PL3437775T3 - Strumieniowa kąpiel lutownicza i urządzenie do lutowania strumieniowego - Google Patents

Strumieniowa kąpiel lutownicza i urządzenie do lutowania strumieniowego

Info

Publication number
PL3437775T3
PL3437775T3 PL18187232.6T PL18187232T PL3437775T3 PL 3437775 T3 PL3437775 T3 PL 3437775T3 PL 18187232 T PL18187232 T PL 18187232T PL 3437775 T3 PL3437775 T3 PL 3437775T3
Authority
PL
Poland
Prior art keywords
jet
solder bath
soldering apparatus
jet solder
jet soldering
Prior art date
Application number
PL18187232.6T
Other languages
English (en)
Inventor
Ryoichi Suzuki
Yasuji Kawashima
Tetuya OKUNO
Shigeo Komine
Takashi Sugihara
Original Assignee
Senju Metal Industry Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co., Ltd filed Critical Senju Metal Industry Co., Ltd
Publication of PL3437775T3 publication Critical patent/PL3437775T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PL18187232.6T 2017-08-04 2018-08-03 Strumieniowa kąpiel lutownicza i urządzenie do lutowania strumieniowego PL3437775T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017151746A JP6593400B2 (ja) 2017-08-04 2017-08-04 噴流はんだ槽及び噴流はんだ付け装置

Publications (1)

Publication Number Publication Date
PL3437775T3 true PL3437775T3 (pl) 2024-04-08

Family

ID=63144880

Family Applications (1)

Application Number Title Priority Date Filing Date
PL18187232.6T PL3437775T3 (pl) 2017-08-04 2018-08-03 Strumieniowa kąpiel lutownicza i urządzenie do lutowania strumieniowego

Country Status (6)

Country Link
US (1) US11167364B2 (pl)
EP (1) EP3437775B1 (pl)
JP (1) JP6593400B2 (pl)
CN (1) CN109382560B (pl)
HU (1) HUE064613T2 (pl)
PL (1) PL3437775T3 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018105388A1 (de) * 2018-03-08 2019-09-12 Ersa Gmbh Lötdüse und Lötanlage
US10780516B2 (en) * 2018-06-14 2020-09-22 Illinois Tool Works Inc. Wave solder nozzle with automated adjustable sliding plate to vary solder wave width
US11389888B2 (en) 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2117690B (en) * 1982-04-02 1986-01-08 Zevatron Gmbh Apparatus for soldering workpieces
JPH0442058Y2 (pl) * 1985-06-15 1992-10-02
JPS63281768A (ja) 1987-05-13 1988-11-18 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
JPH01266793A (ja) * 1988-04-19 1989-10-24 Kenji Kondo プリント基板のはんだ付け方法およびその装置
US4886201A (en) * 1988-06-09 1989-12-12 Electrovert Limited Solder wave nozzle construction
JPH0783174B2 (ja) * 1988-09-02 1995-09-06 権士 近藤 プリント基板のはんだ付け方法およびその装置
US5240169A (en) * 1991-12-06 1993-08-31 Electrovert Ltd. Gas shrouded wave soldering with gas knife
US5156324A (en) * 1992-03-17 1992-10-20 Electrovert Lgd Solder apparatus with dual hollow wave nozzles
US5411197A (en) * 1993-10-19 1995-05-02 Senju Metal Industry Co., Ltd. Soldering pot
US5409159A (en) * 1994-02-28 1995-04-25 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and methods for inerting solder during wave soldering operations
JP3017533U (ja) * 1995-04-28 1995-10-31 千住金属工業株式会社 噴流はんだ槽
JP3311547B2 (ja) * 1995-08-02 2002-08-05 日本電熱計器株式会社 はんだ付け装置
US5772101A (en) * 1995-08-07 1998-06-30 Ns Tekuno Co., Ltd. Wave soldering machine
JPH09293959A (ja) * 1996-04-26 1997-11-11 Senju Metal Ind Co Ltd 噴流はんだ槽
JP2001251047A (ja) * 2000-03-07 2001-09-14 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法および自動はんだ付け装置
MY124946A (en) * 2000-10-23 2006-07-31 Senju Metal Industry Co Automatic wave soldering apparatus and method
US6732309B1 (en) * 2001-08-02 2004-05-04 Xilinx, Inc. Method for testing faults in a programmable logic device
JP2003236655A (ja) 2001-12-11 2003-08-26 Tamura Seisakusho Co Ltd はんだ付け装置
US6742693B2 (en) * 2001-12-21 2004-06-01 Asustek Computer, Inc. Solder bath with rotatable nozzle
TW511856U (en) * 2001-12-26 2002-11-21 Asustek Comp Inc Adjustable nozzle of tin oven
JP2004259963A (ja) 2003-02-26 2004-09-16 Minebea Co Ltd 噴流式半田付け装置
JP2004268092A (ja) * 2003-03-07 2004-09-30 Amtex Corp 半田付装置
JP4410490B2 (ja) 2003-05-27 2010-02-03 千住金属工業株式会社 自動はんだ付け装置
JP4473566B2 (ja) * 2003-12-22 2010-06-02 株式会社タムラ製作所 噴流式はんだ付け装置
JP2006093281A (ja) 2004-09-22 2006-04-06 Nihon Dennetsu Keiki Co Ltd フローはんだ付け装置
DE502007006611D1 (de) * 2006-05-29 2011-04-14 Kirsten Soldering Ag Lötanlage mit lötmodulen und mindestens einer mobilen und auswechselbar in einem lötmodul einsetzbaren lötstation ; entsprechende stand-by station
JP4729453B2 (ja) 2006-08-04 2011-07-20 日本電熱ホールディングス株式会社 ハイブリッドウェーブの形成方法およびハイブリッドウェーブの形成装置
US20100065610A1 (en) * 2008-09-15 2010-03-18 Richard Anthony Szymanowski Wide wave apparatus for soldering an electronic assembly
JP5526957B2 (ja) * 2010-04-09 2014-06-18 千住金属工業株式会社 はんだ付け装置
JP5910784B1 (ja) * 2015-09-11 2016-04-27 千住金属工業株式会社 噴流ノズル及び噴流はんだ付け装置

Also Published As

Publication number Publication date
CN109382560A (zh) 2019-02-26
US20190039159A1 (en) 2019-02-07
JP2019030884A (ja) 2019-02-28
JP6593400B2 (ja) 2019-10-23
CN109382560B (zh) 2022-03-08
US11167364B2 (en) 2021-11-09
EP3437775B1 (en) 2023-10-04
EP3437775A1 (en) 2019-02-06
HUE064613T2 (hu) 2024-04-28

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