ES2537066T3 - Nueva composición de barniz de resina de bajo dieléctrico para laminados y preparación de la misma - Google Patents

Nueva composición de barniz de resina de bajo dieléctrico para laminados y preparación de la misma Download PDF

Info

Publication number
ES2537066T3
ES2537066T3 ES10157150.3T ES10157150T ES2537066T3 ES 2537066 T3 ES2537066 T3 ES 2537066T3 ES 10157150 T ES10157150 T ES 10157150T ES 2537066 T3 ES2537066 T3 ES 2537066T3
Authority
ES
Spain
Prior art keywords
resin
dcpd
dicyclopentadiene
dihydrobenzoxazine
formula
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES10157150.3T
Other languages
English (en)
Inventor
Ming-Jen Tzou
Jung-Che Lu
Yi-Cheng Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nan Ya Plastics Corp
Original Assignee
Nan Ya Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nan Ya Plastics Corp filed Critical Nan Ya Plastics Corp
Application granted granted Critical
Publication of ES2537066T3 publication Critical patent/ES2537066T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D161/00—Coating compositions based on condensation polymers of aldehydes or ketones; Coating compositions based on derivatives of such polymers
    • C09D161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09D161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Phenolic Resins Or Amino Resins (AREA)

Abstract

Una composición de resina de barniz de bajo dieléctrico para laminados que comprende: (a) 30 a 50%, basado en el peso total de la resina, de una resina de diciclopentadieno - dihidrobenzoxazina (DCPD-BX); o una resina híbrida de 13 a 60%, basado en el peso total de la resina, de una o más resinas epoxi fenólicas de diciclopentadieno (DCPD-PNE) y un 30-50% basado en el peso total de la resina de una resina de diciclopentadieno - dihidrobenzoxazina (DCPD-BX); (b) agente retardante de llama (c) agente de curado o acelerador de curado; y (d) disolvente en que la resina de diciclopentadieno - dihidrobenzoxazina (DCPD-BX) se prepara mezclando y removiendo para hacer reaccionar (1) resina de diciclopentadieno fenólica (DCPD-PN) de la fórmula**Fórmula** en que Z es -CH3, -C2H5, -C(CH3)3 o, -H; y n es 0.5-1.5; (2) un compuesto de amina primaria con grupos monofuncionales y bifuncionales mezclados; y (3) un compuesto de formaldehído o paraformaldehído en que la resina de diciclopentadieno-dihidrobenzoxazina (DCPD-BX) tiene la fórmula estructural:**Fórmula** en que Z es -CH3, -C2H5, -C(CH3)3 o, -H; R es alquilo o arilo; y n es 0-1; y en que dichas resinas epoxi fenólicas de diciclopentadieno (DCPD-PNE) se preparan haciendo reaccionar.

Description

imagen1
imagen2
imagen3
imagen4
imagen5
imagen6
imagen7
imagen8
imagen9
imagen10
imagen11
imagen12
imagen13
imagen14
imagen15
imagen16
imagen17
imagen18
imagen19
imagen20
imagen21
imagen22
imagen23
imagen24
imagen25
imagen26
imagen27
imagen28
imagen29
imagen30

Claims (1)

  1. imagen1
    imagen2
    imagen3
    imagen4
    imagen5
    imagen6
ES10157150.3T 2010-03-22 2010-03-22 Nueva composición de barniz de resina de bajo dieléctrico para laminados y preparación de la misma Active ES2537066T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP10157150.3A EP2368930B1 (en) 2010-03-22 2010-03-22 Novel low dielectric resin varnish composition for laminates and the preparation thereof

Publications (1)

Publication Number Publication Date
ES2537066T3 true ES2537066T3 (es) 2015-06-02

Family

ID=42115396

Family Applications (1)

Application Number Title Priority Date Filing Date
ES10157150.3T Active ES2537066T3 (es) 2010-03-22 2010-03-22 Nueva composición de barniz de resina de bajo dieléctrico para laminados y preparación de la misma

Country Status (2)

