ZA878041B - An apparatus for cooling semiconductor components - Google Patents
An apparatus for cooling semiconductor componentsInfo
- Publication number
- ZA878041B ZA878041B ZA878041A ZA878041A ZA878041B ZA 878041 B ZA878041 B ZA 878041B ZA 878041 A ZA878041 A ZA 878041A ZA 878041 A ZA878041 A ZA 878041A ZA 878041 B ZA878041 B ZA 878041B
- Authority
- ZA
- South Africa
- Prior art keywords
- cavity
- cooling
- semiconductor components
- heat
- cooling semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
In a boiling-and-cooling device for semiconductor components based on a boiler cooling with a heat sink (1) which contains, in a cavity (4), a cooling liquid (8) which is in intimate thermal contact with the semiconductor component (6) to be cooled, the semiconductor component (6) is mounted outside the cavity (4). The heat is introduced into the cooling liquid (8) by a heat removing device (5) which seals the cavity (4) on one side and is insulated from the heat sink. This device achieves a simple, compact construction and at the same time high modular flexibility. <IMAGE>
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH427986 | 1986-10-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA878041B true ZA878041B (en) | 1988-04-29 |
Family
ID=4273148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA878041A ZA878041B (en) | 1986-10-29 | 1987-10-27 | An apparatus for cooling semiconductor components |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP0268081B1 (en) |
JP (1) | JPS63116452A (en) |
AT (1) | ATE75074T1 (en) |
DE (1) | DE3778304D1 (en) |
ES (1) | ES2030692T3 (en) |
FI (1) | FI874753A (en) |
IN (1) | IN170337B (en) |
NO (1) | NO874515L (en) |
ZA (1) | ZA878041B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NO894328L (en) * | 1989-10-30 | 1991-05-02 | Dolphin Server Technology As | PROCEDURE AND DEVICE FOR COOLING ELECTRONIC COMPONENTS. |
GB2380057A (en) * | 2001-09-19 | 2003-03-26 | Thermosonic Technology Inc | Heat dissipation structure with cavity for improved heat transfer |
JP4764073B2 (en) * | 2005-06-07 | 2011-08-31 | キヤノン株式会社 | Sheet feeding apparatus and recording apparatus |
JP5880318B2 (en) * | 2012-07-04 | 2016-03-09 | 三菱電機株式会社 | Semiconductor device |
DE102016224232B4 (en) | 2016-07-19 | 2024-03-21 | Hanon Systems Efp Deutschland Gmbh | PCB device |
DE202018003992U1 (en) | 2018-08-26 | 2018-09-13 | Hochschule Mittweida (Fh) | Boehmekühlbares substrate with at least one microelectronic device and / or as a carrier of microelectronic units |
DE102018006806B4 (en) | 2018-08-26 | 2023-01-19 | Hochschule Mittweida (Fh) | Use of at least one laser for structuring at least one area of a surface of a substrate with at least one microelectronic component and/or as a carrier for microelectronic units |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2886746A (en) * | 1956-01-05 | 1959-05-12 | Gen Electric | Evaporative cooling system for electrical devices |
CH342661A (en) * | 1956-08-11 | 1959-11-30 | Bbc Brown Boveri & Cie | Cooler for cooling a semiconductor element |
US3852806A (en) * | 1973-05-02 | 1974-12-03 | Gen Electric | Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes |
US4145708A (en) * | 1977-06-13 | 1979-03-20 | General Electric Company | Power module with isolated substrates cooled by integral heat-energy-removal means |
JPS5936827B2 (en) * | 1979-01-12 | 1984-09-06 | 日本電信電話株式会社 | Integrated circuit device cooling equipment |
DE3302840C2 (en) * | 1983-01-28 | 1985-06-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Device for heat dissipation from energy electronic components |
-
1987
- 1987-10-16 AT AT87115118T patent/ATE75074T1/en not_active IP Right Cessation
- 1987-10-16 DE DE8787115118T patent/DE3778304D1/en not_active Expired - Fee Related
- 1987-10-16 EP EP87115118A patent/EP0268081B1/en not_active Expired - Lifetime
- 1987-10-16 ES ES198787115118T patent/ES2030692T3/en not_active Expired - Lifetime
- 1987-10-23 IN IN768/MAS/87A patent/IN170337B/en unknown
- 1987-10-27 ZA ZA878041A patent/ZA878041B/en unknown
- 1987-10-28 JP JP62272894A patent/JPS63116452A/en active Pending
- 1987-10-28 FI FI874753A patent/FI874753A/en not_active Application Discontinuation
- 1987-10-29 NO NO874515A patent/NO874515L/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPS63116452A (en) | 1988-05-20 |
EP0268081A1 (en) | 1988-05-25 |
NO874515D0 (en) | 1987-10-29 |
ATE75074T1 (en) | 1992-05-15 |
DE3778304D1 (en) | 1992-05-21 |
EP0268081B1 (en) | 1992-04-15 |
IN170337B (en) | 1992-03-14 |
ES2030692T3 (en) | 1992-11-16 |
FI874753A (en) | 1988-04-30 |
FI874753A0 (en) | 1987-10-28 |
NO874515L (en) | 1988-05-02 |
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