NO20072850L - Fremgangsmate for plettering - Google Patents
Fremgangsmate for pletteringInfo
- Publication number
- NO20072850L NO20072850L NO20072850A NO20072850A NO20072850L NO 20072850 L NO20072850 L NO 20072850L NO 20072850 A NO20072850 A NO 20072850A NO 20072850 A NO20072850 A NO 20072850A NO 20072850 L NO20072850 L NO 20072850L
- Authority
- NO
- Norway
- Prior art keywords
- plating
- electrical contact
- contact parts
- plating electrical
- solar cells
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000007747 plating Methods 0.000 title abstract 3
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
- C25D7/126—Semiconductors first coated with a seed layer or a conductive layer for solar cells
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1614—Process or apparatus coating on selected surface areas plating on one side
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/011—Electroplating using electromagnetic wave irradiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1667—Radiant energy, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Sustainable Energy (AREA)
- Inorganic Chemistry (AREA)
- Optics & Photonics (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Det er frembrakt en fremgangsmåte ved plettering av elektriske kontaktdeler på en lysfølsom anordning. Det er også frembrakt en fremgangsmåte ved plettering av elektriske kontaktdeler på solceller.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US81095406P | 2006-06-05 | 2006-06-05 | |
US11/588,520 US20080035489A1 (en) | 2006-06-05 | 2006-10-27 | Plating process |
Publications (1)
Publication Number | Publication Date |
---|---|
NO20072850L true NO20072850L (no) | 2007-12-06 |
Family
ID=38426494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20072850A NO20072850L (no) | 2006-06-05 | 2007-06-05 | Fremgangsmate for plettering |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080035489A1 (no) |
EP (1) | EP1865563A3 (no) |
JP (1) | JP5301115B2 (no) |
KR (1) | KR101370885B1 (no) |
NO (1) | NO20072850L (no) |
TW (1) | TWI359213B (no) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090120497A1 (en) * | 2007-11-09 | 2009-05-14 | Schetty Iii Robert A | Method of metallizing solar cell conductors by electroplating with minimal attack on underlying materials of construction |
JP5216633B2 (ja) * | 2008-03-19 | 2013-06-19 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | バックグラウンドめっきを抑制する方法 |
JP5097617B2 (ja) * | 2008-05-20 | 2012-12-12 | シャープ株式会社 | 太陽電池およびその製造方法、それを備えた太陽電池システム |
EP2141750B1 (en) * | 2008-07-02 | 2013-10-16 | Rohm and Haas Electronic Materials LLC | Method of light induced plating on semiconductors |
EP2157209B1 (en) | 2008-07-31 | 2014-10-22 | Rohm and Haas Electronic Materials LLC | Inhibiting Background Plating |
KR100993511B1 (ko) | 2008-11-19 | 2010-11-12 | 엘지전자 주식회사 | 태양 전지 및 그 제조 방법 |
DE102008037613A1 (de) * | 2008-11-28 | 2010-06-02 | Schott Solar Ag | Verfahren zur Herstellung eines Metallkontakts |
FR2943688B1 (fr) * | 2009-03-27 | 2012-07-20 | Alchimer | Dispositif et procede pour realiser une reaction electrochimique sur une surface d'un substrat semi-conducteur |
US20100264035A1 (en) * | 2009-04-15 | 2010-10-21 | Solopower, Inc. | Reel-to-reel plating of conductive grids for flexible thin film solar cells |
US20110146781A1 (en) * | 2009-06-26 | 2011-06-23 | E.I. Du Pont De Nemours And Company | Process of forming a grid cathode on the front-side of a silicon wafer |
DE102009038141A1 (de) * | 2009-08-13 | 2011-02-17 | Gebr. Schmid Gmbh & Co. | Verfahren zur Herstellung einer Emitter-Elektrode auf eine kristalline Siliziumsolarzelle und entsprechende Siliziumsolarzelle |
