NO894328L - PROCEDURE AND DEVICE FOR COOLING ELECTRONIC COMPONENTS. - Google Patents

PROCEDURE AND DEVICE FOR COOLING ELECTRONIC COMPONENTS.

Info

Publication number
NO894328L
NO894328L NO89894328A NO894328A NO894328L NO 894328 L NO894328 L NO 894328L NO 89894328 A NO89894328 A NO 89894328A NO 894328 A NO894328 A NO 894328A NO 894328 L NO894328 L NO 894328L
Authority
NO
Norway
Prior art keywords
procedure
electronic components
cooling electronic
cooling
components
Prior art date
Application number
NO89894328A
Other languages
Norwegian (no)
Other versions
NO894328D0 (en
Inventor
Torstein Gleditsch
Original Assignee
Dolphin Server Technology As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dolphin Server Technology As filed Critical Dolphin Server Technology As
Priority to NO89894328A priority Critical patent/NO894328L/en
Publication of NO894328D0 publication Critical patent/NO894328D0/en
Priority to PCT/NO1990/000160 priority patent/WO1991006958A1/en
Publication of NO894328L publication Critical patent/NO894328L/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
NO89894328A 1989-10-30 1989-10-30 PROCEDURE AND DEVICE FOR COOLING ELECTRONIC COMPONENTS. NO894328L (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
NO89894328A NO894328L (en) 1989-10-30 1989-10-30 PROCEDURE AND DEVICE FOR COOLING ELECTRONIC COMPONENTS.
PCT/NO1990/000160 WO1991006958A1 (en) 1989-10-30 1990-10-26 A method and a means for cooling electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NO89894328A NO894328L (en) 1989-10-30 1989-10-30 PROCEDURE AND DEVICE FOR COOLING ELECTRONIC COMPONENTS.

Publications (2)

Publication Number Publication Date
NO894328D0 NO894328D0 (en) 1989-10-30
NO894328L true NO894328L (en) 1991-05-02

Family

ID=19892523

Family Applications (1)

Application Number Title Priority Date Filing Date
NO89894328A NO894328L (en) 1989-10-30 1989-10-30 PROCEDURE AND DEVICE FOR COOLING ELECTRONIC COMPONENTS.

Country Status (2)

Country Link
NO (1) NO894328L (en)
WO (1) WO1991006958A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222122B1 (en) * 1998-01-13 2001-04-24 Sun Microsystems, Inc. Sealed liquid-filled module and method of forming same
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
GB2411049A (en) * 2004-01-23 2005-08-17 Jonathan David Cadd Specific heat capacity heatsink for electronics
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
GB2467805C (en) * 2009-05-12 2011-06-01 Iceotope Ltd Cooled electronic system
CN103996664B (en) * 2014-05-30 2016-08-24 佐志温控技术（上海）有限公司 A kind of liquid forced cooling device of counnter attack diode

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138692A (en) * 1977-09-12 1979-02-06 International Business Machines Corporation Gas encapsulated cooling module
US4203129A (en) * 1978-07-11 1980-05-13 International Business Machines Corporation Bubble generating tunnels for cooling semiconductor devices
CA1230184A (en) * 1983-11-29 1987-12-08 Toshiyuki Saito Liquid cooling type high frequency solid state device
DE3778304D1 (en) * 1986-10-29 1992-05-21 Bbc Brown Boveri & Cie DEVICE FOR COOLING SEMICONDUCTOR COMPONENTS.

Also Published As

Publication number Publication date
NO894328D0 (en) 1989-10-30
WO1991006958A1 (en) 1991-05-16

Similar Documents

Publication Publication Date Title
NO902698D0 (en) PROCEDURE AND DEVICE FOR PERFORMING BROENN PERFORING.
DE69025036D1 (en) Improved device for cooling electronic components
KR950702345A (en) Antenna for and Electronic Apparatus
DE58904157D1 (en) ELECTRONIC DEVICE AND OPERATING METHOD.
NO910101D0 (en) PROCEDURE AND DEVICE FOR SOLAR FORM OF INTEGRATED CIRCUIT.
NO894442D0 (en) DEVICE AND PROCEDURE FOR SEALING CASES.
DE69032214D1 (en) Compact electronic device
NO905614D0 (en) PROCEDURE AND DEVICE FOR DRILL PROTECTION PROTECTION.
NO905034D0 (en) PROCEDURE AND DEVICE FOR REFRIGERATING COLD STRINGS.
NO901271D0 (en) PROCEDURE AND GAS SOLUTION DEVICE.
IT9068055A0 (en) DEVICE FOR SHIELDING AND ISOLATING AN ELECTRONIC CIRCUIT BOARD.
DE69020937D1 (en) Imaging method and device.
NO872951D0 (en) PROCEDURE AND DEVICE ORIENTATION ARRANGEMENT.
NO894328D0 (en) PROCEDURE AND DEVICE FOR COOLING ELECTRONIC COMPONENTS.
NO885206D0 (en) DEVICE AND PROCEDURE REMOVAL PROCEDURE.
NO900733L (en) PROCEDURE AND DEVICE FOR MASSING.
DE69000769D1 (en) COOLING DEVICE.
EP0482546A3 (en) Cooling device for optical and/or electronic elements
DE69001135D1 (en) SOLDERING METHOD AND SOLDERING DEVICE.
EP0618453A3 (en) Method of testing circuit boards and device for carrying out the method.
NO903049D0 (en) DEVICE AND PROCEDURE FOR TEMPERATURE MEASUREMENT.
NO912108L (en) PROCEDURE AND APPARATUS FOR CARRYING OUT AN APPROXIMATE DIVISION.
NO904910L (en) PROCEDURE AND DEVICE FOR AA ISOLATE ELECTRONIC MANAGERS.
NO904316L (en) PROCEDURE AND DEVICE FOR AA DESIGN COOL WINDS.
NO895293L (en) PROCEDURE AND DEVICE FOR DETERMINING BORDER LOCATIONS.