NO960617L - Symmetrisk differensialtrykkföler med mikrostrukturert overflate - Google Patents

Symmetrisk differensialtrykkföler med mikrostrukturert overflate

Info

Publication number
NO960617L
NO960617L NO960617A NO960617A NO960617L NO 960617 L NO960617 L NO 960617L NO 960617 A NO960617 A NO 960617A NO 960617 A NO960617 A NO 960617A NO 960617 L NO960617 L NO 960617L
Authority
NO
Norway
Prior art keywords
pressure sensor
differential pressure
microstructured surface
symmetric differential
symmetric
Prior art date
Application number
NO960617A
Other languages
English (en)
Norwegian (no)
Other versions
NO960617D0 (no
Inventor
Tapani Ryhanen
Original Assignee
Vaisala Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vaisala Oy filed Critical Vaisala Oy
Publication of NO960617D0 publication Critical patent/NO960617D0/no
Publication of NO960617L publication Critical patent/NO960617L/no

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
NO960617A 1995-02-17 1996-02-16 Symmetrisk differensialtrykkföler med mikrostrukturert overflate NO960617L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI950715A FI100918B (fi) 1995-02-17 1995-02-17 Pintamikromekaaninen, symmetrinen paine-eroanturi

Publications (2)

Publication Number Publication Date
NO960617D0 NO960617D0 (no) 1996-02-16
NO960617L true NO960617L (no) 1996-08-19

Family

ID=8542876

Family Applications (1)

Application Number Title Priority Date Filing Date
NO960617A NO960617L (no) 1995-02-17 1996-02-16 Symmetrisk differensialtrykkföler med mikrostrukturert overflate

Country Status (6)

Country Link
US (1) US5679902A (de)
EP (1) EP0727650B1 (de)
JP (1) JPH08247878A (de)
DE (1) DE69612576T2 (de)
FI (1) FI100918B (de)
NO (1) NO960617L (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6012336A (en) * 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor
DE19648424C1 (de) * 1996-11-22 1998-06-25 Siemens Ag Mikromechanischer Sensor
WO1998023935A1 (de) * 1996-11-28 1998-06-04 Siemens Aktiengesellschaft Verfahren zur herstellung von mikromechanischen sensoren
DE69702745T2 (de) 1997-03-04 2000-12-07 Stmicroelectronics S.R.L., Agrate Brianza Methode zur Herstellung von mikromechanischen Drucksensoren
AU5489799A (en) 1998-08-19 2000-03-14 Wisconsin Alumni Research Foundation Sealed capacitive pressure sensors
FI20000339A (fi) 2000-02-16 2001-08-16 Nokia Mobile Phones Ltd Mikromekaaninen säädettävä kondensaattori ja integroitu säädettävä resonaattori
FI115500B (fi) * 2000-03-21 2005-05-13 Nokia Oyj Menetelmä kalvoanturin valmistamiseksi
FI112644B (fi) * 2000-11-10 2003-12-31 Vaisala Oyj Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi
US6860154B2 (en) 2001-01-16 2005-03-01 Fujikura Ltd. Pressure sensor and manufacturing method thereof
JP4296728B2 (ja) * 2001-07-06 2009-07-15 株式会社デンソー 静電容量型圧力センサおよびその製造方法並びに静電容量型圧力センサに用いるセンサ用構造体
US6774457B2 (en) * 2001-09-13 2004-08-10 Texas Instruments Incorporated Rectangular contact used as a low voltage fuse element
EP1359402B1 (de) * 2002-05-01 2014-10-01 Infineon Technologies AG Drucksensor
US6575026B1 (en) 2002-06-28 2003-06-10 Eastman Kodak Company Measuring absolute static pressure at one or more positions along a microfluidic device
US6790699B2 (en) 2002-07-10 2004-09-14 Robert Bosch Gmbh Method for manufacturing a semiconductor device
US6843121B1 (en) 2003-08-25 2005-01-18 Eastman Kodak Company Measuring absolute static pressure at one or more positions along a microfluidic device
US7100453B2 (en) * 2003-12-30 2006-09-05 Honeywell International Inc. Modified dual diaphragm pressure sensor
US6901807B1 (en) * 2003-12-30 2005-06-07 Honeywell International Inc. Positive and negative pressure sensor
US7231832B2 (en) * 2004-09-13 2007-06-19 United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration System and method for detecting cracks and their location
DE102005004877A1 (de) * 2005-02-03 2006-08-10 Robert Bosch Gmbh Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
US7231829B2 (en) * 2005-03-31 2007-06-19 Medtronic, Inc. Monolithic integrated circuit/pressure sensor on pacing lead
JP4535046B2 (ja) * 2006-08-22 2010-09-01 ヤマハ株式会社 静電容量センサ及びその製造方法
US9616223B2 (en) 2005-12-30 2017-04-11 Medtronic, Inc. Media-exposed interconnects for transducers
FR2947629B1 (fr) * 2009-07-06 2012-03-30 Tronic S Microsystems Dispositif de mesure de pression et son procede de fabrication
US8617960B2 (en) * 2009-12-31 2013-12-31 Texas Instruments Incorporated Silicon microphone transducer
JP2011193342A (ja) * 2010-03-16 2011-09-29 Panasonic Corp Ｍｅｍｓデバイス
US10485435B2 (en) 2012-03-26 2019-11-26 Medtronic, Inc. Pass-through implantable medical device delivery catheter with removeable distal tip
US8904876B2 (en) * 2012-09-29 2014-12-09 Stryker Corporation Flexible piezocapacitive and piezoresistive force and pressure sensors
CN105067178B (zh) * 2015-05-29 2018-01-19 歌尔股份有限公司 一种差分电容式mems压力传感器及其制造方法
JP6582273B2 (ja) * 2015-08-27 2019-10-02 新日本無線株式会社 Ｍｅｍｓ素子の製造方法
US12072252B2 (en) * 2021-09-24 2024-08-27 Apple Inc. Gap-increasing capacitive pressure sensor for increased range

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3310643C2 (de) * 1983-03-24 1986-04-10 Karlheinz Dr. 7801 Schallstadt Ziegler Drucksensor
US5177661A (en) * 1989-01-13 1993-01-05 Kopin Corporation SOI diaphgram sensor
US5490034A (en) * 1989-01-13 1996-02-06 Kopin Corporation SOI actuators and microsensors
US5431057A (en) * 1990-02-12 1995-07-11 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Integratable capacitative pressure sensor
US5188983A (en) * 1990-04-11 1993-02-23 Wisconsin Alumni Research Foundation Polysilicon resonating beam transducers and method of producing the same
DE69113632T2 (de) * 1990-08-17 1996-03-21 Analog Devices Inc Monolithischer beschleunigungsmesser.
DE4227819C2 (de) * 1991-08-22 1996-10-17 Yamatake Honeywell Co Ltd Kapazitiver Drucksensor
US5332469A (en) * 1992-11-12 1994-07-26 Ford Motor Company Capacitive surface micromachined differential pressure sensor
JPH06213747A (ja) * 1993-01-14 1994-08-05 Toyota Motor Corp 容量型半導体センサ
US5316619A (en) * 1993-02-05 1994-05-31 Ford Motor Company Capacitive surface micromachine absolute pressure sensor and method for processing

Also Published As

Publication number Publication date
EP0727650B1 (de) 2001-04-25
EP0727650A2 (de) 1996-08-21
FI100918B (fi) 1998-03-13
US5679902A (en) 1997-10-21
JPH08247878A (ja) 1996-09-27
FI950715A0 (fi) 1995-02-17
DE69612576T2 (de) 2002-05-29
DE69612576D1 (de) 2001-05-31
EP0727650A3 (de) 1996-12-11
FI950715A (fi) 1996-08-18
NO960617D0 (no) 1996-02-16

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Legal Events

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