DE69702745T2 - Methode zur Herstellung von mikromechanischen Drucksensoren - Google Patents

Methode zur Herstellung von mikromechanischen Drucksensoren

Info

Publication number
DE69702745T2
DE69702745T2 DE69702745T DE69702745T DE69702745T2 DE 69702745 T2 DE69702745 T2 DE 69702745T2 DE 69702745 T DE69702745 T DE 69702745T DE 69702745 T DE69702745 T DE 69702745T DE 69702745 T2 DE69702745 T2 DE 69702745T2
Authority
DE
Germany
Prior art keywords
pressure sensors
micromechanical pressure
manufacturing micromechanical
manufacturing
sensors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69702745T
Other languages
English (en)
Other versions
DE69702745D1 (de
Inventor
Benedetto Vigna
Paolo Ferrari
Pietro Montanini
Marco Ferrera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
STMicroelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL filed Critical STMicroelectronics SRL
Publication of DE69702745D1 publication Critical patent/DE69702745D1/de
Application granted granted Critical
Publication of DE69702745T2 publication Critical patent/DE69702745T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
DE69702745T 1997-03-04 1997-03-04 Methode zur Herstellung von mikromechanischen Drucksensoren Expired - Fee Related DE69702745T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP97830093A EP0863392B1 (de) 1997-03-04 1997-03-04 Methode zur Herstellung von mikromechanischen Drucksensoren

Publications (2)

Publication Number Publication Date
DE69702745D1 DE69702745D1 (de) 2000-09-14
DE69702745T2 true DE69702745T2 (de) 2000-12-07

Family

ID=8230584

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69702745T Expired - Fee Related DE69702745T2 (de) 1997-03-04 1997-03-04 Methode zur Herstellung von mikromechanischen Drucksensoren

Country Status (5)

Country Link
US (1) US6527961B1 (de)
EP (1) EP0863392B1 (de)
JP (1) JP4294751B2 (de)
BR (1) BR9800757A (de)
DE (1) DE69702745T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1305639A4 (de) * 2000-05-30 2004-03-24 Input Output Inc Beschleunigungsmesser mit wiedereintretrillen
US6670286B1 (en) * 2002-02-13 2003-12-30 The Regents Of The University Of California Photopolymerization-based fabrication of chemical sensing films
KR100880044B1 (ko) 2006-12-04 2009-01-22 한국전자통신연구원 다기능 미소기전집적시스템 센서의 제조방법
WO2009114818A2 (en) * 2008-03-13 2009-09-17 University Of Utah Research Foundation Methods of forming an embedded cavity for sensors
ITTO20090616A1 (it) * 2009-08-05 2011-02-06 St Microelectronics Srl Procedimento di fabbricazione di dispositivi mems dotati di cavita' sepolte e dispositivo mems cosi' ottenuto
GB0919742D0 (en) * 2009-11-11 2009-12-30 Millipore Corp Optical sensor
WO2011083159A2 (de) * 2010-01-11 2011-07-14 Elmos Semiconductor Ag Halbleiterbauteil
US9557238B2 (en) * 2014-07-25 2017-01-31 Ams International Ag Pressure sensor with geter embedded in membrane
CN104181461B (zh) * 2014-09-12 2017-02-22 四川九洲电器集团有限责任公司 微波开关的故障检测组件和故障检测方法
IT202100022505A1 (it) 2021-08-30 2023-03-02 St Microelectronics Srl Procedimento di fabbricazione di un sensore di pressione capacitivo e sensore di pressione capacitivo
CN116659731A (zh) * 2023-04-03 2023-08-29 北京智芯传感科技有限公司 一种mems表压传感器及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4406992A (en) * 1981-04-20 1983-09-27 Kulite Semiconductor Products, Inc. Semiconductor pressure transducer or other product employing layers of single crystal silicon
JPS5855732A (ja) * 1981-09-30 1983-04-02 Hitachi Ltd 静電容量型圧力センサ
US4439463A (en) * 1982-02-18 1984-03-27 Atlantic Richfield Company Plasma assisted deposition system
US4665610A (en) * 1985-04-22 1987-05-19 Stanford University Method of making a semiconductor transducer having multiple level diaphragm structure
US4744863A (en) * 1985-04-26 1988-05-17 Wisconsin Alumni Research Foundation Sealed cavity semiconductor pressure transducers and method of producing the same
GB2198611B (en) * 1986-12-13 1990-04-04 Spectrol Reliance Ltd Method of forming a sealed diaphragm on a substrate
US5095401A (en) * 1989-01-13 1992-03-10 Kopin Corporation SOI diaphragm sensor
FR2700003B1 (fr) * 1992-12-28 1995-02-10 Commissariat Energie Atomique Procédé de fabrication d'un capteur de pression utilisant la technologie silicium sur isolant et capteur obtenu.
US5369544A (en) * 1993-04-05 1994-11-29 Ford Motor Company Silicon-on-insulator capacitive surface micromachined absolute pressure sensor
US5427975A (en) * 1993-05-10 1995-06-27 Delco Electronics Corporation Method of micromachining an integrated sensor on the surface of a silicon wafer
FI100918B (fi) * 1995-02-17 1998-03-13 Vaisala Oy Pintamikromekaaninen, symmetrinen paine-eroanturi
EP0822579B1 (de) * 1996-07-31 2004-07-21 STMicroelectronics S.r.l. Integrierte Mikrostrukturen aus Halbleitermaterial und ein Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
US6527961B1 (en) 2003-03-04
EP0863392A1 (de) 1998-09-09
JP4294751B2 (ja) 2009-07-15
JPH10256564A (ja) 1998-09-25
DE69702745D1 (de) 2000-09-14
BR9800757A (pt) 1999-06-29
EP0863392B1 (de) 2000-08-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee