NO330228B1 - Partikler - Google Patents
Partikler Download PDFInfo
- Publication number
- NO330228B1 NO330228B1 NO20011903A NO20011903A NO330228B1 NO 330228 B1 NO330228 B1 NO 330228B1 NO 20011903 A NO20011903 A NO 20011903A NO 20011903 A NO20011903 A NO 20011903A NO 330228 B1 NO330228 B1 NO 330228B1
- Authority
- NO
- Norway
- Prior art keywords
- particles
- gold
- plated
- styrene
- polymer
- Prior art date
Links
- 239000002245 particle Substances 0.000 title claims abstract description 176
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 115
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052737 gold Inorganic materials 0.000 claims abstract description 43
- 239000010931 gold Substances 0.000 claims abstract description 43
- 229920001577 copolymer Polymers 0.000 claims abstract description 42
- 238000000576 coating method Methods 0.000 claims abstract description 25
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 239000000203 mixture Substances 0.000 claims description 40
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 38
- 229920000642 polymer Polymers 0.000 claims description 37
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 26
- 238000007747 plating Methods 0.000 claims description 25
- 239000000243 solution Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 claims description 14
- 239000003381 stabilizer Substances 0.000 claims description 11
- 239000000377 silicon dioxide Substances 0.000 claims description 10
- 125000000524 functional group Chemical group 0.000 claims description 8
- 150000002941 palladium compounds Chemical class 0.000 claims description 8
- 239000000178 monomer Substances 0.000 claims description 6
- 239000003638 chemical reducing agent Substances 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims description 2
- 125000003396 thiol group Chemical class [H]S* 0.000 claims 3
- 239000008199 coating composition Substances 0.000 claims 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 abstract description 4
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 59
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 41
- 238000003756 stirring Methods 0.000 description 16
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 14
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 238000002156 mixing Methods 0.000 description 8
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 7
- 150000003573 thiols Chemical class 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 6
- 239000004005 microsphere Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 4
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 4
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 4
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 4
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 4
- CHRJZRDFSQHIFI-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;styrene Chemical compound C=CC1=CC=CC=C1.C=CC1=CC=CC=C1C=C CHRJZRDFSQHIFI-UHFFFAOYSA-N 0.000 description 3
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000001143 conditioned effect Effects 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 229920003051 synthetic elastomer Polymers 0.000 description 3
- 239000005061 synthetic rubber Substances 0.000 description 3
- AKIZPWSPNKVOMT-UHFFFAOYSA-N 1-sulfanylhexan-1-ol Chemical compound CCCCCC(O)S AKIZPWSPNKVOMT-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 125000005396 acrylic acid ester group Chemical group 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000011325 microbead Substances 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- PXHVJJICTQNCMI-OUBTZVSYSA-N nickel-60 atom Chemical compound [60Ni] PXHVJJICTQNCMI-OUBTZVSYSA-N 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000867 polyelectrolyte Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 2
- HRZFUMHJMZEROT-UHFFFAOYSA-L sodium disulfite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])(=O)=O HRZFUMHJMZEROT-UHFFFAOYSA-L 0.000 description 2
- 235000010262 sodium metabisulphite Nutrition 0.000 description 2
- MNCGMVDMOKPCSQ-UHFFFAOYSA-M sodium;2-phenylethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=CC1=CC=CC=C1 MNCGMVDMOKPCSQ-UHFFFAOYSA-M 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- KGYLMXMMQNTWEM-UHFFFAOYSA-J tetrachloropalladium Chemical compound Cl[Pd](Cl)(Cl)Cl KGYLMXMMQNTWEM-UHFFFAOYSA-J 0.000 description 2
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- SYENVBKSVVOOPS-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butyl prop-2-enoate Chemical compound CCC(CO)(CO)COC(=O)C=C SYENVBKSVVOOPS-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 230000000843 anti-fungal effect Effects 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 125000003636 chemical group Chemical group 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 238000001493 electron microscopy Methods 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 238000001415 gene therapy Methods 0.000 description 1
- WFBTWKBUJOBXPL-UHFFFAOYSA-N gold oxiran-2-ylmethyl 2-methylprop-2-enoate Chemical compound [Au].C(C(=C)C)(=O)OCC1CO1 WFBTWKBUJOBXPL-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910002094 inorganic tetrachloropalladate Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- -1 methacrylate ester Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 1
- 150000002816 nickel compounds Chemical class 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphonic acid group Chemical group P(O)(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 229920001983 poloxamer Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000003586 protic polar solvent Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- VZWGHDYJGOMEKT-UHFFFAOYSA-J sodium pyrophosphate decahydrate Chemical compound O.O.O.O.O.O.O.O.O.O.[Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O VZWGHDYJGOMEKT-UHFFFAOYSA-J 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-N sulfonic acid Chemical compound OS(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0831—Gold
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/013—Additives applied to the surface of polymers or polymer particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Micro-Capsules (AREA)
- Chemically Coating (AREA)
- Glanulating (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Powder Metallurgy (AREA)
- Wire Bonding (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB9822822.4A GB9822822D0 (en) | 1998-10-19 | 1998-10-19 | Particles |
| PCT/GB1999/003432 WO2000024005A1 (fr) | 1998-10-19 | 1999-10-18 | Particules |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO20011903D0 NO20011903D0 (no) | 2001-04-18 |
| NO20011903L NO20011903L (no) | 2001-06-18 |
| NO330228B1 true NO330228B1 (no) | 2011-03-07 |
Family
ID=10840858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO20011903A NO330228B1 (no) | 1998-10-19 | 2001-04-18 | Partikler |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6787233B1 (fr) |
| EP (1) | EP1135777B1 (fr) |
| JP (1) | JP4822377B2 (fr) |
| AT (1) | ATE301329T1 (fr) |
| AU (1) | AU6351499A (fr) |
| DE (1) | DE69926533T2 (fr) |
| GB (1) | GB9822822D0 (fr) |
| NO (1) | NO330228B1 (fr) |
| WO (1) | WO2000024005A1 (fr) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100549228C (zh) * | 2003-06-05 | 2009-10-14 | 日矿金属株式会社 | 无电镀金液 |
| US20050064431A1 (en) * | 2003-09-09 | 2005-03-24 | Eastman Kodak Company | Biological microarray comprising polymer particles and method of use |
| TWI324616B (en) * | 2006-06-01 | 2010-05-11 | Chung Cheng Inst Of Technology Nat Defense University | Process for preparing a styrene polymer composite having nano metallic particles deposited thereon |
| JP5549069B2 (ja) * | 2008-04-22 | 2014-07-16 | 日立化成株式会社 | 異方性導電接着剤用粒子状導電材料及びその製造方法、並びに異方性導電接着剤 |
| GB0907372D0 (en) | 2009-04-29 | 2009-06-10 | Invitrogen Dynal As | Particles |
| US8790916B2 (en) | 2009-05-14 | 2014-07-29 | Genestream, Inc. | Microfluidic method and system for isolating particles from biological fluid |
| US8747084B2 (en) | 2010-07-21 | 2014-06-10 | Aperia Technologies, Inc. | Peristaltic pump |
| DE102010042602A1 (de) * | 2010-10-19 | 2012-04-19 | Osram Opto Semiconductors Gmbh | Leitfähiges Verbindungsmittel und Verfahren zur Herstellung eines leitfähigen Verbindungsmittels |
| GB201018379D0 (en) | 2010-10-29 | 2010-12-15 | Conpart As | Conductive rf particles |
| GB201018380D0 (en) | 2010-10-29 | 2010-12-15 | Conpart As | Process |
| JP5583654B2 (ja) * | 2011-11-30 | 2014-09-03 | 株式会社日本触媒 | 導電性微粒子及びそれを用いた異方性導電材料 |
| WO2013108740A1 (fr) * | 2012-01-19 | 2013-07-25 | 積水化学工業株式会社 | Particules conductrices, matériau conducteur et structure de connexion |
| JP6004680B2 (ja) * | 2012-03-12 | 2016-10-12 | 住友ゴム工業株式会社 | タイヤ用ゴム組成物及びタイヤ |
| EP2828103B1 (fr) | 2012-03-20 | 2017-02-22 | Aperia Technologies | Système de gonflage de pneu |
| WO2013178692A1 (fr) | 2012-05-29 | 2013-12-05 | Conpart As | Adhésif conducteur isotrope |
| GB201212489D0 (en) | 2012-07-13 | 2012-08-29 | Conpart As | Improvements in conductive adhesives |
| US10245908B2 (en) | 2016-09-06 | 2019-04-02 | Aperia Technologies, Inc. | System for tire inflation |
| US11453258B2 (en) | 2013-03-12 | 2022-09-27 | Aperia Technologies, Inc. | System for tire inflation |
| US9604157B2 (en) | 2013-03-12 | 2017-03-28 | Aperia Technologies, Inc. | Pump with water management |
| US10144254B2 (en) | 2013-03-12 | 2018-12-04 | Aperia Technologies, Inc. | Tire inflation system |
| WO2018042701A1 (fr) * | 2016-08-30 | 2018-03-08 | 日立化成株式会社 | Composition adhésive |
| DE102017203523A1 (de) * | 2016-10-04 | 2017-06-29 | Evonik Degussa Gmbh | Vorrichtung zum Erwärmen polymerer Pulver mittels Strahlung bei Pulverbeschichtungsverfahren |
| US10406869B2 (en) | 2017-11-10 | 2019-09-10 | Aperia Technologies, Inc. | Inflation system |
| JP7314801B2 (ja) | 2017-12-28 | 2023-07-26 | 株式会社レゾナック | 接続構造体及びその製造方法 |
| US11642920B2 (en) | 2018-11-27 | 2023-05-09 | Aperia Technologies, Inc. | Hub-integrated inflation system |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4049752A (en) * | 1976-02-17 | 1977-09-20 | Eastman Kodak Company | Polymeric compositions of styrene and amorphous polyolefins useful in preparing hot melt adhesives |
| AU530410B2 (en) | 1978-02-21 | 1983-07-14 | Sintef | Preparing aqueous emulsions |
| DE3215413A1 (de) * | 1982-04-24 | 1983-10-27 | Bayer Ag, 5090 Leverkusen | Metallisierte polymergranulate, ihre herstellung und verwendung |
| JPS61215604A (ja) | 1985-03-22 | 1986-09-25 | Japan Synthetic Rubber Co Ltd | ポリマ−粒子の製造方法 |
| JPH0651728B2 (ja) | 1985-03-22 | 1994-07-06 | 日本合成ゴム株式会社 | 重合体粒子の製造方法 |
| JPS61215603A (ja) | 1985-03-22 | 1986-09-25 | Japan Synthetic Rubber Co Ltd | 重合体粒子の製造方法 |
| US4740657A (en) * | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
| JPS6433808A (en) | 1986-10-18 | 1989-02-03 | Japan Synthetic Rubber Co Ltd | Conductive particle and conductive adhesive including it |
| DE69017553T2 (de) | 1989-08-15 | 1995-12-14 | Casio Computer Co Ltd | Leitfähige Verbindungsstruktur. |
| JPH04115407A (ja) | 1990-09-03 | 1992-04-16 | Soken Kagaku Kk | 異方導電性接着剤組成物 |
| JPH04174980A (ja) * | 1990-11-07 | 1992-06-23 | Hitachi Chem Co Ltd | 回路の接続部材 |
| JPH0519241A (ja) | 1991-07-15 | 1993-01-29 | Seiko Epson Corp | 液晶電気光学素子 |
| GB9115372D0 (en) | 1991-07-16 | 1991-08-28 | Sinvent As | Polymerisation process |
| JP2948038B2 (ja) * | 1992-12-18 | 1999-09-13 | 住友ベークライト株式会社 | 異方導電フィルム |
| GB9302112D0 (en) | 1993-02-03 | 1993-03-24 | Mcdonald Brian | An improved butt |
| JP3150054B2 (ja) * | 1994-10-13 | 2001-03-26 | 住友ベークライト株式会社 | 異方導電フィルム |
| JP3561748B2 (ja) * | 1994-10-14 | 2004-09-02 | 綜研化学株式会社 | 異方導電性接着剤 |
| JP3436327B2 (ja) * | 1995-05-16 | 2003-08-11 | 日本化学工業株式会社 | 導電性無電解めっき粉体 |
| DE69602150T2 (de) * | 1995-09-08 | 1999-09-02 | Idemitsu Petrochemical Co. | Harzzusammensetzung auf Styrolbasis |
| JPH09209195A (ja) * | 1996-02-05 | 1997-08-12 | Mitsubishi Heavy Ind Ltd | クロムめっき方法 |
| JP3379456B2 (ja) * | 1998-12-25 | 2003-02-24 | ソニーケミカル株式会社 | 異方導電性接着フィルム |
-
1998
- 1998-10-19 GB GBGB9822822.4A patent/GB9822822D0/en not_active Ceased
-
1999
- 1999-10-18 JP JP2000577669A patent/JP4822377B2/ja not_active Expired - Lifetime
- 1999-10-18 WO PCT/GB1999/003432 patent/WO2000024005A1/fr active IP Right Grant
- 1999-10-18 AT AT99950922T patent/ATE301329T1/de not_active IP Right Cessation
- 1999-10-18 AU AU63514/99A patent/AU6351499A/en not_active Abandoned
- 1999-10-18 US US09/807,839 patent/US6787233B1/en not_active Expired - Lifetime
- 1999-10-18 EP EP99950922A patent/EP1135777B1/fr not_active Expired - Lifetime
- 1999-10-18 DE DE69926533T patent/DE69926533T2/de not_active Expired - Lifetime
-
2001
- 2001-04-18 NO NO20011903A patent/NO330228B1/no not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| GB9822822D0 (en) | 1998-12-16 |
| NO20011903L (no) | 2001-06-18 |
| JP4822377B2 (ja) | 2011-11-24 |
| JP2002528852A (ja) | 2002-09-03 |
| EP1135777B1 (fr) | 2005-08-03 |
| NO20011903D0 (no) | 2001-04-18 |
| US6787233B1 (en) | 2004-09-07 |
| WO2000024005A1 (fr) | 2000-04-27 |
| AU6351499A (en) | 2000-05-08 |
| DE69926533D1 (de) | 2005-09-08 |
| ATE301329T1 (de) | 2005-08-15 |
| DE69926533T2 (de) | 2006-06-01 |
| EP1135777A1 (fr) | 2001-09-26 |
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Legal Events
| Date | Code | Title | Description |
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| EREP | Power of attorney discontinued | ||
| CREP | Change of representative |
Representative=s name: ZACCO NORWAY AS, POSTBOKS 2003 VIKA |
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| CHAD | Change of the owner's name or address (par. 44 patent law, par. patentforskriften) |
Owner name: LIFE TECHNOLOGIES AS, NO |
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| MK1K | Patent expired |