HUE050436T2 - Sugárfúvóka és sugárforrasztó berendezés - Google Patents

Sugárfúvóka és sugárforrasztó berendezés

Info

Publication number
HUE050436T2
HUE050436T2 HUE16188170A HUE16188170A HUE050436T2 HU E050436 T2 HUE050436 T2 HU E050436T2 HU E16188170 A HUE16188170 A HU E16188170A HU E16188170 A HUE16188170 A HU E16188170A HU E050436 T2 HUE050436 T2 HU E050436T2
Authority
HU
Hungary
Prior art keywords
jet
soldering apparatus
nozzle
jet nozzle
jet soldering
Prior art date
Application number
HUE16188170A
Other languages
English (en)
Inventor
Noboru Hashimoto
Takahiro Kasama
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of HUE050436T2 publication Critical patent/HUE050436T2/hu

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0676—Conveyors therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
HUE16188170A 2015-09-11 2016-09-09 Sugárfúvóka és sugárforrasztó berendezés HUE050436T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015179350A JP5910784B1 (ja) 2015-09-11 2015-09-11 噴流ノズル及び噴流はんだ付け装置

Publications (1)

Publication Number Publication Date
HUE050436T2 true HUE050436T2 (hu) 2020-12-28

Family

ID=55808235

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE16188170A HUE050436T2 (hu) 2015-09-11 2016-09-09 Sugárfúvóka és sugárforrasztó berendezés

Country Status (5)

Country Link
US (1) US9849535B2 (hu)
EP (1) EP3141328B1 (hu)
JP (1) JP5910784B1 (hu)
CN (1) CN106535494B (hu)
HU (1) HUE050436T2 (hu)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10029326B2 (en) * 2016-10-26 2018-07-24 Illinois Tool Works Inc. Wave soldering nozzle having automatic adjustable throat width
JP6593400B2 (ja) 2017-08-04 2019-10-23 千住金属工業株式会社 噴流はんだ槽及び噴流はんだ付け装置
US10780516B2 (en) * 2018-06-14 2020-09-22 Illinois Tool Works Inc. Wave solder nozzle with automated adjustable sliding plate to vary solder wave width
JP6744372B2 (ja) 2018-08-24 2020-08-19 ファナック株式会社 レーザ加工システム、噴流調整装置、及びレーザ加工方法
JP7340388B2 (ja) * 2019-08-21 2023-09-07 株式会社デンソーテン はんだ付け装置
WO2021059456A1 (ja) * 2019-09-26 2021-04-01 オー・エム・シー株式会社 レーザー式ハンダ付け方法とその装置
US11389888B2 (en) 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing
CN113732425A (zh) * 2021-08-24 2021-12-03 苏州恊合自动化科技有限公司 一种低波动便于维护的锡炉泵及波峰焊接锡炉

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52122349U (hu) * 1976-03-16 1977-09-17
US4447001A (en) * 1980-12-11 1984-05-08 Banner/Technical Devices Company, Inc. Adjustably dimensioned uniformly distributed solder wave apparatus
JPH0741411B2 (ja) 1991-10-08 1995-05-10 株式会社ピーエフユー ハンダ付け装置
JPH06633A (ja) * 1992-06-19 1994-01-11 Nippon Seiki Co Ltd 自動ハンダ付装置
JP3040297B2 (ja) 1993-03-09 2000-05-15 株式会社トクヤマ 歯科用軟質裏装材
JP2001036226A (ja) * 1999-07-19 2001-02-09 Fujitsu Ten Ltd 半田付け装置
US6367677B1 (en) * 1999-09-28 2002-04-09 Hill-Rom Services, Inc. Wave solder apparatus and method
JP2002134898A (ja) * 2000-10-26 2002-05-10 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法および噴流はんだ槽
JP3910797B2 (ja) 2000-12-28 2007-04-25 日本電熱計器株式会社 はんだ付けシステム
JP3897089B2 (ja) 2001-03-08 2007-03-22 日本電熱計器株式会社 はんだ付けシステム
JP2006080439A (ja) * 2004-09-13 2006-03-23 Koki Tec Corp 半田噴流ノズル
JP2013098467A (ja) * 2011-11-04 2013-05-20 Ricoh Co Ltd 二次ノズル体と噴流式ハンダ付け方法と噴流式ハンダ付け装置
JP5910616B2 (ja) * 2013-11-28 2016-04-27 千住金属工業株式会社 噴流ノズル及び噴流装置

Also Published As

Publication number Publication date
US20170072492A1 (en) 2017-03-16
CN106535494B (zh) 2018-03-09
JP2017055030A (ja) 2017-03-16
EP3141328A1 (en) 2017-03-15
US9849535B2 (en) 2017-12-26
JP5910784B1 (ja) 2016-04-27
CN106535494A (zh) 2017-03-22
EP3141328B1 (en) 2020-04-22

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