PL2233519T3 - Poliester odporny na żarzący się drut - Google Patents
Poliester odporny na żarzący się drutInfo
- Publication number
- PL2233519T3 PL2233519T3 PL09156428T PL09156428T PL2233519T3 PL 2233519 T3 PL2233519 T3 PL 2233519T3 PL 09156428 T PL09156428 T PL 09156428T PL 09156428 T PL09156428 T PL 09156428T PL 2233519 T3 PL2233519 T3 PL 2233519T3
- Authority
- PL
- Poland
- Prior art keywords
- glow
- antimony
- tetrabromobisphenol
- molding composition
- resistant polyester
- Prior art date
Links
- 229920000728 polyester Polymers 0.000 title abstract 3
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 abstract 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 abstract 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 2
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 abstract 1
- DYIZJUDNMOIZQO-UHFFFAOYSA-N 4,5,6,7-tetrabromo-2-[2-(4,5,6,7-tetrabromo-1,3-dioxoisoindol-2-yl)ethyl]isoindole-1,3-dione Chemical compound O=C1C(C(=C(Br)C(Br)=C2Br)Br)=C2C(=O)N1CCN1C(=O)C2=C(Br)C(Br)=C(Br)C(Br)=C2C1=O DYIZJUDNMOIZQO-UHFFFAOYSA-N 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract 1
- 239000004793 Polystyrene Substances 0.000 abstract 1
- 229910052787 antimony Inorganic materials 0.000 abstract 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract 1
- JGDFBJMWFLXCLJ-UHFFFAOYSA-N copper chromite Chemical compound [Cu]=O.[Cu]=O.O=[Cr]O[Cr]=O JGDFBJMWFLXCLJ-UHFFFAOYSA-N 0.000 abstract 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 abstract 1
- 239000013538 functional additive Substances 0.000 abstract 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 238000001746 injection moulding Methods 0.000 abstract 1
- 150000005526 organic bromine compounds Chemical class 0.000 abstract 1
- 229920002223 polystyrene Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- NSBGJRFJIJFMGW-UHFFFAOYSA-N trisodium;stiborate Chemical compound [Na+].[Na+].[Na+].[O-][Sb]([O-])([O-])=O NSBGJRFJIJFMGW-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/02—Halogenated hydrocarbons
- C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
- C08K5/3417—Five-membered rings condensed with carbocyclic rings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Resistance Heating (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09156428A EP2233519B1 (de) | 2009-03-27 | 2009-03-27 | Glühdrahtbeständige Polyester |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2233519T3 true PL2233519T3 (pl) | 2012-01-31 |
Family
ID=40910871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL09156428T PL2233519T3 (pl) | 2009-03-27 | 2009-03-27 | Poliester odporny na żarzący się drut |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2233519B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5465056B2 (cg-RX-API-DMAC7.html) |
| CN (1) | CN101845201B (cg-RX-API-DMAC7.html) |
| AT (1) | ATE522568T1 (cg-RX-API-DMAC7.html) |
| PL (1) | PL2233519T3 (cg-RX-API-DMAC7.html) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2676799B1 (en) * | 2011-03-18 | 2014-06-11 | Mitsubishi Chemical Europe GmbH | Thermoplastic resin composition, resin molded article, and method of manufactoring resin molded article with plated layer |
| CN103154135B (zh) * | 2011-03-18 | 2014-10-15 | 三菱化学欧洲合资公司 | 生产电路载体的方法 |
| BR112014015399A8 (pt) * | 2011-12-22 | 2017-07-04 | 3M Innovative Properties Co | processo de fiação por sopro em fusão, fibras poliméricas e estruturas fibrosas fiadas por sopro em fusão de encolhimento baixo, e composições poliméricas fiáveis por sopro em fusão |
| JP5937855B2 (ja) * | 2012-03-14 | 2016-06-22 | ナミックス株式会社 | 樹脂組成物 |
| EP2639262A1 (en) * | 2012-03-16 | 2013-09-18 | Mitsubishi Chemical Europe GmbH | Thermoplastic composition |
| US9365693B2 (en) | 2012-03-23 | 2016-06-14 | Mitsubishi Engineering-Plastics Corporation | Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer |
| US20140142571A1 (en) * | 2012-11-21 | 2014-05-22 | Ticona Llc | Liquid Crystalline Polymer Composition for Melt-Extruded Substrates |
| KR101339640B1 (ko) * | 2013-04-02 | 2013-12-09 | 김한주 | 레이저 직접 구조화 방법 |
| JP6196478B2 (ja) * | 2013-06-11 | 2017-09-13 | 三菱エンジニアリングプラスチックス株式会社 | 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法 |
| EP2886605B2 (de) * | 2013-12-20 | 2021-09-01 | Ems-Chemie Ag | Kunststoffformmasse und deren Verwendung |
| EP2942367B1 (de) * | 2014-05-05 | 2018-07-11 | LANXESS Deutschland GmbH | Polyester Zusammensetzungen |
| KR101770350B1 (ko) * | 2014-08-29 | 2017-08-22 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체 |
| WO2017038409A1 (ja) * | 2015-09-03 | 2017-03-09 | 三菱エンジニアリングプラスチックス株式会社 | レーザーダイレクトストラクチャリング用ポリエステル系樹脂組成物 |
| JP6667953B2 (ja) * | 2016-03-11 | 2020-03-18 | 三菱エンジニアリングプラスチックス株式会社 | 樹脂成形品の製造方法 |
| CN107417977B (zh) * | 2017-07-19 | 2019-07-12 | 广州铂钡信息科技有限公司 | 一种用于聚合物的添加剂及其制备方法 |
| WO2022044947A1 (ja) * | 2020-08-25 | 2022-03-03 | ポリプラスチックス株式会社 | 難燃性樹脂組成物及びその成形品 |
| CN115989276A (zh) * | 2020-08-25 | 2023-04-18 | 宝理塑料株式会社 | 阻燃性树脂组合物和其成型品 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1580834A (cg-RX-API-DMAC7.html) | 1968-01-04 | 1969-09-12 | ||
| US3644574A (en) | 1969-07-17 | 1972-02-22 | Eastman Kodak Co | Shaped articles of blends of polyesters and polyvinyls |
| US4013613A (en) | 1971-10-01 | 1977-03-22 | General Electric Company | Reinforced intercrystalline thermoplastic polyester compositions |
| US4035958A (en) | 1973-03-30 | 1977-07-19 | Tokyo Kosei Kaken Co. Ltd. | Mobile floor cleaning and polishing device |
| JPS5039599B2 (cg-RX-API-DMAC7.html) | 1973-03-30 | 1975-12-18 | ||
| DE2407776A1 (de) | 1974-02-19 | 1975-09-04 | Licentia Gmbh | Schaltung zur regelung der betriebsspannung fuer die transistor-zeilenendstufe eines fernsehempfaengers |
| DE2715932A1 (de) | 1977-04-09 | 1978-10-19 | Bayer Ag | Schnellkristallisierende poly(aethylen/alkylen)-terephthalate |
| DE3631539A1 (de) | 1986-09-17 | 1988-03-24 | Bayer Ag | Alterungsbestaendige thermoplastische formmassen mit guter zaehigkeit |
| DE3631540A1 (de) | 1986-09-17 | 1988-03-24 | Bayer Ag | Thermoplastische formmassen mit hoher alterungsbestaendigkeit und guter tieftemperaturzaehigkeit |
| DE3704655A1 (de) | 1987-02-14 | 1988-08-25 | Bayer Ag | Teilchenfoermige mehrphasenpolymerisate |
| DE3704657A1 (de) | 1987-02-14 | 1988-08-25 | Bayer Ag | Teilchenfoermige mehrphasenpolymerisate |
| DE3738143A1 (de) | 1987-11-10 | 1989-05-18 | Bayer Ag | Verwendung von redoxpfropfpolymerisaten zur verbesserung der benzinbestaendigkeit von thermoplastischen, aromatischen polycarbonat- und/oder polyestercarbonat-formmassen |
| DE4236122A1 (de) | 1992-10-27 | 1994-04-28 | Bayer Ag | Flammgeschützte, mineralgefüllte, thermoplastische Formmassen mit hoher Kriechstromfestigkeit |
| DE19643280A1 (de) | 1996-10-21 | 1998-04-23 | Basf Ag | Flammgeschützte Formmassen |
| DE19731346C2 (de) | 1997-06-06 | 2003-09-25 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und ein Verfahren zu deren Herstellung |
| DE19723734C2 (de) | 1997-06-06 | 2002-02-07 | Gerhard Naundorf | Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial und Verfahren zu ihrer Herstellung |
| WO2000035259A2 (de) | 1998-12-10 | 2000-06-15 | Gerhard Naundorf | Verfahren zur herstellung von leiterbahnstrukturen |
| MXPA01007968A (es) | 1999-02-09 | 2003-07-14 | Univ Virginia | Compuestos derivados del felbamato. |
| DE10132092A1 (de) | 2001-07-05 | 2003-01-23 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und Verfahren zu ihrer Herstellung |
| WO2003005784A2 (de) | 2001-07-05 | 2003-01-16 | Lpkf Laser & Electronics Ag | Leiterbahnstrukturen und verfahren zu ihrer herstellung |
