DE69926533D1 - Partikel - Google Patents

Partikel

Info

Publication number
DE69926533D1
DE69926533D1 DE69926533T DE69926533T DE69926533D1 DE 69926533 D1 DE69926533 D1 DE 69926533D1 DE 69926533 T DE69926533 T DE 69926533T DE 69926533 T DE69926533 T DE 69926533T DE 69926533 D1 DE69926533 D1 DE 69926533D1
Authority
DE
Germany
Prior art keywords
styrene
particle
copolymer
core
styrene copolymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69926533T
Other languages
English (en)
Other versions
DE69926533T2 (de
Inventor
Evenr D Molteberg
Trygve Berge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Life Technologies AS
Original Assignee
Dynal Biotech ASA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynal Biotech ASA filed Critical Dynal Biotech ASA
Publication of DE69926533D1 publication Critical patent/DE69926533D1/de
Application granted granted Critical
Publication of DE69926533T2 publication Critical patent/DE69926533T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0831—Gold
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/013—Additives applied to the surface of polymers or polymer particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
DE69926533T 1998-10-19 1999-10-18 Partikel Expired - Lifetime DE69926533T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9822822 1998-10-19
GBGB9822822.4A GB9822822D0 (en) 1998-10-19 1998-10-19 Particles
PCT/GB1999/003432 WO2000024005A1 (en) 1998-10-19 1999-10-18 Particles

Publications (2)

Publication Number Publication Date
DE69926533D1 true DE69926533D1 (de) 2005-09-08
DE69926533T2 DE69926533T2 (de) 2006-06-01

Family

ID=10840858

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69926533T Expired - Lifetime DE69926533T2 (de) 1998-10-19 1999-10-18 Partikel

Country Status (9)

Country Link
US (1) US6787233B1 (de)
EP (1) EP1135777B1 (de)
JP (1) JP4822377B2 (de)
AT (1) ATE301329T1 (de)
AU (1) AU6351499A (de)
DE (1) DE69926533T2 (de)
GB (1) GB9822822D0 (de)
NO (1) NO330228B1 (de)
WO (1) WO2000024005A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4299300B2 (ja) * 2003-06-05 2009-07-22 日鉱金属株式会社 無電解金めっき液
US20050064431A1 (en) * 2003-09-09 2005-03-24 Eastman Kodak Company Biological microarray comprising polymer particles and method of use
TWI324616B (en) * 2006-06-01 2010-05-11 Chung Cheng Inst Of Technology Nat Defense University Process for preparing a styrene polymer composite having nano metallic particles deposited thereon
JP5549069B2 (ja) * 2008-04-22 2014-07-16 日立化成株式会社 異方性導電接着剤用粒子状導電材料及びその製造方法、並びに異方性導電接着剤
GB0907372D0 (en) 2009-04-29 2009-06-10 Invitrogen Dynal As Particles
US8790916B2 (en) 2009-05-14 2014-07-29 Genestream, Inc. Microfluidic method and system for isolating particles from biological fluid
US8747084B2 (en) 2010-07-21 2014-06-10 Aperia Technologies, Inc. Peristaltic pump
DE102010042602A1 (de) * 2010-10-19 2012-04-19 Osram Opto Semiconductors Gmbh Leitfähiges Verbindungsmittel und Verfahren zur Herstellung eines leitfähigen Verbindungsmittels
GB201018379D0 (en) 2010-10-29 2010-12-15 Conpart As Conductive rf particles
GB201018380D0 (en) 2010-10-29 2010-12-15 Conpart As Process
JP5583654B2 (ja) * 2011-11-30 2014-09-03 株式会社日本触媒 導電性微粒子及びそれを用いた異方性導電材料
KR101987509B1 (ko) * 2012-01-19 2019-06-10 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
JP6004680B2 (ja) * 2012-03-12 2016-10-12 住友ゴム工業株式会社 タイヤ用ゴム組成物及びタイヤ
PL2828103T3 (pl) 2012-03-20 2017-09-29 Aperia Technologies System pompowania opon
WO2013178692A1 (en) * 2012-05-29 2013-12-05 Conpart As Isotropic conductive adhesive
GB201212489D0 (en) 2012-07-13 2012-08-29 Conpart As Improvements in conductive adhesives
US11453258B2 (en) 2013-03-12 2022-09-27 Aperia Technologies, Inc. System for tire inflation
US10245908B2 (en) 2016-09-06 2019-04-02 Aperia Technologies, Inc. System for tire inflation
US9604157B2 (en) 2013-03-12 2017-03-28 Aperia Technologies, Inc. Pump with water management
US10144254B2 (en) 2013-03-12 2018-12-04 Aperia Technologies, Inc. Tire inflation system
WO2018042701A1 (ja) * 2016-08-30 2018-03-08 日立化成株式会社 接着剤組成物
DE102017203523A1 (de) * 2016-10-04 2017-06-29 Evonik Degussa Gmbh Vorrichtung zum Erwärmen polymerer Pulver mittels Strahlung bei Pulverbeschichtungsverfahren
WO2019131904A1 (ja) 2017-12-28 2019-07-04 日立化成株式会社 接続構造体及びその製造方法
US11642920B2 (en) 2018-11-27 2023-05-09 Aperia Technologies, Inc. Hub-integrated inflation system

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4049752A (en) * 1976-02-17 1977-09-20 Eastman Kodak Company Polymeric compositions of styrene and amorphous polyolefins useful in preparing hot melt adhesives
AU530410B2 (en) 1978-02-21 1983-07-14 Sintef Preparing aqueous emulsions
DE3215413A1 (de) 1982-04-24 1983-10-27 Bayer Ag, 5090 Leverkusen Metallisierte polymergranulate, ihre herstellung und verwendung
JPS61215603A (ja) 1985-03-22 1986-09-25 Japan Synthetic Rubber Co Ltd 重合体粒子の製造方法
JPS61215604A (ja) 1985-03-22 1986-09-25 Japan Synthetic Rubber Co Ltd ポリマ−粒子の製造方法
JPH0651728B2 (ja) 1985-03-22 1994-07-06 日本合成ゴム株式会社 重合体粒子の製造方法
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
JPS6433808A (en) 1986-10-18 1989-02-03 Japan Synthetic Rubber Co Ltd Conductive particle and conductive adhesive including it
DE69017553T2 (de) 1989-08-15 1995-12-14 Casio Computer Co Ltd Leitfähige Verbindungsstruktur.
JPH04115407A (ja) 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JPH04174980A (ja) 1990-11-07 1992-06-23 Hitachi Chem Co Ltd 回路の接続部材
JPH0519241A (ja) 1991-07-15 1993-01-29 Seiko Epson Corp 液晶電気光学素子
GB9115372D0 (en) 1991-07-16 1991-08-28 Sinvent As Polymerisation process
JP2948038B2 (ja) * 1992-12-18 1999-09-13 住友ベークライト株式会社 異方導電フィルム
GB9302112D0 (en) 1993-02-03 1993-03-24 Mcdonald Brian An improved butt
JP3150054B2 (ja) 1994-10-13 2001-03-26 住友ベークライト株式会社 異方導電フィルム
JP3561748B2 (ja) * 1994-10-14 2004-09-02 綜研化学株式会社 異方導電性接着剤
JP3436327B2 (ja) * 1995-05-16 2003-08-11 日本化学工業株式会社 導電性無電解めっき粉体
DE69602150T2 (de) * 1995-09-08 1999-09-02 Idemitsu Petrochemical Co Harzzusammensetzung auf Styrolbasis
JPH09209195A (ja) * 1996-02-05 1997-08-12 Mitsubishi Heavy Ind Ltd クロムめっき方法
JP3379456B2 (ja) * 1998-12-25 2003-02-24 ソニーケミカル株式会社 異方導電性接着フィルム

Also Published As

Publication number Publication date
NO20011903D0 (no) 2001-04-18
GB9822822D0 (en) 1998-12-16
WO2000024005A1 (en) 2000-04-27
JP4822377B2 (ja) 2011-11-24
NO20011903L (no) 2001-06-18
EP1135777A1 (de) 2001-09-26
EP1135777B1 (de) 2005-08-03
AU6351499A (en) 2000-05-08
US6787233B1 (en) 2004-09-07
JP2002528852A (ja) 2002-09-03
ATE301329T1 (de) 2005-08-15
DE69926533T2 (de) 2006-06-01
NO330228B1 (no) 2011-03-07

Similar Documents

Publication Publication Date Title
DE69926533D1 (de) Partikel
ZA989560B (en) Compositions containing an Ó 1,2-fucose linkage and uses thereof.
MY124440A (en) Transparent conductive film and composition for forming same
AU4987700A (en) Polymerized modified particles and methods of making the same
WO2002051470A3 (en) Injection systems
DE69715670D1 (de) Konditionierende shampoozusammensetzung
ITRE970057A0 (it) Procedimento di pressatura di polveri ceramiche ed attrezzatura di att uazione dello stesso.
HK1023961A1 (en) Ultrafine particles and process for the productionthereof.
AU2193600A (en) An entity model that enables privilege tracking across multiple terminals
EP1249474A4 (de) Feines metalloxipulver mit hoher dispergierbarkeit und toner-zusammensetzung dieses enthaltend
EP0821931A3 (de) Metallfluoridpartikel und diese Partikel enthaltende Dentalmasse
Munroe Systematics and ecology of tonguefishes of the genus Symphurus (Cynoglossidae: Pleuronectiformes) from the western Atlantic Ocean
YU46480B (sh) Poliorganosiloksanske mase
MY104592A (en) Method of treating or coating a substrate with an aqueous composition and the use of such compositons.
BG101105A (en) Substituted benzamidines, their preparation and application as medicamentous forms
WO2002102586A3 (en) Cellulose-polymer composites and methods for manufacturing same
AU4960097A (en) Magnetizable device
ZA984272B (en) Electrical lead and financial terminal including the lead.
DE69932182D1 (de) Präparationen, die virus-ähnliche partikel als immunpotentiatoren enthalten und durch die schleimhaut verabreicht werden.
DE59005546D1 (de) Dispersionen kugelförmiger anorganischer partikel.
RS50345B (sr) Vodena farmaceutska kompozicija koja sadrži ciklesonid
GR3034675T3 (en) Polymer composition, the production and further processing thereof into receptacles
NO995900L (no) Retrovirale vektorpartikler dannet i et baculovirus- ekspresjonssystem
KR950700855A (ko) 피착된 침상미립자와 그 제법 및 용도(compound-deposited needle-shaped fine particles, method of manufacturing the same, and use of the same)
GB9927648D0 (en) Medicated dressings

Legal Events

Date Code Title Description
8364 No opposition during term of opposition