NO20063257L - Behandlingsenhet for vatkjemisk eller elektrolytisk behandling av flate arbeidsstykker - Google Patents
Behandlingsenhet for vatkjemisk eller elektrolytisk behandling av flate arbeidsstykkerInfo
- Publication number
- NO20063257L NO20063257L NO20063257A NO20063257A NO20063257L NO 20063257 L NO20063257 L NO 20063257L NO 20063257 A NO20063257 A NO 20063257A NO 20063257 A NO20063257 A NO 20063257A NO 20063257 L NO20063257 L NO 20063257L
- Authority
- NO
- Norway
- Prior art keywords
- treatment
- hydrochemical
- flat workpieces
- unit
- electrolytic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Processing Of Meat And Fish (AREA)
- Weting (AREA)
- Coating Apparatus (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Oppfinnelsen vedrører behandlingsenheter for våtkjemisk eller elektrolyttisk behandling av flate arbeidsstykker (1), så som metallfilmer, trykte kretsfilmer eller trykte kretskort, hvor arbeidsstykkene (1) transporteres i en transportbane ved hjelp av transportørelementer (6, 6', 6", 7). Behandlingsenheten innbefatter bæreelementer (4) med utsparinger (21). Bæreelementene (4) er orientert slik at de er parallelle med transportbanen. Videre innbefatter behandlingsenheten minst ett modulsystem for bæring av transportørelementene (6, 6', 6", 7), hvilket system består av innføringselementer (14, 26), fortrinnsvis anordnet i par. Det i det minste ene modulsystem er utformet slik at det vil flukte med og fortrinnsvis vil kunne gli inn i utsparingene (21) i bærerelementene (4). Behandlingsenheten benyttes fortrinnsvis i horisontale transportlinjer.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10361880A DE10361880B3 (de) | 2003-12-19 | 2003-12-19 | Behandlungseinheit zur nasschemischen oder elektrolytischen Behandlung von flachem Behandlungsgut und Verwendung der Behandlungseinheit |
PCT/EP2004/014008 WO2005059206A2 (en) | 2003-12-19 | 2004-12-07 | Treatment unit for the wet-chemical or electrolytic treatment of flat workpieces |
Publications (1)
Publication Number | Publication Date |
---|---|
NO20063257L true NO20063257L (no) | 2006-09-19 |
Family
ID=34399723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20063257A NO20063257L (no) | 2003-12-19 | 2006-07-13 | Behandlingsenhet for vatkjemisk eller elektrolytisk behandling av flate arbeidsstykker |
Country Status (14)
Country | Link |
---|---|
US (1) | US7993486B2 (no) |
EP (1) | EP1694886B1 (no) |
JP (1) | JP4887157B2 (no) |
KR (1) | KR101149302B1 (no) |
CN (1) | CN1894444B (no) |
AT (1) | ATE374266T1 (no) |
BR (1) | BRPI0417271A (no) |
DE (2) | DE10361880B3 (no) |
ES (1) | ES2293364T3 (no) |
HK (1) | HK1088641A1 (no) |
NO (1) | NO20063257L (no) |
PL (1) | PL1694886T3 (no) |
TW (1) | TWI388699B (no) |
WO (1) | WO2005059206A2 (no) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4805195B2 (ja) * | 2007-03-13 | 2011-11-02 | 富士フイルム株式会社 | 軸受体、液切り装置及びめっき被膜付きフィルムの製造装置 |
DE102007026635B4 (de) | 2007-06-06 | 2010-07-29 | Atotech Deutschland Gmbh | Vorrichtung zum nasschemischen Behandeln von Ware, Verwendung eines Strömungsorgans, Verfahren zum Einbauen eines Strömungsorgans in die Vorrichtung sowie Verfahren zur Herstellung einer nasschemisch behandelten Ware |
US9508582B2 (en) | 2011-06-03 | 2016-11-29 | Tel Nexx, Inc. | Parallel single substrate marangoni module |
CN103266334B (zh) * | 2013-04-24 | 2015-12-02 | 东莞市鸿展机械设备有限公司 | 隔液传送装置 |
CN103213804A (zh) * | 2013-05-08 | 2013-07-24 | 湖南三星磊洋玻璃机械有限公司 | 一种固定架 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4385967A (en) * | 1981-10-07 | 1983-05-31 | Chemcut Corporation | Electroplating apparatus and method |
EP0095915B1 (en) * | 1982-05-28 | 1987-01-21 | De La Rue Systems Limited | Banding method and apparatus |
US4607590A (en) * | 1982-09-07 | 1986-08-26 | Pender Don P | Apparatus for directing fluid stream against substrate sheet |
JP2538671B2 (ja) * | 1989-06-26 | 1996-09-25 | 川崎製鉄株式会社 | 水平処理槽におけるロ―ル交換装置 |
DE4035932A1 (de) * | 1990-11-12 | 1992-05-14 | Hoellmueller Hans | Vorrichtung zur herstellung flexibler schaltungen bzw. von multilayer-innenschichten |
JPH04311590A (ja) * | 1991-04-11 | 1992-11-04 | Seiko Instr Inc | フープ材両面部分めっき装置 |
DE4402596C2 (de) * | 1994-01-28 | 1997-03-27 | Atotech Deutschland Gmbh | Elektrolytisches Verfahren in horizontalen Durchlaufanlagen und Vorrichtung zur Durchführung desselben |
US5592958A (en) * | 1995-02-01 | 1997-01-14 | Coates, Asi, Inc. | Flood conveyer |
US5755935A (en) * | 1996-03-07 | 1998-05-26 | Jackson; Dale | Processing system |
EP1541720A3 (en) * | 1998-05-20 | 2006-05-31 | Process Automation International Limited | An electroplating machine |
US6153064A (en) * | 1998-11-25 | 2000-11-28 | Oliver Sales Company | Apparatus for in line plating |
DE10015349A1 (de) * | 2000-03-23 | 2001-10-25 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum Behandeln von durchgehende Löcher und/oder Vertiefungen aufweisenden Schaltungsträgern sowie Anwendung des Verfahrens und Verwendung der Vorrichtung |
DE10210538B4 (de) * | 2002-03-05 | 2004-11-18 | Atotech Deutschland Gmbh | Horizontal-Durchlaufanlage und Verfahren zum galvanotechnischen Behandeln von Behandlungsgut |
-
2003
- 2003-12-19 DE DE10361880A patent/DE10361880B3/de not_active Expired - Fee Related
-
2004
- 2004-12-07 PL PL04801219T patent/PL1694886T3/pl unknown
- 2004-12-07 BR BRPI0417271-0A patent/BRPI0417271A/pt not_active IP Right Cessation
- 2004-12-07 AT AT04801219T patent/ATE374266T1/de active
- 2004-12-07 CN CN200480037689XA patent/CN1894444B/zh active Active
- 2004-12-07 EP EP04801219A patent/EP1694886B1/en active Active
- 2004-12-07 ES ES04801219T patent/ES2293364T3/es active Active
- 2004-12-07 WO PCT/EP2004/014008 patent/WO2005059206A2/en active IP Right Grant
- 2004-12-07 US US10/581,353 patent/US7993486B2/en active Active
- 2004-12-07 JP JP2006544284A patent/JP4887157B2/ja active Active
- 2004-12-07 DE DE602004009215T patent/DE602004009215T2/de active Active
- 2004-12-07 KR KR1020067011615A patent/KR101149302B1/ko active IP Right Grant
- 2004-12-17 TW TW093139264A patent/TWI388699B/zh active
-
2006
- 2006-07-13 NO NO20063257A patent/NO20063257L/no not_active Application Discontinuation
- 2006-09-22 HK HK06110612A patent/HK1088641A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2005059206A3 (en) | 2006-01-12 |
KR20060133995A (ko) | 2006-12-27 |
CN1894444A (zh) | 2007-01-10 |
DE602004009215D1 (de) | 2007-11-08 |
KR101149302B1 (ko) | 2012-05-25 |
BRPI0417271A (pt) | 2007-03-27 |
TWI388699B (zh) | 2013-03-11 |
PL1694886T3 (pl) | 2008-03-31 |
HK1088641A1 (en) | 2006-11-10 |
US7993486B2 (en) | 2011-08-09 |
WO2005059206A2 (en) | 2005-06-30 |
ATE374266T1 (de) | 2007-10-15 |
DE602004009215T2 (de) | 2008-06-26 |
US20070012560A1 (en) | 2007-01-18 |
ES2293364T3 (es) | 2008-03-16 |
JP4887157B2 (ja) | 2012-02-29 |
JP2007514866A (ja) | 2007-06-07 |
EP1694886A2 (en) | 2006-08-30 |
EP1694886B1 (en) | 2007-09-26 |
DE10361880B3 (de) | 2005-05-04 |
TW200533790A (en) | 2005-10-16 |
CN1894444B (zh) | 2010-07-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |