IN170337B - - Google Patents
Info
- Publication number
- IN170337B IN170337B IN768/MAS/87A IN768MA1987A IN170337B IN 170337 B IN170337 B IN 170337B IN 768MA1987 A IN768MA1987 A IN 768MA1987A IN 170337 B IN170337 B IN 170337B
- Authority
- IN
- India
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Executing Machine-Instructions (AREA)
- Dairy Products (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH427986 | 1986-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN170337B true IN170337B (en) | 1992-03-14 |
Family
ID=4273148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN768/MAS/87A IN170337B (en) | 1986-10-29 | 1987-10-23 |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP0268081B1 (en) |
| JP (1) | JPS63116452A (en) |
| AT (1) | ATE75074T1 (en) |
| DE (1) | DE3778304D1 (en) |
| ES (1) | ES2030692T3 (en) |
| FI (1) | FI874753A7 (en) |
| IN (1) | IN170337B (en) |
| NO (1) | NO874515L (en) |
| ZA (1) | ZA878041B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO894328L (en) * | 1989-10-30 | 1991-05-02 | Dolphin Server Technology As | PROCEDURE AND DEVICE FOR COOLING ELECTRONIC COMPONENTS. |
| GB2380057A (en) * | 2001-09-19 | 2003-03-26 | Thermosonic Technology Inc | Heat dissipation structure with cavity for improved heat transfer |
| JP4764073B2 (en) * | 2005-06-07 | 2011-08-31 | キヤノン株式会社 | Sheet feeding apparatus and recording apparatus |
| JP5880318B2 (en) * | 2012-07-04 | 2016-03-09 | 三菱電機株式会社 | Semiconductor device |
| DE102016224232B4 (en) | 2016-07-19 | 2024-03-21 | Hanon Systems Efp Deutschland Gmbh | PCB device |
| DE102018006806B4 (en) | 2018-08-26 | 2023-01-19 | Hochschule Mittweida (Fh) | Use of at least one laser for structuring at least one area of a surface of a substrate with at least one microelectronic component and/or as a carrier for microelectronic units |
| DE202018003992U1 (en) | 2018-08-26 | 2018-09-13 | Hochschule Mittweida (Fh) | Boehmekühlbares substrate with at least one microelectronic device and / or as a carrier of microelectronic units |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2886746A (en) * | 1956-01-05 | 1959-05-12 | Gen Electric | Evaporative cooling system for electrical devices |
| CH342661A (en) * | 1956-08-11 | 1959-11-30 | Bbc Brown Boveri & Cie | Cooler for cooling a semiconductor element |
| US3852806A (en) * | 1973-05-02 | 1974-12-03 | Gen Electric | Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes |
| US4145708A (en) * | 1977-06-13 | 1979-03-20 | General Electric Company | Power module with isolated substrates cooled by integral heat-energy-removal means |
| JPS5936827B2 (en) * | 1979-01-12 | 1984-09-06 | 日本電信電話株式会社 | Integrated circuit device cooling equipment |
| DE3302840C2 (en) * | 1983-01-28 | 1985-06-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Device for heat dissipation from energy electronic components |
-
1987
- 1987-10-16 AT AT87115118T patent/ATE75074T1/en not_active IP Right Cessation
- 1987-10-16 ES ES198787115118T patent/ES2030692T3/en not_active Expired - Lifetime
- 1987-10-16 DE DE8787115118T patent/DE3778304D1/en not_active Expired - Lifetime
- 1987-10-16 EP EP87115118A patent/EP0268081B1/en not_active Expired - Lifetime
- 1987-10-23 IN IN768/MAS/87A patent/IN170337B/en unknown
- 1987-10-27 ZA ZA878041A patent/ZA878041B/en unknown
- 1987-10-28 FI FI874753A patent/FI874753A7/en not_active Application Discontinuation
- 1987-10-28 JP JP62272894A patent/JPS63116452A/en active Pending
- 1987-10-29 NO NO874515A patent/NO874515L/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63116452A (en) | 1988-05-20 |
| NO874515L (en) | 1988-05-02 |
| FI874753A0 (en) | 1987-10-28 |
| ES2030692T3 (en) | 1992-11-16 |
| FI874753L (en) | 1988-04-30 |
| NO874515D0 (en) | 1987-10-29 |
| EP0268081B1 (en) | 1992-04-15 |
| DE3778304D1 (en) | 1992-05-21 |
| FI874753A7 (en) | 1988-04-30 |
| ATE75074T1 (en) | 1992-05-15 |
| ZA878041B (en) | 1988-04-29 |
| EP0268081A1 (en) | 1988-05-25 |