NO982940L - Struktur for Õ skjerme en elektronisk krets mot radiob°lger - Google Patents

Struktur for Õ skjerme en elektronisk krets mot radiob°lger

Info

Publication number
NO982940L
NO982940L NO982940A NO982940A NO982940L NO 982940 L NO982940 L NO 982940L NO 982940 A NO982940 A NO 982940A NO 982940 A NO982940 A NO 982940A NO 982940 L NO982940 L NO 982940L
Authority
NO
Norway
Prior art keywords
shielding
electronic circuit
radio waves
circuit against
against radio
Prior art date
Application number
NO982940A
Other languages
English (en)
Other versions
NO982940D0 (no
NO324072B1 (no
Inventor
Masataka Suzuki
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Publication of NO982940D0 publication Critical patent/NO982940D0/no
Publication of NO982940L publication Critical patent/NO982940L/no
Publication of NO324072B1 publication Critical patent/NO324072B1/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
NO19982940A 1997-06-25 1998-06-24 Struktur for a skjerme en elektronisk krets mot radiobolger NO324072B1 (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9169249A JP2894325B2 (ja) 1997-06-25 1997-06-25 電子回路のシールド構造

Publications (3)

Publication Number Publication Date
NO982940D0 NO982940D0 (no) 1998-06-24
NO982940L true NO982940L (no) 1998-12-28
NO324072B1 NO324072B1 (no) 2007-08-06

Family

ID=15883016

Family Applications (1)

Application Number Title Priority Date Filing Date
NO19982940A NO324072B1 (no) 1997-06-25 1998-06-24 Struktur for a skjerme en elektronisk krets mot radiobolger

Country Status (5)

Country Link
US (1) US6218610B1 (no)
EP (1) EP0888040B1 (no)
JP (1) JP2894325B2 (no)
DE (1) DE69831700T2 (no)
NO (1) NO324072B1 (no)

Families Citing this family (34)

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NL1016549C2 (nl) * 2000-10-06 2002-04-10 Stork Screens Bv Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling.
US6420963B1 (en) * 2001-02-16 2002-07-16 Scientific-Atlanta, Inc. Plastic housing including a conductive liner for use with an electronic device
US6900383B2 (en) * 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
US20050095410A1 (en) * 2001-03-19 2005-05-05 Mazurkiewicz Paul H. Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
JP3883847B2 (ja) * 2001-11-19 2007-02-21 株式会社日立製作所 車載用信号処理装置
WO2005041352A1 (en) * 2003-10-24 2005-05-06 Proofcap Ab Device with integrated antenna for encapsulation of radio electronics and a method for fabrication of such devices
GB2393326A (en) * 2002-09-21 2004-03-24 Hewlett Packard Co Shielding electronic devices from electromagnetic radiation
US6954177B2 (en) * 2002-11-07 2005-10-11 M/A-Com, Inc. Microstrip antenna array with periodic filters for enhanced performance
GB2396748B (en) * 2002-12-24 2006-06-07 Ubinetics Ltd Screening electrical/electronic components
JP4096975B2 (ja) * 2003-12-18 2008-06-04 三菱電機株式会社 携帯無線機
JP2005268428A (ja) * 2004-03-17 2005-09-29 Mitsubishi Electric Corp 基板の電磁シールド構造
US7639183B2 (en) 2004-11-15 2009-12-29 Anritsu Corporation Circularly polarized antenna and radar device using the same
US20070040030A1 (en) * 2005-08-16 2007-02-22 Mastercard International Incorporated Contactless proximity communications apparatus and method
WO2007055028A1 (ja) * 2005-11-14 2007-05-18 Anritsu Corporation 直線偏波アンテナ及びそれを用いるレーダ装置
JP5239556B2 (ja) * 2008-07-01 2013-07-17 富士通株式会社 成型品
US8077480B2 (en) 2008-11-26 2011-12-13 Rosemount Aerospace Inc. Faraday cage for camera
US8228255B2 (en) * 2009-01-02 2012-07-24 Sony Computer Entertainment Inc. Printed circuit board (PCB) antenna assembly with radio frequency (RF) shroud
JP5459551B2 (ja) * 2010-05-12 2014-04-02 スズキ株式会社 高電圧部品の保安構造
US8654537B2 (en) 2010-12-01 2014-02-18 Apple Inc. Printed circuit board with integral radio-frequency shields
US8279625B2 (en) * 2010-12-14 2012-10-02 Apple Inc. Printed circuit board radio-frequency shielding structures
JP5602065B2 (ja) * 2011-03-04 2014-10-08 長野日本無線株式会社 非接触電力伝送装置
US9179538B2 (en) 2011-06-09 2015-11-03 Apple Inc. Electromagnetic shielding structures for selectively shielding components on a substrate
US20130196539A1 (en) * 2012-01-12 2013-08-01 John Mezzalingua Associates, Inc. Electronics Packaging Assembly with Dielectric Cover
JP6145214B2 (ja) * 2013-03-28 2017-06-07 ヒューレット パッカード エンタープライズ デベロップメント エル ピーＨｅｗｌｅｔｔ Ｐａｃｋａｒｄ Ｅｎｔｅｒｐｒｉｓｅ Ｄｅｖｅｌｏｐｍｅｎｔ ＬＰ 電子デバイス用シールド
US20150097737A1 (en) * 2013-10-07 2015-04-09 Corning Optical Communications Rf Llc Modular antenna assemblies for wireless systems
DE102014201550A1 (de) * 2014-01-29 2015-07-30 Siemens Aktiengesellschaft Mehrlagenleiterplatine
WO2017142978A1 (en) * 2016-02-15 2017-08-24 Transsip Inc Emi shielded integrated circuit packages and methods of making the same
DE102016108867A1 (de) * 2016-05-13 2017-11-16 Kathrein Werke Kg Schirmgehäuse für HF-Anwendungen
JP6888667B2 (ja) 2017-03-21 2021-06-16 株式会社村田製作所 アンテナモジュール及び通信装置
US9901016B1 (en) * 2017-04-14 2018-02-20 Kinsus Interconnect Technology Corp. Electromagnetic-interference shielding device
JP7049897B2 (ja) * 2018-04-13 2022-04-07 モレックス エルエルシー アンテナモジュール
US20220232693A1 (en) * 2019-05-23 2022-07-21 Sony Interactive Entertainment Inc. Electronic equipment
US11056441B2 (en) 2019-12-05 2021-07-06 Apple Inc. Electromagnetic shielding of compact electronic modules
EP4060730A1 (en) * 2021-03-18 2022-09-21 Murata Manufacturing Co., Ltd. Shielded electronic component

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Publication number Priority date Publication date Assignee Title
JPS59158016A (ja) * 1983-02-28 1984-09-07 ティーディーケイ株式会社 電磁シ−ルド材料
GB2150749B (en) * 1983-12-03 1987-09-23 Standard Telephones Cables Ltd Integrated circuits
JPS6440910U (no) 1987-09-07 1989-03-10
JPS6489793A (en) 1987-09-30 1989-04-04 Toshiba Corp Chrominance signal processor
JPH02133284A (ja) 1988-11-14 1990-05-22 Tokai T R W Kk 回転式方向制御弁
US5191174A (en) * 1990-08-01 1993-03-02 International Business Machines Corporation High density circuit board and method of making same
JPH04205612A (ja) 1990-11-30 1992-07-27 Toshiba Corp 小型電子機器
JP2825670B2 (ja) * 1990-12-14 1998-11-18 富士通株式会社 高周波回路装置のシールド構造
US5418685A (en) 1992-02-21 1995-05-23 Robert Bosch Gmbh Housing for a control device having a printed circuit board with an electrically and thermally conducting lining
US5455117A (en) * 1992-10-27 1995-10-03 Kansai Paint Co., Ltd. Electromagnetic wave reflection-preventing material and electromagnetic wave reflection-preventing method
JPH06164265A (ja) 1992-11-16 1994-06-10 Toshiba Corp マイクロ波増幅器
JPH0745983A (ja) * 1993-07-28 1995-02-14 Toshiba Corp プリント配線板とシールドケースの接続構造
JPH0745982A (ja) * 1993-07-28 1995-02-14 Toshiba Corp シールドケースとプリント配線板との接続構造
US5687064A (en) * 1993-08-31 1997-11-11 Wireless Access, Inc. Rigidized outer support structure for an integrated circuit card
US5566055A (en) 1995-03-03 1996-10-15 Parker-Hannifin Corporation Shieled enclosure for electronics
DE29515035U1 (de) 1995-09-20 1996-01-11 Siegfried Schaal Metallveredel Abdeckkappe für elektronische Bauteile
JP3491414B2 (ja) * 1995-11-08 2004-01-26 三菱電機株式会社 回路基板
JP2790122B2 (ja) * 1996-05-31 1998-08-27 日本電気株式会社 積層回路基板

Also Published As

Publication number Publication date
DE69831700T2 (de) 2006-07-06
DE69831700D1 (de) 2005-11-03
EP0888040B1 (en) 2005-09-28
EP0888040A3 (en) 1999-08-11
JP2894325B2 (ja) 1999-05-24
NO982940D0 (no) 1998-06-24
NO324072B1 (no) 2007-08-06
JPH1117377A (ja) 1999-01-22
EP0888040A2 (en) 1998-12-30
US6218610B1 (en) 2001-04-17

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Legal Events

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