IL198776A0 - Method and arrangement for heat treatment of substrates - Google Patents

Method and arrangement for heat treatment of substrates

Info

Publication number
IL198776A0
IL198776A0 IL198776A IL19877609A IL198776A0 IL 198776 A0 IL198776 A0 IL 198776A0 IL 198776 A IL198776 A IL 198776A IL 19877609 A IL19877609 A IL 19877609A IL 198776 A0 IL198776 A0 IL 198776A0
Authority
IL
Israel
Prior art keywords
cooling
heating
substrates
heat treatment
arrangement
Prior art date
Application number
IL198776A
Other versions
IL198776A (en
Original Assignee
Ct Therm Thermal Solutions Gmb
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ct Therm Thermal Solutions Gmb filed Critical Ct Therm Thermal Solutions Gmb
Publication of IL198776A0 publication Critical patent/IL198776A0/en
Publication of IL198776A publication Critical patent/IL198776A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/22—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0263—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by varying the geometry or cross-section of header box
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
    • F28F9/0265—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using guiding means or impingement means inside the header box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Furnace Details (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • General Preparation And Processing Of Foods (AREA)

Abstract

To provide a method and an arrangement for heat treatment of substrates which allow continuously adjustable cooling rates over a wide temperature range with simultaneously largely homogeneous temperature distribution over the area of the heating/cooling plate, a cooling/heating plate is provided containing a multiplicity of cooling/heating pipes running parallel to one another. Each cooling/heating pipe comprises an outer pipe, an inner pipe which can carry a flow, and an interspace between them which can carry a flow. Each inner pipe is connected to a supply line for water and each interspace is connected to a supply line for air, with water and air being routed simultaneously though the cooling/heating plate.
IL198776A 2006-11-17 2009-05-14 Method and arrangement for heat treatment of substrates IL198776A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006054691 2006-11-17
PCT/EP2007/062448 WO2008059049A1 (en) 2006-11-17 2007-11-16 Method and arrangement for heat treatment of substrates

Publications (2)

Publication Number Publication Date
IL198776A0 true IL198776A0 (en) 2010-02-17
IL198776A IL198776A (en) 2012-07-31

Family

ID=38969571

Family Applications (1)

Application Number Title Priority Date Filing Date
IL198776A IL198776A (en) 2006-11-17 2009-05-14 Method and arrangement for heat treatment of substrates

Country Status (11)

Country Link
US (1) US20100032146A1 (en)
EP (1) EP2092557B1 (en)
JP (1) JP2010510649A (en)
KR (1) KR20090113250A (en)
AT (1) ATE514183T1 (en)
AU (1) AU2007321185A1 (en)
CA (1) CA2669417A1 (en)
IL (1) IL198776A (en)
NO (1) NO20092169L (en)
WO (1) WO2008059049A1 (en)
ZA (1) ZA200903702B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101800258A (en) * 2010-02-11 2010-08-11 天津大学 Electricity-heat-cold triplex co-generation building integrated radiation panel
CN102378301B (en) * 2010-08-12 2015-03-11 电信科学技术研究院 Method, device and system for obtaining control node information
DE102017223592B4 (en) * 2017-12-21 2023-11-09 Meyer Burger (Germany) Gmbh System for electrically decoupled, homogeneous temperature control of an electrode using heat pipes and processing system with such a system
BE1028438B1 (en) * 2020-06-26 2022-02-03 Atlas Copco Airpower Nv Heat exchanger and method for manufacturing such a heat exchanger

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4644943B2 (en) * 2001-01-23 2011-03-09 東京エレクトロン株式会社 Processing equipment
JP2003324095A (en) * 2002-05-02 2003-11-14 Komatsu Ltd Substrate cooling circuit for semiconductor manufacturing device and semiconductor manufacturing device provided with cooling circuit
US20050229854A1 (en) * 2004-04-15 2005-10-20 Tokyo Electron Limited Method and apparatus for temperature change and control
JP2006064200A (en) * 2004-08-24 2006-03-09 Furukawa Electric Co Ltd:The Heat exchanger
JP4738781B2 (en) * 2004-09-15 2011-08-03 エスペック株式会社 Temperature control device
US7789962B2 (en) * 2005-03-31 2010-09-07 Tokyo Electron Limited Device and method for controlling temperature of a mounting table, a program therefor, and a processing apparatus including same
DE102005049598B4 (en) * 2005-10-17 2017-10-19 Att Advanced Temperature Test Systems Gmbh Hybrid Chuck

Also Published As

Publication number Publication date
AU2007321185A1 (en) 2008-05-22
WO2008059049A1 (en) 2008-05-22
NO20092169L (en) 2009-06-04
IL198776A (en) 2012-07-31
ZA200903702B (en) 2010-02-24
US20100032146A1 (en) 2010-02-11
CA2669417A1 (en) 2008-05-22
KR20090113250A (en) 2009-10-29
EP2092557B1 (en) 2011-06-22
ATE514183T1 (en) 2011-07-15
JP2010510649A (en) 2010-04-02
EP2092557A1 (en) 2009-08-26

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Legal Events

Date Code Title Description
FF Patent granted
KB Patent renewed
MM9K Patent not in force due to non-payment of renewal fees