NO943647L - Fremgangsmåte for fremstilling av en adhesiv binding mellom kobberlag og keramer - Google Patents

Fremgangsmåte for fremstilling av en adhesiv binding mellom kobberlag og keramer

Info

Publication number
NO943647L
NO943647L NO943647A NO943647A NO943647L NO 943647 L NO943647 L NO 943647L NO 943647 A NO943647 A NO 943647A NO 943647 A NO943647 A NO 943647A NO 943647 L NO943647 L NO 943647L
Authority
NO
Norway
Prior art keywords
ceramics
adhesive bond
preparation
copper
copper layers
Prior art date
Application number
NO943647A
Other languages
English (en)
Other versions
NO943647D0 (no
Inventor
Heinrich Kuhn
Ulrich Bos
Carsten Hannss
Karl-Friedrich Von Kayser
Original Assignee
Hoechst Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoechst Ag filed Critical Hoechst Ag
Publication of NO943647D0 publication Critical patent/NO943647D0/no
Publication of NO943647L publication Critical patent/NO943647L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5127—Cu, e.g. Cu-CuO eutectic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/06—Metallic material
    • C23C4/08—Metallic material containing only metal elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Ceramic Products (AREA)

Abstract

Oppfinnelsen angår en fremgangsmåte for å fremstille en adhesiv binding mellom lag av kobber, påført ved termisk spraylng av pulverformet kobber (4) eller kobberlegeringer, og keramer (6). Flnfordelt kobber- pulver (4) med en gjennomsnittlig kornstørrelse £20 JJID blir påført keramikkoverflaten ved termisk spraying.
NO943647A 1992-04-02 1994-09-30 Fremgangsmåte for fremstilling av en adhesiv binding mellom kobberlag og keramer NO943647L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4210900A DE4210900A1 (de) 1992-04-02 1992-04-02 Verfahren zur Herstellung eines haftfesten Verbundes zwischen Kupferschichten und Keramik
PCT/EP1993/000675 WO1993020255A1 (de) 1992-04-02 1993-03-19 Verfahren zur herstellung eines haftfesten verbundes zwischen kupferschichten und keramik

Publications (2)

Publication Number Publication Date
NO943647D0 NO943647D0 (no) 1994-09-30
NO943647L true NO943647L (no) 1994-09-30

Family

ID=6455759

Family Applications (1)

Application Number Title Priority Date Filing Date
NO943647A NO943647L (no) 1992-04-02 1994-09-30 Fremgangsmåte for fremstilling av en adhesiv binding mellom kobberlag og keramer

Country Status (8)

Country Link
US (1) US5648123A (no)
EP (1) EP0733129B1 (no)
JP (1) JP2944215B2 (no)
CA (1) CA2133422C (no)
DE (2) DE4210900A1 (no)
ES (1) ES2121996T3 (no)
NO (1) NO943647L (no)
WO (1) WO1993020255A1 (no)

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US6872427B2 (en) * 2003-02-07 2005-03-29 Delphi Technologies, Inc. Method for producing electrical contacts using selective melting and a low pressure kinetic spray process
US6871553B2 (en) * 2003-03-28 2005-03-29 Delphi Technologies, Inc. Integrating fluxgate for magnetostrictive torque sensors
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US6984277B2 (en) * 2003-07-31 2006-01-10 Siemens Westinghouse Power Corporation Bond enhancement for thermally insulated ceramic matrix composite materials
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US7351450B2 (en) * 2003-10-02 2008-04-01 Delphi Technologies, Inc. Correcting defective kinetically sprayed surfaces
US7335341B2 (en) * 2003-10-30 2008-02-26 Delphi Technologies, Inc. Method for securing ceramic structures and forming electrical connections on the same
US7024946B2 (en) * 2004-01-23 2006-04-11 Delphi Technologies, Inc. Assembly for measuring movement of and a torque applied to a shaft
US7475831B2 (en) * 2004-01-23 2009-01-13 Delphi Technologies, Inc. Modified high efficiency kinetic spray nozzle
US20050214474A1 (en) * 2004-03-24 2005-09-29 Taeyoung Han Kinetic spray nozzle system design
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WO2006022642A1 (en) * 2004-07-27 2006-03-02 The Regents Of The University Of Michigan Zero-gap laser welding
US20060040048A1 (en) * 2004-08-23 2006-02-23 Taeyoung Han Continuous in-line manufacturing process for high speed coating deposition via a kinetic spray process
US20060038044A1 (en) * 2004-08-23 2006-02-23 Van Steenkiste Thomas H Replaceable throat insert for a kinetic spray nozzle
US20070074656A1 (en) * 2005-10-04 2007-04-05 Zhibo Zhao Non-clogging powder injector for a kinetic spray nozzle system
US7674076B2 (en) * 2006-07-14 2010-03-09 F. W. Gartner Thermal Spraying, Ltd. Feeder apparatus for controlled supply of feedstock
JP5217639B2 (ja) * 2008-05-30 2013-06-19 富士通株式会社 コア基板およびプリント配線板
JP5217640B2 (ja) * 2008-05-30 2013-06-19 富士通株式会社 プリント配線板の製造方法およびプリント基板ユニットの製造方法
JP2009290124A (ja) * 2008-05-30 2009-12-10 Fujitsu Ltd プリント配線板
JP2009290135A (ja) * 2008-05-30 2009-12-10 Fujitsu Ltd プリント配線板の製造方法および導電性接合剤
JP6085787B2 (ja) * 2012-11-12 2017-03-01 北川工業株式会社 放熱部材の製造方法
TWI567047B (zh) * 2014-02-12 2017-01-21 三菱綜合材料股份有限公司 銅／陶瓷接合體及電源模組用基板
DE102016203030A1 (de) * 2016-02-26 2017-08-31 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund
DE102016203112B4 (de) * 2016-02-26 2019-08-29 Heraeus Deutschland GmbH & Co. KG Kupfer-Keramik-Verbund
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CN111454080B (zh) * 2020-05-12 2021-10-26 清华大学 一种敷铜或敷铜合金氧化铝陶瓷基板及其制备方法
CN114807818B (zh) * 2022-05-17 2023-09-29 中北大学 铜合金表面耐磨导电陶瓷金属熔覆涂层的制备方法
DE102022209709A1 (de) * 2022-09-15 2024-03-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren zur ausbildung von einer metallschicht auf einer oberfläche eines festen, ionenleitenden substrats und mit dem verfahren herstellbares substrat
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Also Published As

Publication number Publication date
EP0733129A1 (de) 1996-09-25
NO943647D0 (no) 1994-09-30
CA2133422A1 (en) 1993-10-03
US5648123A (en) 1997-07-15
DE4210900A1 (de) 1993-10-14
WO1993020255A1 (de) 1993-10-14
DE59308833D1 (de) 1998-09-03
EP0733129B1 (de) 1998-07-29
ES2121996T3 (es) 1998-12-16
JP2944215B2 (ja) 1999-08-30
CA2133422C (en) 1999-01-26
JPH07501855A (ja) 1995-02-23

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