| EP1288260A1 (en) * | 2001-08-29 | 2003-03-05 | Albemarle Corporation | Flame retardant compositions |
| CN1823124A (zh) * | 2003-05-21 | 2006-08-23 | 韦尔曼公司 | 慢结晶聚酯树脂 |
| DE102004003891A1 (de) * | 2004-01-27 | 2005-08-11 | Mitsubishi Polyester Film Gmbh | Orientierte, mittels elektromagnetischer Strahlung strukturierbare Folie aus thermoplastischem Polyester, Verfahren zu ihrer Herstellung und ihre Verwendung |
| KR100874996B1 (ko) * | 2004-06-08 | 2008-12-19 | 란세스 도이치란트 게엠베하 | 열가소성 폴리에스테르를 기재로 하는 유동성이 개선된성형 화합물 |
| JP4692108B2 (ja) * | 2004-07-07 | 2011-06-01 | 三菱エンジニアリングプラスチックス株式会社 | 絶縁材料部品 |
| DE102004039148A1 (de) | 2004-08-12 | 2006-02-23 | Clariant Gmbh | Glühdrahtbeständige flammwidrige Polymere |
| DE102004048876A1 (de) | 2004-09-13 | 2006-03-30 | Bayer Ag | Halogenfreie flammgeschützte thermoplastische Formmassen auf Basis von Polyamid mit erhöhter Glühdrahtbeständigkeit |
| US7547849B2 (en) * | 2005-06-15 | 2009-06-16 | E.I. Du Pont De Nemours And Company | Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto |
| JP2008019400A (ja) * | 2006-07-14 | 2008-01-31 | Wintech Polymer Ltd | 難燃性ポリブチレンテレフタレート樹脂組成物 |
| JP2008140972A (ja) * | 2006-12-01 | 2008-06-19 | Auto Network Gijutsu Kenkyusho:Kk | 導電回路を有する成形品及びその製造方法 |
-
2009
- 2009-03-27 EP EP09156428A patent/EP2233519B1/de active Active
- 2009-03-27 AT AT09156428T patent/ATE522568T1/de active
- 2009-03-27 PL PL09156428T patent/PL2233519T3/pl unknown
-
2010
- 2010-03-23 CN CN201010140122.2A patent/CN101845201B/zh not_active Expired - Fee Related
- 2010-03-26 JP JP2010072467A patent/JP5465056B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| ATE522568T1 (de) | 2011-09-15 |
| CN101845201A (zh) | 2010-09-29 |
| EP2233519B1 (de) | 2011-08-31 |
| CN101845201B (zh) | 2014-04-09 |
| EP2233519A1 (de) | 2010-09-29 |
| JP2010229410A (ja) | 2010-10-14 |
| JP5465056B2 (ja) | 2014-04-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| PL2233519T3 (pl) | Poliester odporny na żarzący się drut | |
| JP2010229410A5 (cg-RX-API-DMAC7.html) | ||
| EP2947122A4 (en) | RESIN COMPOSITION, PREPREG, LAMINATE, METAL FILM-COATED LAMINATE AND PCB | |
| DE502006006191D1 (de) | Stromrichterschaltung mit verteilten energiespeichern | |
| ATE456617T1 (de) | Wärmeleitfähige polyamide | |
| JP2008542840A5 (cg-RX-API-DMAC7.html) | ||
| ATE455818T1 (de) | Gegenstände aus zusammensetzungen auf basis von weichgemachtem thermoplastischem polyolefin | |
| JP2010153813A5 (ja) | 発光装置 | |
| TW200735425A (en) | Light-emitting diode package and manufacturing method thereof | |
| ATE531241T1 (de) | Bestückte leiterplatte | |
| FI20060447A7 (fi) | Menetelmä elektronisilla komponenteilla upotetun piirilevyn valmistamiseksi | |
| EP3026144A4 (en) | Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board | |
| EP2682398A4 (en) | PHOSPHORATE-COMPATIBLE OLIGOMER COMPOSITION, HARDENABLE RESIN COMPOSITION, SUBSTANCE AND CIRCUIT PIPE RESULTING FROM THEIR HARDENING | |
| MX2015004038A (es) | Viga mixta de acero. | |
| WO2013009113A3 (en) | Epoxy resin compound and radiant heat circuit board using the same | |
| ATE389445T1 (de) | Spielzeug | |
| MX2016003328A (es) | Composicion de multiples capas que comprende una capa de poliester. | |
| DE502006004213D1 (de) | Bauteil mit einer elektrischen Flachbaugruppe | |
| ATE358697T1 (de) | Flammwidrige epoxyprepregs, laminate und leiterplatten mit verbesserter wärmestabilität | |
| DE502006005568D1 (de) | Induktives Bauteil mit optimierter Wärmeableitung | |
| TWD127765S1 (zh) | 發光二極體(led) | |
| TW200738840A (en) | Polyimide resin composition and metal polyimide laminate | |
| PE20070092A1 (es) | Unidad electronica de control y proceso para su produccion | |
| DE602006017105D1 (de) | Berührungssichere buchse | |
| USD715748S1 (en) | Inverted floating core heat sink |