NO3040356T3 - - Google Patents

Info

Publication number
NO3040356T3
NO3040356T3 NO15160974A NO15160974A NO3040356T3 NO 3040356 T3 NO3040356 T3 NO 3040356T3 NO 15160974 A NO15160974 A NO 15160974A NO 15160974 A NO15160974 A NO 15160974A NO 3040356 T3 NO3040356 T3 NO 3040356T3
Authority
NO
Norway
Application number
NO15160974A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NO3040356T3 publication Critical patent/NO3040356T3/no

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • C08K5/5333—Esters of phosphonic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/04—Epoxynovolacs

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
NO15160974A 2014-12-29 2015-03-26 NO3040356T3 (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410834617.3A CN105802127B (zh) 2014-12-29 2014-12-29 一种无卤热固性树脂组合物及使用它的预浸料以及印制电路用层压板

Publications (1)

Publication Number Publication Date
NO3040356T3 true NO3040356T3 (no) 2018-03-10

Family

ID=52779540

Family Applications (1)

Application Number Title Priority Date Filing Date
NO15160974A NO3040356T3 (no) 2014-12-29 2015-03-26

Country Status (8)

Country Link
US (1) US20160185952A1 (no)
EP (1) EP3040356B1 (no)
KR (1) KR101676560B1 (no)
CN (1) CN105802127B (no)
ES (1) ES2650849T3 (no)
NO (1) NO3040356T3 (no)
TW (1) TWI548666B (no)
WO (1) WO2016107066A1 (no)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3193349B2 (ja) * 1998-10-09 2001-07-30 財団法人工業技術研究院 エポキシ樹脂組成物
AU2003290646A1 (en) * 2002-11-08 2004-06-03 Akzo Nobel N.V. Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler
KR20060019547A (ko) * 2003-05-22 2006-03-03 슈프레스타 엘엘씨 에폭시 수지용 폴리포스포네이트 난연성 경화제
US7910665B2 (en) * 2004-05-19 2011-03-22 Icl-Ip America Inc. Composition of epoxy resin and epoxy-reactive polyphosphonate
WO2006006592A1 (ja) * 2004-07-13 2006-01-19 Hitachi Chemical Co., Ltd. 封止用エポキシ樹脂成形材料及び電子部品装置
WO2007046316A1 (ja) * 2005-10-21 2007-04-26 Nippon Kayaku Kabushiki Kaisha エポキシ樹脂、硬化性樹脂組成物、およびその硬化物
CN101195676B (zh) * 2007-12-27 2012-08-22 东莞理工学院 一种含磷双酚a酚醛环氧树脂及其制备方法
ES2537066T3 (es) * 2010-03-22 2015-06-02 Nan-Ya Plastics Corporation Nueva composición de barniz de resina de bajo dieléctrico para laminados y preparación de la misma
TWI494340B (zh) * 2010-08-02 2015-08-01 Taiwan Union Technology Corp 環氧樹脂組成物及其製成的預浸材和印刷電路板
KR20120033670A (ko) * 2010-09-30 2012-04-09 도레이첨단소재 주식회사 할로겐 프리 커버레이 필름용 접착제 조성물 및 이를 이용한 할로겐프리 커버레이 필름
CN102101935B (zh) * 2010-12-23 2012-06-27 广东生益科技股份有限公司 无卤环氧树脂组合物以及使用其制备的挠性覆铜板
CN102093669B (zh) * 2010-12-28 2012-08-22 天津盛远达科技有限公司 一种环保型环氧塑封料及其制备方法
KR101239515B1 (ko) * 2011-02-07 2013-03-05 이테크 코포레이션 할로겐 프리 에폭시 수지 조성물과, 그것을 이용한 프리프레그 및 기판
CN103421273B (zh) * 2012-05-22 2016-02-10 中山台光电子材料有限公司 无卤素树脂组成物
CN104379668B (zh) * 2012-06-12 2016-12-07 三菱瓦斯化学株式会社 树脂组合物、预浸料、覆金属箔层叠板及印刷布线板
CN103073846A (zh) * 2013-01-18 2013-05-01 腾辉电子（苏州）有限公司 无卤低介电环氧树脂组合物
CN104119639B (zh) * 2013-04-24 2016-08-03 台光电子材料(昆山)有限公司 无卤素树脂组合物及应用其的铜箔基板及印刷电路板
JP5969133B2 (ja) * 2013-08-23 2016-08-17 台光電子材料（昆山）有限公司Ｅｌｉｔｅ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌ （Ｋｕｎｓｈａｎ） Ｃｏ． Ｌｔｄ 樹脂組成物ならびにそれを使用した銅張積層板およびプリント回路板
CN103756257B (zh) * 2013-12-27 2016-01-13 广东生益科技股份有限公司 一种热固性环氧树脂组合物及其用途

Also Published As

Publication number Publication date
KR20160082908A (ko) 2016-07-11
TWI548666B (zh) 2016-09-11
CN105802127A (zh) 2016-07-27
ES2650849T3 (es) 2018-01-22
CN105802127B (zh) 2018-05-04
TW201623361A (zh) 2016-07-01
WO2016107066A1 (zh) 2016-07-07
EP3040356B1 (en) 2017-10-11
US20160185952A1 (en) 2016-06-30
EP3040356A1 (en) 2016-07-06
KR101676560B1 (ko) 2016-11-15

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