NO20092169L - Fremgangsmate og anordning for termisk behandling av substrater - Google Patents
Fremgangsmate og anordning for termisk behandling av substraterInfo
- Publication number
- NO20092169L NO20092169L NO20092169A NO20092169A NO20092169L NO 20092169 L NO20092169 L NO 20092169L NO 20092169 A NO20092169 A NO 20092169A NO 20092169 A NO20092169 A NO 20092169A NO 20092169 L NO20092169 L NO 20092169L
- Authority
- NO
- Norway
- Prior art keywords
- cooling
- heating
- substrates
- interspace
- supply line
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 title abstract 2
- 238000007669 thermal treatment Methods 0.000 title 1
- 238000001816 cooling Methods 0.000 abstract 6
- 238000010438 heat treatment Methods 0.000 abstract 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
- F28F1/22—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means having portions engaging further tubular elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
- F28F9/0263—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by varying the geometry or cross-section of header box
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
- F28F9/0265—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Furnace Details (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- General Preparation And Processing Of Foods (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
Oppfinnelsen vedrører en fremgangsmåte for varmebehandling av substrater, og et arrangement for å utføre fremgangsmåten. Hensikten er å tilveiebringe en fremgangsmåte og et arrangement for varmebehandling av substrater som muliggjør kontinuerlig regulerbare kjølerater over et bredt temperaturområde med samtidig i det vesentligste homogen temperaturfordeling over området til varme/kjøleplaten. Dette oppnås ved hjelp av kjøle/varmeplaten (1) inneholdende et mangfold kjøle/varmerør(5) som løper parallelt med hverandre, hvor hvert kjøle/varmerør (5) innbefatter et ytre rør (9), et indre rør (8) som kan føre en strøm og et mellomrom (10) mellom dem som kan føre en strøm, og hvert indre rør (8) er forbundet med en tilførselsledning for vann og hvert mellomrom (10) er forbundet med en tilførselsledning for luft, hvor vann og luft blir ledet samtidig gjennom kjøle/varmeplaten.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006054691 | 2006-11-17 | ||
PCT/EP2007/062448 WO2008059049A1 (de) | 2006-11-17 | 2007-11-16 | Verfahren und anordnung zum thermischen behandeln von substraten |
Publications (1)
Publication Number | Publication Date |
---|---|
NO20092169L true NO20092169L (no) | 2009-06-04 |
Family
ID=38969571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20092169A NO20092169L (no) | 2006-11-17 | 2009-06-04 | Fremgangsmate og anordning for termisk behandling av substrater |
Country Status (11)
Country | Link |
---|---|
US (1) | US20100032146A1 (no) |
EP (1) | EP2092557B1 (no) |
JP (1) | JP2010510649A (no) |
KR (1) | KR20090113250A (no) |
AT (1) | ATE514183T1 (no) |
AU (1) | AU2007321185A1 (no) |
CA (1) | CA2669417A1 (no) |
IL (1) | IL198776A (no) |
NO (1) | NO20092169L (no) |
WO (1) | WO2008059049A1 (no) |
ZA (1) | ZA200903702B (no) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101800258A (zh) * | 2010-02-11 | 2010-08-11 | 天津大学 | 电热冷三联产的建筑一体化辐射板 |
CN102378301B (zh) * | 2010-08-12 | 2015-03-11 | 电信科学技术研究院 | 获取控制节点信息的方法、设备及系统 |
DE102017223592B4 (de) * | 2017-12-21 | 2023-11-09 | Meyer Burger (Germany) Gmbh | System zur elektrisch entkoppelten, homogenen Temperierung einer Elektrode mittels Wärmeleitrohren sowie Bearbeitungsanlage mit einem solchen System |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4644943B2 (ja) * | 2001-01-23 | 2011-03-09 | 東京エレクトロン株式会社 | 処理装置 |
JP2003324095A (ja) * | 2002-05-02 | 2003-11-14 | Komatsu Ltd | 半導体製造装置用基板の冷却回路とその冷却回路を備えた半導体製造装置 |
US20050229854A1 (en) * | 2004-04-15 | 2005-10-20 | Tokyo Electron Limited | Method and apparatus for temperature change and control |
JP2006064200A (ja) * | 2004-08-24 | 2006-03-09 | Furukawa Electric Co Ltd:The | 熱交換器 |
JP4738781B2 (ja) * | 2004-09-15 | 2011-08-03 | エスペック株式会社 | 温度制御装置 |
US7789962B2 (en) * | 2005-03-31 | 2010-09-07 | Tokyo Electron Limited | Device and method for controlling temperature of a mounting table, a program therefor, and a processing apparatus including same |
DE102005049598B4 (de) * | 2005-10-17 | 2017-10-19 | Att Advanced Temperature Test Systems Gmbh | Hybrid Chuck |
-
2007
- 2007-11-16 AU AU2007321185A patent/AU2007321185A1/en not_active Abandoned
- 2007-11-16 WO PCT/EP2007/062448 patent/WO2008059049A1/de active Application Filing
- 2007-11-16 AT AT07822667T patent/ATE514183T1/de active
- 2007-11-16 US US12/515,067 patent/US20100032146A1/en not_active Abandoned
- 2007-11-16 CA CA002669417A patent/CA2669417A1/en not_active Abandoned
- 2007-11-16 KR KR1020097012500A patent/KR20090113250A/ko not_active Application Discontinuation
- 2007-11-16 EP EP07822667A patent/EP2092557B1/de not_active Not-in-force
- 2007-11-16 JP JP2009536741A patent/JP2010510649A/ja active Pending
-
2009
- 2009-05-14 IL IL198776A patent/IL198776A/en not_active IP Right Cessation
- 2009-05-28 ZA ZA2009/03702A patent/ZA200903702B/en unknown
- 2009-06-04 NO NO20092169A patent/NO20092169L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP2092557B1 (de) | 2011-06-22 |
ATE514183T1 (de) | 2011-07-15 |
CA2669417A1 (en) | 2008-05-22 |
JP2010510649A (ja) | 2010-04-02 |
WO2008059049A1 (de) | 2008-05-22 |
ZA200903702B (en) | 2010-02-24 |
EP2092557A1 (de) | 2009-08-26 |
KR20090113250A (ko) | 2009-10-29 |
US20100032146A1 (en) | 2010-02-11 |
IL198776A (en) | 2012-07-31 |
AU2007321185A1 (en) | 2008-05-22 |
IL198776A0 (en) | 2010-02-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |