), wherein the second edge part (232) comprises a slanted plane (238) configured non-perpendicular to the first face (201) and the second face (202), wherein the second edge part (232) is configured recessed relative to the board outline (236); and
the functional component (300) comprises a solid state light source.
13. A method of providing a board (200), the method comprising:
providing a board panel arrangement (1) comprising a support panel arrangement (100) and a board (200), wherein the board (200) comprises a board edge (230) comprising board extremities (235), wherein the board extremities (235) define an board outline (236) of the board (200), wherein over a first edge part (231) the board (200) is configured separated from the support panel arrangement (100), and wherein over a second edge part (232) the board (200) and the support panel arrangement (100) are physically connected via a panel bridge (102);
generating a groove (105) in the panel bridge (102) at a position in the panel bridge (102) such that the groove (105) is configured recessed relative to the board outline (236), and
wherein the method further comprising a functional component (300) functionally coupled to the board (200), wherein the board (200) comprises a printed circuit board (310), and wherein the functional component (310) comprises a solid state light source.
14. The method according to any one of the preceding claim 13, further comprising separating the board (200) and the support panel arrangement (100) by breaking along the groove (105).
15. An electronic system (5), comprising the functional unit (2) according to claim
12 or obtainable according to the method of claim 13 or 14.
PCT/EP2020/055226 2019-03-01 2020-02-28 Tolerance reduction for v-cut WO2020178156A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP19160272 2019-03-01
EP19160272.1 2019-03-01

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6370489A (en) 1986-09-11 1988-03-30 松下電工株式会社 Method of working metal base printed wiring board
US20040245012A1 (en) 2003-04-25 2004-12-09 Advanced Digital Broadcast Polska Sp. Z O.O. Set of printed circuit boards
US20060276058A1 (en) 2005-06-01 2006-12-07 Seagate Technology Llc Method and apparatus for attenuating flexible circuit resonance
US20110255250A1 (en) 2010-04-19 2011-10-20 Richard Hung Minh Dinh Printed circuit board components for electronic devices
US20120056210A1 (en) 2010-09-02 2012-03-08 Hideaki Kato Light emitting apparatus and multi-surface pattern substrate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6370489A (en) 1986-09-11 1988-03-30 松下電工株式会社 Method of working metal base printed wiring board
US20040245012A1 (en) 2003-04-25 2004-12-09 Advanced Digital Broadcast Polska Sp. Z O.O. Set of printed circuit boards
US20060276058A1 (en) 2005-06-01 2006-12-07 Seagate Technology Llc Method and apparatus for attenuating flexible circuit resonance
US20110255250A1 (en) 2010-04-19 2011-10-20 Richard Hung Minh Dinh Printed circuit board components for electronic devices
US20120056210A1 (en) 2010-09-02 2012-03-08 Hideaki Kato Light emitting apparatus and multi-surface pattern substrate

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