PL3330338T3 - Ciekła kompozycja klejowa, folia klejąca i sposób łączenia klejowego - Google Patents

Ciekła kompozycja klejowa, folia klejąca i sposób łączenia klejowego

Info

Publication number
PL3330338T3
PL3330338T3 PL16202265T PL16202265T PL3330338T3 PL 3330338 T3 PL3330338 T3 PL 3330338T3 PL 16202265 T PL16202265 T PL 16202265T PL 16202265 T PL16202265 T PL 16202265T PL 3330338 T3 PL3330338 T3 PL 3330338T3
Authority
PL
Poland
Prior art keywords
adhesive
bonding method
liquid
sheet
composition
Prior art date
Application number
PL16202265T
Other languages
English (en)
Inventor
Junichi Sawanobori
Original Assignee
Henkel Ag & Co. Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co. Kgaa filed Critical Henkel Ag & Co. Kgaa
Publication of PL3330338T3 publication Critical patent/PL3330338T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F20/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
PL16202265T 2016-12-05 2016-12-05 Ciekła kompozycja klejowa, folia klejąca i sposób łączenia klejowego PL3330338T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP16202265.1A EP3330338B1 (en) 2016-12-05 2016-12-05 Liquid adhesive composition, adhesive sheet, and adhesive bonding method

Publications (1)

Publication Number Publication Date
PL3330338T3 true PL3330338T3 (pl) 2020-08-10

Family

ID=57539029

Family Applications (1)

Application Number Title Priority Date Filing Date
PL16202265T PL3330338T3 (pl) 2016-12-05 2016-12-05 Ciekła kompozycja klejowa, folia klejąca i sposób łączenia klejowego

Country Status (11)

Country Link
US (1) US11193050B2 (pl)
EP (1) EP3330338B1 (pl)
JP (1) JP7076448B2 (pl)
KR (1) KR102337053B1 (pl)
CN (1) CN110023445B (pl)
ES (1) ES2787001T3 (pl)
HU (1) HUE050219T2 (pl)
MX (1) MX2019006472A (pl)
PL (1) PL3330338T3 (pl)
TW (1) TWI746703B (pl)
WO (1) WO2018104074A1 (pl)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200064061A (ko) * 2017-10-04 2020-06-05 닛뽄 가야쿠 가부시키가이샤 자외선 경화형 접착제 조성물, 그 경화물 및 자외선 경화형 접착제 조성물을 사용한 광학 부재의 제조 방법
KR102554029B1 (ko) * 2019-02-07 2023-07-11 (주)이녹스첨단소재 폴더블 디스플레이용 점착제 조성물
JP7387400B2 (ja) * 2019-11-15 2023-11-28 ヘンケルジャパン株式会社 Ｕｖ熱硬化型接着剤組成物
KR102347872B1 (ko) * 2019-11-21 2022-01-06 주식회사 엘지화학 표면 보호 필름
WO2023189684A1 (ja) * 2022-03-28 2023-10-05 三井化学株式会社 光硬化性組成物、立体造形物、歯科用製品及びスプリント

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55116772A (en) * 1979-03-01 1980-09-08 Kanegafuchi Chem Ind Co Ltd Primer composition
US4446259A (en) * 1982-09-30 1984-05-01 E. I. Du Pont De Nemours And Company Coating composition of a blend of a glycidyl acrylic polymer and a reactive polysiloxane
EP0159683A3 (en) * 1984-04-23 1987-09-02 DeSOTO, INC. Electron beam-curable release coatings
JP2000038547A (ja) * 1998-07-24 2000-02-08 Mitsubishi Rayon Co Ltd 光硬化型接着剤組成物およびそれを用いた光学部材
WO2000046315A1 (en) * 1999-02-08 2000-08-10 Hitachi Chemical Co., Ltd. Adhesive, electrode-connecting structure, and method of connecting electrodes
FR2826664B1 (fr) * 2001-06-29 2005-09-09 Rhodia Chimie Sa Procede de realisation d'un revetement etanche de surfaces pour batiment comprenant un membrane silicone reticulee et etanche, colle et kit pret a l'emploi pour la mise en oeuvre de ce procede
JP4721995B2 (ja) * 2006-09-12 2011-07-13 株式会社トンボ鉛筆 ボールペン型接着具
US20080085417A1 (en) * 2006-09-13 2008-04-10 Sumitomo Chemical Company, Limited Optical film coated with adhesive
JP2011140571A (ja) 2010-01-07 2011-07-21 Nitto Denko Corp 粘着剤組成物および粘着シート
CN101812278A (zh) * 2010-05-20 2010-08-25 上海西怡新材料科技有限公司 紫外固化有机硅-丙烯酸树脂电子胶及其应用
CN102399525B (zh) * 2010-09-10 2012-11-28 宏峰行化工(深圳)有限公司 一种软包装复合膜紫外光固化水性胶粘剂及其制备方法
JP5161283B2 (ja) 2010-10-14 2013-03-13 電気化学工業株式会社 電子部品の製造方法
JP2012172064A (ja) 2011-02-22 2012-09-10 Nitto Denko Corp 紫外線硬化型光学樹脂接着剤組成物
JP5804867B2 (ja) * 2011-09-16 2015-11-04 大日本印刷株式会社 液状粘着剤組成物、この組成物が封入された光学部材及びこの光学部材の製造方法
WO2013085132A1 (ko) * 2011-12-07 2013-06-13 제일모직 주식회사 광경화형 점착제 조성물 및 이를 포함하는 디스플레이 장치
WO2013103091A1 (ja) * 2012-01-06 2013-07-11 日東電工株式会社 水生生物付着防止粘着テープ
US20150104601A1 (en) 2012-05-31 2015-04-16 3M Innovative Properties Company Adhesive article
JP5765303B2 (ja) * 2012-08-20 2015-08-19 信越化学工業株式会社 光学用感圧接着剤組成物
KR102326631B1 (ko) * 2013-05-30 2021-11-15 산요가세이고교 가부시키가이샤 감광성 수지 조성물, 포토스페이서, 컬러 필터용 보호막, 및, 터치 패널의 보호막 혹은 절연막
KR101623771B1 (ko) * 2014-10-16 2016-05-25 도레이첨단소재 주식회사 저유전율을 갖는 터치스크린 패널용 점착 수지 조성물 및 이를 이용한 점착필름
JP6420480B2 (ja) 2014-11-18 2018-11-07 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 光硬化性接着剤組成物、その調製およびその使用
WO2018003981A1 (ja) 2016-07-01 2018-01-04 デンカ株式会社 組成物

Also Published As

Publication number Publication date
EP3330338B1 (en) 2020-02-26
US20190284458A1 (en) 2019-09-19
MX2019006472A (es) 2019-08-22
EP3330338A1 (en) 2018-06-06
JP2020500986A (ja) 2020-01-16
HUE050219T2 (hu) 2020-11-30
CN110023445B (zh) 2021-09-14
TWI746703B (zh) 2021-11-21
ES2787001T3 (es) 2020-10-14
TW201829701A (zh) 2018-08-16
KR102337053B1 (ko) 2021-12-07
US11193050B2 (en) 2021-12-07
JP7076448B2 (ja) 2022-05-27
CN110023445A (zh) 2019-07-16
KR20190089030A (ko) 2019-07-29
WO2018104074A1 (en) 2018-06-14

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