NO874515L - Anordning for kjoeling av halvlederbyggeelementer. - Google Patents

Anordning for kjoeling av halvlederbyggeelementer.

Info

Publication number
NO874515L
NO874515L NO874515A NO874515A NO874515L NO 874515 L NO874515 L NO 874515L NO 874515 A NO874515 A NO 874515A NO 874515 A NO874515 A NO 874515A NO 874515 L NO874515 L NO 874515L
Authority
NO
Norway
Prior art keywords
cavity
cooling
building elements
heat
cooling semiconductor
Prior art date
Application number
NO874515A
Other languages
English (en)
Norwegian (no)
Other versions
NO874515D0 (no
Inventor
Xaver Vogel
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of NO874515D0 publication Critical patent/NO874515D0/no
Publication of NO874515L publication Critical patent/NO874515L/no

Links

Classifications

    • H10W40/73—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Dairy Products (AREA)
  • Executing Machine-Instructions (AREA)
NO874515A 1986-10-29 1987-10-29 Anordning for kjoeling av halvlederbyggeelementer. NO874515L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH427986 1986-10-29

Publications (2)

Publication Number Publication Date
NO874515D0 NO874515D0 (no) 1987-10-29
NO874515L true NO874515L (no) 1988-05-02

Family

ID=4273148

Family Applications (1)

Application Number Title Priority Date Filing Date
NO874515A NO874515L (no) 1986-10-29 1987-10-29 Anordning for kjoeling av halvlederbyggeelementer.

Country Status (9)

Country Link
EP (1) EP0268081B1 (show.php)
JP (1) JPS63116452A (show.php)
AT (1) ATE75074T1 (show.php)
DE (1) DE3778304D1 (show.php)
ES (1) ES2030692T3 (show.php)
FI (1) FI874753A7 (show.php)
IN (1) IN170337B (show.php)
NO (1) NO874515L (show.php)
ZA (1) ZA878041B (show.php)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO894328L (no) * 1989-10-30 1991-05-02 Dolphin Server Technology As Fremgangsmaate og anordning for kjoeling av elektroniske komponenter.
GB2380057A (en) * 2001-09-19 2003-03-26 Thermosonic Technology Inc Heat dissipation structure with cavity for improved heat transfer
JP4764073B2 (ja) * 2005-06-07 2011-08-31 キヤノン株式会社 シート供給装置及び記録装置
JP5880318B2 (ja) * 2012-07-04 2016-03-09 三菱電機株式会社 半導体装置
DE102016224232B4 (de) 2016-07-19 2024-03-21 Hanon Systems Efp Deutschland Gmbh Leiterplattenvorrichtung
DE202018003992U1 (de) 2018-08-26 2018-09-13 Hochschule Mittweida (Fh) Siedekühlbares Substrat mit wenigstens einem mikroelektronischen Bauelement und/oder als Träger mikroelektronischer Einheiten
DE102018006806B4 (de) 2018-08-26 2023-01-19 Hochschule Mittweida (Fh) Verwendung wenigstens eines Lasers zur Strukturierung mindestens eines Bereichs einer Oberfläche eines Substrats mit wenigstens einem mikroelektronischen Bauelement und/oder als Träger mikroelektronischer Einheiten

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2886746A (en) * 1956-01-05 1959-05-12 Gen Electric Evaporative cooling system for electrical devices
CH342661A (de) * 1956-08-11 1959-11-30 Bbc Brown Boveri & Cie Kühler für die Kühlung eines Halbleiterelementes
US3852806A (en) * 1973-05-02 1974-12-03 Gen Electric Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes
US4145708A (en) * 1977-06-13 1979-03-20 General Electric Company Power module with isolated substrates cooled by integral heat-energy-removal means
JPS5936827B2 (ja) * 1979-01-12 1984-09-06 日本電信電話株式会社 集積回路素子の冷却装置
DE3302840C2 (de) * 1983-01-28 1985-06-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Einrichtung zur Wärmeabführung von energieelektronischen Bauelementen

Also Published As

Publication number Publication date
ATE75074T1 (de) 1992-05-15
JPS63116452A (ja) 1988-05-20
IN170337B (show.php) 1992-03-14
DE3778304D1 (de) 1992-05-21
EP0268081B1 (de) 1992-04-15
ZA878041B (en) 1988-04-29
NO874515D0 (no) 1987-10-29
FI874753L (fi) 1988-04-30
FI874753A7 (fi) 1988-04-30
ES2030692T3 (es) 1992-11-16
EP0268081A1 (de) 1988-05-25
FI874753A0 (fi) 1987-10-28

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