NO973845L - Paneltilpasset nestet stöttefikstur - Google Patents
Paneltilpasset nestet stöttefiksturInfo
- Publication number
- NO973845L NO973845L NO973845A NO973845A NO973845L NO 973845 L NO973845 L NO 973845L NO 973845 A NO973845 A NO 973845A NO 973845 A NO973845 A NO 973845A NO 973845 L NO973845 L NO 973845L
- Authority
- NO
- Norway
- Prior art keywords
- circuit board
- membrane
- fixture
- vacuum
- casting
- Prior art date
Links
- 239000012528 membrane Substances 0.000 claims description 81
- 238000005266 casting Methods 0.000 claims description 56
- 238000000034 method Methods 0.000 claims description 48
- 239000000463 material Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000012778 molding material Substances 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 8
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 238000012876 topography Methods 0.000 claims description 2
- 230000037303 wrinkles Effects 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims 1
- 238000000605 extraction Methods 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000007639 printing Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 12
- 239000006260 foam Substances 0.000 description 10
- 238000005452 bending Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
- H05K13/0069—Holders for printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/30—Mounting, exchanging or centering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/026—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/26—Moulds or cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0173—Template for holding a PCB having mounted components thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S269/00—Work holders
- Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
- Y10S425/06—Vacuum
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
- Y10S425/119—Perforated or porous
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
- Y10T29/49982—Coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Finishing Walls (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39309295A | 1995-02-22 | 1995-02-22 | |
US08/494,706 US5819394A (en) | 1995-02-22 | 1995-06-26 | Method of making board matched nested support fixture |
PCT/US1996/002412 WO1996026630A1 (en) | 1995-02-22 | 1996-02-21 | Board matched nested support fixture |
Publications (2)
Publication Number | Publication Date |
---|---|
NO973845D0 NO973845D0 (no) | 1997-08-21 |
NO973845L true NO973845L (no) | 1997-10-21 |
Family
ID=27014160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO973845A NO973845L (no) | 1995-02-22 | 1997-08-21 | Paneltilpasset nestet stöttefikstur |
Country Status (9)
Country | Link |
---|---|
US (3) | US5819394A (de) |
EP (1) | EP0811308A4 (de) |
JP (1) | JPH11505667A (de) |
KR (1) | KR19980702424A (de) |
AU (1) | AU715591B2 (de) |
FI (1) | FI973438A (de) |
NO (1) | NO973845L (de) |
NZ (1) | NZ303569A (de) |
WO (1) | WO1996026630A1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5713563A (en) * | 1995-03-21 | 1998-02-03 | Hewlett-Packard Co. | Wire bonding to flexible substrates |
DE69835554T2 (de) * | 1997-04-18 | 2007-08-09 | Ivoclar Vivadent Ag | Verfahren zur Herstellung einer Zahnprothese |
US6142357A (en) * | 1998-10-15 | 2000-11-07 | Mcms, Inc. | Molded selective solder pallet |
DE19907295C1 (de) * | 1999-02-22 | 2001-02-08 | Univ Dresden Tech | Verfahren zur Montage elektronischer und/oder optischer Bauelemente und Baugruppen auf der Rückseite einseitig bestückter flexibler Leiterplatten |
US6806428B1 (en) * | 1999-04-16 | 2004-10-19 | Matsushita Electric Industrial Co., Ltd. | Module component and method of manufacturing the same |
US6713854B1 (en) | 2000-10-16 | 2004-03-30 | Legacy Electronics, Inc | Electronic circuit module with a carrier having a mounting pad array |
US7102892B2 (en) * | 2000-03-13 | 2006-09-05 | Legacy Electronics, Inc. | Modular integrated circuit chip carrier |
US6635308B1 (en) * | 2000-08-22 | 2003-10-21 | Motorola, Inc. | Method and apparatus for electronics board retention during manufacturing operations |
US7337522B2 (en) * | 2000-10-16 | 2008-03-04 | Legacy Electronics, Inc. | Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
US6631798B1 (en) | 2000-11-01 | 2003-10-14 | Micron Technology, Inc. | Printed circuit board support |
KR100897314B1 (ko) * | 2001-03-14 | 2009-05-14 | 레가시 일렉트로닉스, 인크. | 반도체 칩의 3차원 표면 실장 어레이를 갖는 회로 기판을 제조하기 위한 방법 및 장치 |
DE10152330C1 (de) * | 2001-10-26 | 2003-04-03 | Univ Dresden Tech | Verfahren zur rückseitigen Oberflächenmontage von Komponenten |
RU2004117773A (ru) * | 2001-11-23 | 2005-06-10 | Награид Са (Ch) | Способ изготовления модуля, содержащего, по меньшей мере, один электронный компонент |
AU2003258279A1 (en) * | 2002-08-16 | 2004-03-03 | Electro Scientific Industries, Inc. | Modular belt carrier for electronic components |
US6874226B2 (en) * | 2003-03-06 | 2005-04-05 | James Gleason | Circuit board pallet with improved securement pin |
US7093704B2 (en) * | 2004-08-17 | 2006-08-22 | Micron Technology, Inc. | Printed circuit board support |
WO2006076381A2 (en) * | 2005-01-12 | 2006-07-20 | Legacy Electronics, Inc. | Radial circuit board, system, and methods |
US20060213806A1 (en) * | 2005-03-25 | 2006-09-28 | Saunders William J | Configurations of electronic component-carrying apertures in a termination belt |
US20060244190A1 (en) * | 2005-04-29 | 2006-11-02 | Gunter Erdmann | Pin locking method and apparatus for pin-supported workpieces |
US20070177356A1 (en) * | 2006-02-01 | 2007-08-02 | Jeffrey Panek | Three-dimensional cold plate and method of manufacturing same |
US7450387B2 (en) * | 2006-03-02 | 2008-11-11 | Tdk Innoveta Technologies, Inc. | System for cooling electronic components |
JP4293252B2 (ja) * | 2007-03-19 | 2009-07-08 | ダイキン工業株式会社 | 熱交換器用フィン、並びにガイド及びその使用方法 |
DE102008032574A1 (de) * | 2008-07-11 | 2010-01-14 | Brötje-Automation GmbH | Vorrichtung zur Verwendung bei der Herstellung faserverstärkter Bauteile |
US8059411B2 (en) * | 2009-07-29 | 2011-11-15 | GM Global Technology Operations LLC | Vehicular electronics assembly |
JP2015053418A (ja) * | 2013-09-09 | 2015-03-19 | 株式会社東芝 | 半導体製造装置 |
US20150271962A1 (en) * | 2014-03-22 | 2015-09-24 | Quik-Tool Llc | Circuit board suction assembly |
US9656420B2 (en) | 2015-04-30 | 2017-05-23 | International Business Machines Corporation | Bondline control fixture and method of affixing first and second components |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1148468A (fr) * | 1955-12-12 | 1957-12-10 | Applic De La Lumiere Electroni | Procédé permettant de maintenir en place les pièces et éléments d'un montage électrique ou radio-électrique |
US3294392A (en) * | 1963-05-31 | 1966-12-27 | Dunham Tool Company Inc | Vacuum chucking |
FR1406595A (fr) * | 1964-06-09 | 1965-07-23 | Radiotechnique | Procédé de réalisation de dispositifs permettant le maintien provisoire d'éléments électroniques associés à une plaquette de circuit imprimé |
US3899379A (en) * | 1967-10-09 | 1975-08-12 | Western Electric Co | Releasable mounting and method of placing an oriented array of devices on the mounting |
US3608809A (en) * | 1968-08-16 | 1971-09-28 | Western Electric Co | Apparatus for uniform multiple-lead bonding |
US3589704A (en) * | 1968-11-12 | 1971-06-29 | Ibm | Holders for irregularly formed integrated circuit devices |
US3700226A (en) * | 1970-09-24 | 1972-10-24 | Sylvania Electric Prod | Pressurized universal holding device |
GB1458965A (en) * | 1972-12-20 | 1976-12-22 | Hawker Siddeley Dynamics Ltd | Protection of boards carrying components especially electrical circuit boards carrying electronic components |
GB8507073D0 (en) * | 1985-03-19 | 1985-04-24 | Ben Air Ltd | Mould |
IT1191977B (it) * | 1986-06-30 | 1988-03-31 | Selenia Ind Elettroniche | Tecnica per allineare con fotolitografia convenzionale una struttura sul retro di un campione con alta precisione di registrazione |
US4778641A (en) * | 1986-08-11 | 1988-10-18 | National Semiconductor Corporation | Method of molding a pin grid array package |
US4810616A (en) * | 1986-08-25 | 1989-03-07 | Amp Incorporated | Manufacturing method for integrated circuit chip carriers |
US5123985A (en) * | 1986-09-02 | 1992-06-23 | Patricia Evans | Vacuum bagging apparatus and method including a thermoplastic elastomer film vacuum bag |
US4768286A (en) * | 1986-10-01 | 1988-09-06 | Eastman Christensen Co. | Printed circuit packaging for high vibration and temperature environments |
US5106784A (en) * | 1987-04-16 | 1992-04-21 | Texas Instruments Incorporated | Method of making a post molded cavity package with internal dam bar for integrated circuit |
US5166184A (en) * | 1987-10-13 | 1992-11-24 | Mitsui Petrochemical Industries, Ltd. | Epoxy resin, process for the preparation thereof and process for the production of epoxy foam |
US5030407A (en) * | 1988-04-28 | 1991-07-09 | Schlumberger Industries | Method of making cards having graphics elements thereon |
US5037599A (en) * | 1989-06-26 | 1991-08-06 | Basf Aktiengesellschaft | Single diaphragm forming of drapeable thermoplastic impregnated composite materials |
US5054193A (en) * | 1989-08-28 | 1991-10-08 | Hewlett-Packard Company | Printed circuit board fixture and a method of assembling a printed circuit board |
US5045914A (en) * | 1989-12-26 | 1991-09-03 | Motorola, Inc. | Plastic pad array electronic AC device |
JP2504607B2 (ja) * | 1990-06-14 | 1996-06-05 | 株式会社東芝 | 半導体製造装置及び製造方法 |
US5216278A (en) * | 1990-12-04 | 1993-06-01 | Motorola, Inc. | Semiconductor device having a pad array carrier package |
US5218759A (en) * | 1991-03-18 | 1993-06-15 | Motorola, Inc. | Method of making a transfer molded semiconductor device |
US5091769A (en) * | 1991-03-27 | 1992-02-25 | Eichelberger Charles W | Configuration for testing and burn-in of integrated circuit chips |
US5270574A (en) * | 1991-08-01 | 1993-12-14 | Texas Instruments Incorporated | Vacuum micro-chamber for encapsulating a microelectronics device |
CA2071170C (en) * | 1992-06-12 | 1996-11-19 | Claude Comtois | Packaging for protecting printed circuit board and other products |
US5303824A (en) * | 1992-12-04 | 1994-04-19 | International Business Machines Corporations | Solder preform carrier and use |
US5320226A (en) * | 1992-12-09 | 1994-06-14 | Merrill Kenneth V | Reversible snap dome container package |
US5353498A (en) * | 1993-02-08 | 1994-10-11 | General Electric Company | Method for fabricating an integrated circuit module |
US5578158A (en) * | 1994-03-01 | 1996-11-26 | Massachusetts Institute Of Technology | Method and system for forming a composite product from a thermoformable material |
US5576030A (en) * | 1995-10-02 | 1996-11-19 | Lockheed Corporation | Apparatus for fabricating composite parts |
-
1995
- 1995-06-26 US US08/494,706 patent/US5819394A/en not_active Expired - Fee Related
-
1996
- 1996-02-21 NZ NZ303569A patent/NZ303569A/xx unknown
- 1996-02-21 EP EP96906590A patent/EP0811308A4/de not_active Withdrawn
- 1996-02-21 JP JP8525815A patent/JPH11505667A/ja active Pending
- 1996-02-21 KR KR1019970705823A patent/KR19980702424A/ko not_active Application Discontinuation
- 1996-02-21 AU AU49926/96A patent/AU715591B2/en not_active Ceased
- 1996-02-21 WO PCT/US1996/002412 patent/WO1996026630A1/en not_active Application Discontinuation
-
1997
- 1997-03-26 US US08/824,812 patent/US5820983A/en not_active Expired - Fee Related
- 1997-08-21 NO NO973845A patent/NO973845L/no unknown
- 1997-08-21 FI FI973438A patent/FI973438A/fi unknown
-
1998
- 1998-04-01 US US09/053,599 patent/US6093249A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
AU4992696A (en) | 1996-09-11 |
EP0811308A1 (de) | 1997-12-10 |
US6093249A (en) | 2000-07-25 |
AU715591B2 (en) | 2000-02-03 |
KR19980702424A (ko) | 1998-07-15 |
US5819394A (en) | 1998-10-13 |
NO973845D0 (no) | 1997-08-21 |
FI973438A0 (fi) | 1997-08-21 |
US5820983A (en) | 1998-10-13 |
JPH11505667A (ja) | 1999-05-21 |
EP0811308A4 (de) | 1998-05-06 |
WO1996026630A1 (en) | 1996-08-29 |
NZ303569A (en) | 1999-03-29 |
FI973438A (fi) | 1997-08-21 |
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