PL2342553T3 - Sposób analitycznej kontroli elektrolitu do osadzania powłoki metalicznej - Google Patents

Sposób analitycznej kontroli elektrolitu do osadzania powłoki metalicznej

Info

Publication number
PL2342553T3
PL2342553T3 PL09748250T PL09748250T PL2342553T3 PL 2342553 T3 PL2342553 T3 PL 2342553T3 PL 09748250 T PL09748250 T PL 09748250T PL 09748250 T PL09748250 T PL 09748250T PL 2342553 T3 PL2342553 T3 PL 2342553T3
Authority
PL
Poland
Prior art keywords
deposit
metal coating
analytical control
deposition electrolyte
electrolyte serving
Prior art date
Application number
PL09748250T
Other languages
English (en)
Inventor
Philip Hartmann
Michael Jonat
Mathias Wuensche
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of PL2342553T3 publication Critical patent/PL2342553T3/pl

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N17/00—Investigating resistance of materials to the weather, to corrosion, or to light
    • G01N17/02—Electrochemical measuring systems for weathering, corrosion or corrosion-protection measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • G01N27/42—Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
PL09748250T 2008-11-05 2009-10-26 Sposób analitycznej kontroli elektrolitu do osadzania powłoki metalicznej PL2342553T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008056470A DE102008056470B3 (de) 2008-11-05 2008-11-05 Verfahren zum Untersuchen einer Metallschicht und Verfahren zur analytischen Kontrolle eines zum Abscheiden der Metallschicht dienenden Abscheideelektrolyten
PCT/EP2009/007741 WO2010051937A1 (en) 2008-11-05 2009-10-26 A method of inspecting a metal coating and a method for analytical control of a deposition electrolyte serving to deposit said metal coating
EP09748250A EP2342553B1 (en) 2008-11-05 2009-10-26 Method for analytical control of a deposition electrolyte serving to deposit said metal coating

Publications (1)

Publication Number Publication Date
PL2342553T3 true PL2342553T3 (pl) 2013-08-30

Family

ID=41432780

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09748250T PL2342553T3 (pl) 2008-11-05 2009-10-26 Sposób analitycznej kontroli elektrolitu do osadzania powłoki metalicznej

Country Status (11)

Country Link
US (1) US8894835B2 (pl)
EP (1) EP2342553B1 (pl)
JP (1) JP5211247B2 (pl)
KR (1) KR101513333B1 (pl)
CN (1) CN102203599B (pl)
BR (1) BRPI0921282B1 (pl)
DE (1) DE102008056470B3 (pl)
ES (1) ES2409261T3 (pl)
PL (1) PL2342553T3 (pl)
TW (1) TWI475206B (pl)
WO (1) WO2010051937A1 (pl)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008056470B3 (de) 2008-11-05 2010-04-22 Atotech Deutschland Gmbh Verfahren zum Untersuchen einer Metallschicht und Verfahren zur analytischen Kontrolle eines zum Abscheiden der Metallschicht dienenden Abscheideelektrolyten
US9616142B2 (en) * 2009-08-03 2017-04-11 The Research Foundation For The State University Of New York Electrochemical eradication of microbes on surfaces of objects
US20110155582A1 (en) 2009-11-18 2011-06-30 Tremmel Robert A Semi-Bright Nickel Plating Bath and Method of Using Same
CN101949879A (zh) * 2010-09-14 2011-01-19 东南大学 带有搅拌功能的电化学电解池
DE102010055968A1 (de) 2010-12-23 2012-06-28 Coventya Spa Substrat mit korrosionsbeständigem Überzug und Verfahren zu dessen Herstellung
CN103792181A (zh) * 2013-11-08 2014-05-14 燕山大学 评价富锌涂层阴极保护性能的恒电流溶解方法
DE102014207778B3 (de) * 2014-04-25 2015-05-21 Kiesow Dr. Brinkmann GmbH & Co. KG Verwendung einer Mischung zur Verwendung in einem galvanischen Bad oder eines galvanischen Bades zur Herstellung einer Glanznickelschicht sowie Verfahren zur Herstellung eines Artikels mit einer Glanznickelschicht
DE102015105410A1 (de) * 2015-04-09 2016-10-13 Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG Vorrichtung zur Überwachung der Auflösung eines Probenmaterials
DE102016013792A1 (de) 2016-11-21 2018-05-24 Atotech Deutschland Gmbh Verfahren zur Bewertung des Korrosionsverhaltens eines Prüfkörpers
JP2020500631A (ja) 2016-12-19 2020-01-16 ザ プロクター アンド ギャンブル カンパニーＴｈｅ Ｐｒｏｃｔｅｒ ＆ Ｇａｍｂｌｅ Ｃｏｍｐａｎｙ 吸収性コアを有する吸収性物品
JP7291911B2 (ja) * 2019-05-30 2023-06-16 長野県 電気ニッケルめっき液中の添加剤濃度推定方法
CN113514528A (zh) * 2021-03-10 2021-10-19 首钢集团有限公司 一种热镀锌板抑制层致密性的测量方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4132605A (en) * 1976-12-27 1979-01-02 Rockwell International Corporation Method for evaluating the quality of electroplating baths
JPS55149049A (en) * 1979-05-10 1980-11-20 Nippon Paint Co Ltd Testing method for corrosion evaluation of coated metal material and its apparatus
US4479852A (en) * 1983-01-21 1984-10-30 International Business Machines Corporation Method for determination of concentration of organic additive in plating bath
US5523182A (en) * 1992-11-12 1996-06-04 Ovonic Battery Company, Inc. Enhanced nickel hydroxide positive electrode materials for alkaline rechargeable electrochemical cells
DE69630493T2 (de) * 1995-08-24 2004-05-06 Matsushita Electric Industrial Co., Ltd., Kadoma Metalloberflächenzustandsevaluationsmethode und Halbleiterproduktionsmethode
US6899805B2 (en) * 1998-05-01 2005-05-31 Semitool, Inc. Automated chemical management system executing improved electrolyte analysis method
US6280602B1 (en) 1999-10-20 2001-08-28 Advanced Technology Materials, Inc. Method and apparatus for determination of additives in metal plating baths
US6808611B2 (en) * 2002-06-27 2004-10-26 Applied Materials, Inc. Methods in electroanalytical techniques to analyze organic components in plating baths
US6758955B2 (en) * 2002-12-06 2004-07-06 Advanced Technology Materials, Inc. Methods for determination of additive concentration in metal plating baths
JP2004323971A (ja) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 改良された浴分析
DE102008056470B3 (de) 2008-11-05 2010-04-22 Atotech Deutschland Gmbh Verfahren zum Untersuchen einer Metallschicht und Verfahren zur analytischen Kontrolle eines zum Abscheiden der Metallschicht dienenden Abscheideelektrolyten

Also Published As

Publication number Publication date
TWI475206B (zh) 2015-03-01
JP2012507693A (ja) 2012-03-29
JP5211247B2 (ja) 2013-06-12
KR20110082545A (ko) 2011-07-19
CN102203599B (zh) 2013-10-30
US20110215003A1 (en) 2011-09-08
DE102008056470B3 (de) 2010-04-22
CN102203599A (zh) 2011-09-28
ES2409261T3 (es) 2013-06-26
EP2342553B1 (en) 2013-03-27
KR101513333B1 (ko) 2015-04-21
TW201027062A (en) 2010-07-16
WO2010051937A1 (en) 2010-05-14
BRPI0921282B1 (pt) 2019-12-10
US8894835B2 (en) 2014-11-25
BRPI0921282A2 (pt) 2016-03-08
EP2342553A1 (en) 2011-07-13

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