TWI396771B (zh) * | 2009-08-25 | 2013-05-21 | 羅門哈斯電子材料有限公司 | 形成矽化鎳之強化方法 |
US8337942B2 (en) * | 2009-08-28 | 2012-12-25 | Minsek David W | Light induced plating of metals on silicon photovoltaic cells |
US8722142B2 (en) * | 2009-08-28 | 2014-05-13 | David Minsek | Light induced electroless plating |
DE102009051688A1 (de) * | 2009-10-23 | 2011-04-28 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur lichtinduzierten galvanischen Pulsabscheidung zur Ausbildung einer Saatschicht für einen Metallkontakt einer Solarzelle und zur nachfolgenden Verstärkung dieser Saatschicht bzw. dieses Metallkontakts sowie Anordnung zur Durchführung des Verfahrens |
TWI486492B (zh) * | 2009-11-03 | 2015-06-01 | Newsouth Innovations Pty Ltd | 用於太陽能電池之金屬電極之光鍍技術 |
US9012766B2 (en) | 2009-11-12 | 2015-04-21 | Silevo, Inc. | Aluminum grid as backside conductor on epitaxial silicon thin film solar cells |
DE102009044823A1 (de) * | 2009-12-08 | 2011-06-09 | Q-Cells Se | Verfahren zur Herstellung von Solarzellen und Verfahren zur Herstellung von Solarmodulen |
US20110192316A1 (en) | 2010-02-05 | 2011-08-11 | E-Chem Enterprise Corp. | Electroless plating solution for providing solar cell electrode |
US20110195542A1 (en) | 2010-02-05 | 2011-08-11 | E-Chem Enterprise Corp. | Method of providing solar cell electrode by electroless plating and an activator used therein |
WO2011112620A2 (en) * | 2010-03-08 | 2011-09-15 | University Of Washington | Composite photoanodes |
US9214576B2 (en) | 2010-06-09 | 2015-12-15 | Solarcity Corporation | Transparent conducting oxide for photovoltaic devices |
US8865502B2 (en) * | 2010-06-10 | 2014-10-21 | International Business Machines Corporation | Solar cells with plated back side surface field and back side electrical contact and method of fabricating same |
DE102010040258A1 (de) * | 2010-09-03 | 2012-03-08 | Schott Solar Ag | Verfahren zur Herstellung von Solarzellen |
EP2442367B1 (en) | 2010-10-14 | 2014-07-16 | Rohm and Haas Electronic Materials LLC | Improved method for forming metal contacts |
JP5996244B2 (ja) * | 2011-04-19 | 2016-09-21 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 半導体上の銅のめっき |
TW201248874A (en) * | 2011-05-16 | 2012-12-01 | Motech Ind Inc | Solar cell with back surface field structure and manufacturing method thereof |
DE102011086302A1 (de) * | 2011-11-14 | 2013-05-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung einer metallischen Kontaktierungsstruktur auf einer Oberfläche einer Halbleiterstruktur und photovoltaische Solarzelle |
JP6082187B2 (ja) * | 2012-04-06 | 2017-02-15 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 金属コンタクトを形成する改良された方法 |
JP6092219B2 (ja) * | 2012-07-31 | 2017-03-08 | 株式会社大和化成研究所 | 電気銀めっき液 |
FR2995727B1 (fr) * | 2012-09-14 | 2014-10-24 | Commissariat Energie Atomique | Dispositif et procede de restauration de cellules photovoltaiques a base de silicium |
US9412884B2 (en) | 2013-01-11 | 2016-08-09 | Solarcity Corporation | Module fabrication of solar cells with low resistivity electrodes |
US10074755B2 (en) | 2013-01-11 | 2018-09-11 | Tesla, Inc. | High efficiency solar panel |
US9219174B2 (en) | 2013-01-11 | 2015-12-22 | Solarcity Corporation | Module fabrication of solar cells with low resistivity electrodes |
US8945978B2 (en) | 2013-06-28 | 2015-02-03 | Sunpower Corporation | Formation of metal structures in solar cells |
US10309012B2 (en) | 2014-07-03 | 2019-06-04 | Tesla, Inc. | Wafer carrier for reducing contamination from carbon particles and outgassing |
KR101575068B1 (ko) * | 2014-09-16 | 2015-12-07 | 주식회사 호진플라텍 | 광유도 도금 및 순방향 바이어스 도금을 병행하는 태양전지 기판용 도금장치 |
