PL1850646T3 - Wanna do lutowania strumieniem - Google Patents
Wanna do lutowania strumieniemInfo
- Publication number
- PL1850646T3 PL1850646T3 PL06713119T PL06713119T PL1850646T3 PL 1850646 T3 PL1850646 T3 PL 1850646T3 PL 06713119 T PL06713119 T PL 06713119T PL 06713119 T PL06713119 T PL 06713119T PL 1850646 T3 PL1850646 T3 PL 1850646T3
- Authority
- PL
- Poland
- Prior art keywords
- solder bath
- jet solder
- jet
- bath
- solder
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005030957 | 2005-02-07 | ||
EP06713119A EP1850646B1 (en) | 2005-02-07 | 2006-02-06 | Jet solder bath |
PCT/JP2006/301976 WO2006082960A1 (ja) | 2005-02-07 | 2006-02-06 | 噴流はんだ槽 |
Publications (1)
Publication Number | Publication Date |
---|---|
PL1850646T3 true PL1850646T3 (pl) | 2011-01-31 |
Family
ID=36777337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL06713119T PL1850646T3 (pl) | 2005-02-07 | 2006-02-06 | Wanna do lutowania strumieniem |
Country Status (7)
Country | Link |
---|---|
US (1) | US8091758B2 (pl) |
EP (1) | EP1850646B1 (pl) |
JP (1) | JP4941289B2 (pl) |
CN (1) | CN101112139B (pl) |
DE (1) | DE602006015776D1 (pl) |
PL (1) | PL1850646T3 (pl) |
WO (1) | WO2006082960A1 (pl) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011105034A1 (ja) * | 2010-02-26 | 2011-09-01 | パナソニック株式会社 | 半田付け装置 |
KR20130059760A (ko) * | 2011-11-29 | 2013-06-07 | 삼성전기주식회사 | 솔더범프 형성장치 및 이를 구비하는 솔더링 설비 |
JP5601342B2 (ja) | 2012-04-27 | 2014-10-08 | 千住金属工業株式会社 | 偏流板及び噴流装置 |
DE102012013209A1 (de) * | 2012-07-04 | 2014-01-09 | Erwin Quarder Systemtechnik Gmbh | Lötdüse für eine Lötvorrichtung |
TWM454066U (zh) * | 2013-01-25 | 2013-05-21 | Inventec Corp | 自動焊接設備 |
DE102014211807A1 (de) * | 2014-06-20 | 2015-12-24 | Robert Bosch Gmbh | Lötvorrichtung und Verfahren zum Löten |
US9370838B2 (en) * | 2014-08-21 | 2016-06-21 | Illinois Tool Works Inc. | Wave soldering nozzle system and method of wave soldering |
DE102016124642B4 (de) | 2016-12-16 | 2023-10-05 | Seho Vermögensverwaltungs Gmbh & Co. Kg | Verfahren und Vorrichtung zum Verlöten von Baugruppen |
CN109719361A (zh) * | 2017-10-31 | 2019-05-07 | 康普技术有限责任公司 | 选择性波焊接的设备和方法 |
US20190366460A1 (en) * | 2018-06-01 | 2019-12-05 | Progress Y&Y Corp. | Soldering apparatus and solder nozzle module thereof |
US10780516B2 (en) * | 2018-06-14 | 2020-09-22 | Illinois Tool Works Inc. | Wave solder nozzle with automated adjustable sliding plate to vary solder wave width |
JP6590232B1 (ja) * | 2019-04-22 | 2019-10-16 | 千住金属工業株式会社 | はんだ付け装置及びはんだ付け方法 |
US11389888B2 (en) | 2020-08-17 | 2022-07-19 | Illinois Tool Works Inc. | Wave solder nozzle with automated exit wing |
CN115415630B (zh) * | 2022-08-30 | 2024-05-14 | 西安空间无线电技术研究所 | 一种用于自动搪锡设备的锡锅结构 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3752383A (en) * | 1971-11-11 | 1973-08-14 | Technical Devices Co | Soldering apparatus |
JPS521771B2 (pl) | 1972-03-25 | 1977-01-18 | ||
DE2515437A1 (de) | 1974-04-16 | 1975-11-20 | Ici Ltd | Verfahren zur kristallisation von bis(4-chlorphenyl)sulfon |
JPS513632A (ja) | 1974-06-28 | 1976-01-13 | Kenkoo Kk | Ingayakitsukeho |
JPS62259665A (ja) | 1986-01-20 | 1987-11-12 | Asahi Chem Res Lab Ltd | 溶融半田の噴流方法及び装置 |
JPS6471572A (en) * | 1987-09-09 | 1989-03-16 | Tamura Seisakusho Kk | Method for separating solder oxide |
JPH0619968A (ja) | 1991-09-13 | 1994-01-28 | Oki Electric Ind Co Ltd | 専門用語自動抽出装置 |
FR2682903B1 (fr) * | 1991-10-28 | 1994-01-21 | Jacqueline Brizais | Dispositif de controle de hauteur de vague dans une installation de soudage a la vague. |
JPH0619968U (ja) * | 1992-08-20 | 1994-03-15 | 株式会社コウキテクノ | 噴流式半田槽 |
JP4647150B2 (ja) * | 2001-08-07 | 2011-03-09 | 千住金属工業株式会社 | 酸化物の分離装置 |
JP2004009127A (ja) * | 2002-06-11 | 2004-01-15 | Senju Metal Ind Co Ltd | 噴流はんだ槽 |
JP4136887B2 (ja) * | 2003-06-17 | 2008-08-20 | 千住システムテクノロジー株式会社 | 半田槽用ポンプ及びそれを使用する半田槽 |
DE602004027279D1 (de) * | 2003-10-10 | 2010-07-01 | Senju Metal Industry Co | Strahllotbehältnis |
DE102004040405B4 (de) | 2004-08-19 | 2008-11-13 | Nec Europe Ltd. | Verfahren zur Optimierung des Energieverbrauchs einer Station in einem drahtlosen Netzwerk |
-
2006
- 2006-02-06 US US11/883,846 patent/US8091758B2/en active Active
- 2006-02-06 EP EP06713119A patent/EP1850646B1/en active Active
- 2006-02-06 PL PL06713119T patent/PL1850646T3/pl unknown
- 2006-02-06 DE DE602006015776T patent/DE602006015776D1/de active Active
- 2006-02-06 WO PCT/JP2006/301976 patent/WO2006082960A1/ja active Search and Examination
- 2006-02-06 CN CN2006800035682A patent/CN101112139B/zh active Active
- 2006-02-06 JP JP2007501661A patent/JP4941289B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JPWO2006082960A1 (ja) | 2008-08-07 |
US8091758B2 (en) | 2012-01-10 |
WO2006082960A1 (ja) | 2006-08-10 |
CN101112139B (zh) | 2012-01-25 |
EP1850646A4 (en) | 2009-04-08 |
CN101112139A (zh) | 2008-01-23 |
EP1850646B1 (en) | 2010-07-28 |
EP1850646A1 (en) | 2007-10-31 |
DE602006015776D1 (de) | 2010-09-09 |
US20100163599A1 (en) | 2010-07-01 |
JP4941289B2 (ja) | 2012-05-30 |
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