Country Link
EP (1) EP2368930B1 (es)
ES (1) ES2537066T3 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6227505B2 (ja) 2013-11-12 2017-11-08 Ｊｆｅケミカル株式会社 エポキシ樹脂組成物およびエポキシ樹脂硬化物
CN104974520B (zh) * 2014-04-02 2017-11-03 广东生益科技股份有限公司 一种无卤树脂组合物及其用途
CN105131597B (zh) * 2014-06-05 2017-11-21 广东生益科技股份有限公司 一种无卤树脂组合物以及使用它的预浸料和印制电路用层压板
CN105694451B (zh) * 2014-11-28 2018-04-13 浙江华正新材料股份有限公司 一种无卤树脂组合物、预浸料、层压板及电路板
CN105802127B (zh) * 2014-12-29 2018-05-04 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料以及印制电路用层压板
CN108586684B (zh) * 2018-05-15 2020-09-04 闽江学院 三维打印用漆酚树脂及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050267286A1 (en) * 2003-10-20 2005-12-01 Shinya Nakamura Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative
US20070244267A1 (en) * 2006-04-10 2007-10-18 Dueber Thomas E Hydrophobic crosslinkable compositions for electronic applications
US20080118633A1 (en) * 2006-11-21 2008-05-22 Cheng-Chung Chen Methods for creating electronic circuitry comprising phenolic epoxy binder compositions

Also Published As

Publication number Publication date
EP2368930A1 (en) 2011-09-28
EP2368930B1 (en) 2015-02-25

Similar Documents

Publication Publication Date Title
ES2537066T3 (es) Nueva composición de barniz de resina de bajo dieléctrico para laminados y preparación de la misma
BR112015013087A2 (pt) massa a base de epóxi para fins de fixação, seu uso e o uso de determinados componentes
BRPI0915938A2 (pt) mistura, processo para preparar a mistura, uso da mistura, adesivo estrutural, e, resina epóxi curada
ES2527817T3 (es) Adhesivo de revestimiento de 2 componentes
ES2539601T3 (es) Composición de resina epoxídica 1C con toxicidad reducida
RU2013142992A (ru) Характеризующиеся высокой латентностью отвердители для эпоксидных смол
BR112013025456A2 (pt) composição curável útil para uso como material de circulação perdido em perfuração de poços
AR100955A1 (es) Composición y método para cementación
BR112014031322A2 (pt) endureceddor líquido para endurecimento de resinas de epóxido (i)
RU2017103513A (ru) Амин для низкоэмиссионных композиций эпоксидных смол
AR116377A1 (es) Composiciones poliméricas de emisión de bajo impacto de co₂ y sus métodos de preparación
ATE540022T1 (de) Blends enthaltend epoxidharze und mischungen von aminen mit guanidin-derivaten
RU2015129322A (ru) Образующая изоляционный слой композиция и ее применение
AR091806A1 (es) Agente de curado para resina epoxi, composicion de resina epoxi y adhesivo para barrera de gas y laminado con barrera de gas
BR112017016180A2 (pt) composição de resina epóxi retardante de chamas, pré-impregnado e placa laminada que usa o mesmo
ATE509053T1 (de) Dimethylformamidfreie formulierungen mit dicyanadiamid als härtemittel für wärmehärtende epoxidharze
DE602008001878D1 (de) Wärmehärtbare zusammensetzung
BR112015009388A2 (pt) composição de agente de cura, processo para preparar uma composição de agente de cura, composição curável, processo para preparar uma composição curável, processo para preparar um termofixo e artigo termofixo curado
ES2569381T3 (es) Espuma a base de resinas fenólicas
ES2572385T3 (es) Agente coalescente para composiciones acuosas
AR112939A1 (es) Compuestos adhesivos a base de solvente
AR111871A1 (es) Composiciones adhesivas a base de solvente
DK1996641T3 (da) Anvendelse af en substitueret guanidinforbindelse som en hærder for epoxyharpikser
BR112015018995A2 (pt) Composição e método para fazer endurecedor epóxi transportado por água para uso em compostos de auto-nivelamento de epóxi de dois componentes com características de vida útil longa, cura rápida e baixo encolhimento
MY156450A (en) Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material