JP6510900B2 (ja) * | 2014-09-30 | 2019-05-08 | イサハヤ電子株式会社 | 半導体装置用接合材及びその製造方法 |
FR3036852B1 (fr) * | 2015-05-28 | 2017-06-16 | Electricite De France | Fabrication d'une cellule photovoltaique en couches minces a contacts metalliques perfectionnes |
US20170051411A1 (en) * | 2015-08-20 | 2017-02-23 | Macdermid Acumen, Inc. | Electroless Silver Plating Bath and Method of Using the Same |
US9761744B2 (en) | 2015-10-22 | 2017-09-12 | Tesla, Inc. | System and method for manufacturing photovoltaic structures with a metal seed layer |
US10115838B2 (en) | 2016-04-19 | 2018-10-30 | Tesla, Inc. | Photovoltaic structures with interlocking busbars |
SG11202005062SA (en) | 2016-07-13 | 2020-06-29 | Alligant Scientific Llc | Electrochemical methods, devices and compositions |
US10672919B2 (en) | 2017-09-19 | 2020-06-02 | Tesla, Inc. | Moisture-resistant solar cells for solar roof tiles |
US11190128B2 (en) | 2018-02-27 | 2021-11-30 | Tesla, Inc. | Parallel-connected solar roof tile modules |
CN113265685B (zh) * | 2021-05-27 | 2024-01-23 | 益阳市菲美特新材料有限公司 | 一种多孔铜箔及其制备方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4972137A (no) * | 1972-11-11 | 1974-07-12 | ||
US4144139A (en) * | 1977-11-30 | 1979-03-13 | Solarex Corporation | Method of plating by means of light |
US4251327A (en) * | 1980-01-14 | 1981-02-17 | Motorola, Inc. | Electroplating method |
US4425196A (en) * | 1982-09-03 | 1984-01-10 | Bell Telephone Laboratories, Incorporated | Photoelectrochemical plating of silver |
US4592807A (en) * | 1983-05-19 | 1986-06-03 | Union Oil Company Of California | Methods of making highly conductive photoelectrochemical electrodes |
US4608750A (en) * | 1983-08-01 | 1986-09-02 | Union Oil Company Of California | Preparation of photovoltaic device by electrochemical deposition |
US4644638A (en) * | 1983-08-01 | 1987-02-24 | Union Oil Company Of California | Photovoltaic device prepared by electroless deposition |
US4626322A (en) * | 1983-08-01 | 1986-12-02 | Union Oil Company Of California | Photoelectrochemical preparation of a solid-state semiconductor photonic device |
US4507181A (en) * | 1984-02-17 | 1985-03-26 | Energy Conversion Devices, Inc. | Method of electro-coating a semiconductor device |
JPH072996B2 (ja) * | 1984-09-21 | 1995-01-18 | 株式会社日立製作所 | 光誘起電極反応装置 |
JPS62293717A (ja) * | 1986-06-13 | 1987-12-21 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JPH01138717A (ja) * | 1987-11-25 | 1989-05-31 | Fujitsu Ltd | 半導体装置の製造方法 |
JPH01259532A (ja) * | 1988-04-08 | 1989-10-17 | Fujitsu Ltd | 光照射めっき方法及び装置 |
US5011565A (en) * | 1989-12-06 | 1991-04-30 | Mobil Solar Energy Corporation | Dotted contact solar cell and method of making same |
US5277790A (en) * | 1992-07-10 | 1994-01-11 | Technic Incorporated | Non-cyanide electroplating solution for gold or alloys thereof |
US5882435A (en) * | 1993-09-30 | 1999-03-16 | Siemens Solar Gmbh | Process for the metal coating of solar cells made of crystalline silicon |
US6251249B1 (en) * | 1996-09-20 | 2001-06-26 | Atofina Chemicals, Inc. | Precious metal deposition composition and process |
DE19928047A1 (de) * | 1999-06-19 | 2000-12-21 | Gerhard Hoffacker | Schadstoffarme bis schadstoffreie wäßrige Systeme zur galvanischen Abscheidung von Edelmetallen und Edelmetall-Legierungen |
JP4234295B2 (ja) * | 2000-03-28 | 2009-03-04 | 仗祐 中田 | 球状半導体素子の電極形成方法 |
JP2003213478A (ja) * | 2001-11-07 | 2003-07-30 | Learonal Japan Inc | 電解銅めっき方法 |
US7326673B2 (en) * | 2001-12-31 | 2008-02-05 | Advanced Technology Materials, Inc. | Treatment of semiconductor substrates using long-chain organothiols or long-chain acetates |
US20040040852A1 (en) * | 2002-08-30 | 2004-03-04 | Shipley Company, L.L.C. | Plating method |
US6805786B2 (en) * | 2002-09-24 | 2004-10-19 | Northrop Grumman Corporation | Precious alloyed metal solder plating process |
US20050252544A1 (en) * | 2004-05-11 | 2005-11-17 | Ajeet Rohatgi | Silicon solar cells and methods of fabrication |
-
2006
- 2006-10-27 US US11/588,520 patent/US20080035489A1/en not_active Abandoned
-
2007
- 2007-06-03 EP EP07010932A patent/EP1865563A3/en not_active Withdrawn
- 2007-06-04 JP JP2007148193A patent/JP5301115B2/ja not_active Expired - Fee Related
- 2007-06-05 TW TW096120048A patent/TWI359213B/zh not_active IP Right Cessation
- 2007-06-05 NO NO20072850A patent/NO20072850L/no not_active Application Discontinuation
- 2007-06-05 KR KR1020070055036A patent/KR101370885B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW200813266A (en) | 2008-03-16 |
US20080035489A1 (en) | 2008-02-14 |
EP1865563A3 (en) | 2012-08-08 |
TWI359213B (en) | 2012-03-01 |
JP5301115B2 (ja) | 2013-09-25 |
KR101370885B1 (ko) | 2014-03-07 |
JP2008057035A (ja) | 2008-03-13 |
KR20070116564A (ko) | 2007-12-10 |
EP1865563A2 (en) | 2007-12-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NO20072850L (no) | Fremgangsmate for plettering | |
DK2463676T3 (da) | Fremgangsmåde til overvågning af en fotovoltaisk generator | |
EP2135296A4 (en) | Localized power point optimizer for solar cell installations | |
BRPI0811107A2 (pt) | Processo para a obtenção de um revestimento exterior de um dispositivo fotovoltaico, substrato vítreo para aplicação fotovoltaica, e, módulo fotovoltaico. | |
DK1963616T3 (da) | Elektrisk forsyningssystem til et undesøisk system | |
DK3804809T3 (da) | Optimering af egenskaberne af et elektrisk felt for at øge feltets effekt på proliferende celler | |
WO2009032021A3 (en) | Electroplating on roll-to-roll flexible solar cell substrates | |
WO2009008605A3 (en) | Maskless exposure method | |
DK2162617T3 (da) | Fuldstændigt neddykket apparat til omdannelse af bølgeenergi | |
DE602006019791D1 (de) | Einbau einer elektrischen Einheit | |
IT1392105B1 (it) | Placca di copertura e gruppo di parti, includente tale placca, per il montaggio a parete di un apparecchio elettrico | |
DE602005005397D1 (de) | Trägerstruktur einer elektrischen Verdrahtung für Fahrräder | |
DK1921910T3 (da) | Kredsløbsarrangement med et effektmodul, som er kombineret med et kredsløbskort | |
NO20055353D0 (no) | Avbruddsfri stromforsyning til undervannsinstallasjoner | |
ATE508804T1 (de) | Elektrostatische zerstäuberanordnung | |
NO20091597L (no) | Puriner som PKC-theta-inhibitorer | |
TW200740015A (en) | Fuel cell type power generation device, electronic apparatus and treatment method of fuel | |
WO2007082753A3 (de) | Wechselrichterschaltung für netzeinspeisung und für netzunabhängigen betrieb auf basis des sperrwandlerprinzips | |
DE602005005581D1 (de) | Abdeckungsvorrichtung einer elektrischen Verdrahtung für Fahrräder | |
TW200729599A (en) | Pressure-adjustable fixture for fuel cell unit | |
ZA201001474B (en) | Power control device of a power network of an electrochemical coating facility | |
EP2149171B8 (de) | Trägervorrichtung für eine elektrochemische funktionseinrichtung, brennstoffzellenmodul und verfahren zur herstellung einer trägervorrichtung | |
DE502006002138D1 (de) | Verwendung einer beschichtung zur elektrischen kontaktierung | |
TW200713430A (en) | A method for fabricating a semiconductor device | |
FR2919115B1 (fr) | Installation de production d'electricite photovoltaique |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |