ATE374266T1 - Behandlungsverfahren zur nasschemischen oder elektrolytischen behandlung von flachen werkstücken - Google Patents
Behandlungsverfahren zur nasschemischen oder elektrolytischen behandlung von flachen werkstückenInfo
- Publication number
- ATE374266T1 ATE374266T1 AT04801219T AT04801219T ATE374266T1 AT E374266 T1 ATE374266 T1 AT E374266T1 AT 04801219 T AT04801219 T AT 04801219T AT 04801219 T AT04801219 T AT 04801219T AT E374266 T1 ATE374266 T1 AT E374266T1
- Authority
- AT
- Austria
- Prior art keywords
- wet chemical
- treatment
- flat workpieces
- treatment process
- electrolytic treatment
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Processing Of Meat And Fish (AREA)
- Weting (AREA)
- Coating Apparatus (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10361880A DE10361880B3 (de) | 2003-12-19 | 2003-12-19 | Behandlungseinheit zur nasschemischen oder elektrolytischen Behandlung von flachem Behandlungsgut und Verwendung der Behandlungseinheit |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE374266T1 true ATE374266T1 (de) | 2007-10-15 |
Family
ID=34399723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04801219T ATE374266T1 (de) | 2003-12-19 | 2004-12-07 | Behandlungsverfahren zur nasschemischen oder elektrolytischen behandlung von flachen werkstücken |
Country Status (14)
Country | Link |
---|---|
US (1) | US7993486B2 (de) |
EP (1) | EP1694886B1 (de) |
JP (1) | JP4887157B2 (de) |
KR (1) | KR101149302B1 (de) |
CN (1) | CN1894444B (de) |
AT (1) | ATE374266T1 (de) |
BR (1) | BRPI0417271A (de) |
DE (2) | DE10361880B3 (de) |
ES (1) | ES2293364T3 (de) |
HK (1) | HK1088641A1 (de) |
NO (1) | NO20063257L (de) |
PL (1) | PL1694886T3 (de) |
TW (1) | TWI388699B (de) |
WO (1) | WO2005059206A2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4805195B2 (ja) * | 2007-03-13 | 2011-11-02 | 富士フイルム株式会社 | 軸受体、液切り装置及びめっき被膜付きフィルムの製造装置 |
DE102007026635B4 (de) | 2007-06-06 | 2010-07-29 | Atotech Deutschland Gmbh | Vorrichtung zum nasschemischen Behandeln von Ware, Verwendung eines Strömungsorgans, Verfahren zum Einbauen eines Strömungsorgans in die Vorrichtung sowie Verfahren zur Herstellung einer nasschemisch behandelten Ware |
WO2012167285A1 (en) | 2011-06-03 | 2012-12-06 | Tel Nexx, Inc. | Parallel single substrate processing system |
CN103266334B (zh) * | 2013-04-24 | 2015-12-02 | 东莞市鸿展机械设备有限公司 | 隔液传送装置 |
CN103213804A (zh) * | 2013-05-08 | 2013-07-24 | 湖南三星磊洋玻璃机械有限公司 | 一种固定架 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4385967A (en) * | 1981-10-07 | 1983-05-31 | Chemcut Corporation | Electroplating apparatus and method |
EP0095915B1 (de) * | 1982-05-28 | 1987-01-21 | De La Rue Systems Limited | Verfahren zum Banderslieren und Vorrichtung |
US4607590A (en) * | 1982-09-07 | 1986-08-26 | Pender Don P | Apparatus for directing fluid stream against substrate sheet |
JP2538671B2 (ja) | 1989-06-26 | 1996-09-25 | 川崎製鉄株式会社 | 水平処理槽におけるロ―ル交換装置 |
DE4035932A1 (de) * | 1990-11-12 | 1992-05-14 | Hoellmueller Hans | Vorrichtung zur herstellung flexibler schaltungen bzw. von multilayer-innenschichten |
JPH04311590A (ja) * | 1991-04-11 | 1992-11-04 | Seiko Instr Inc | フープ材両面部分めっき装置 |
DE4402596C2 (de) * | 1994-01-28 | 1997-03-27 | Atotech Deutschland Gmbh | Elektrolytisches Verfahren in horizontalen Durchlaufanlagen und Vorrichtung zur Durchführung desselben |
US5592958A (en) * | 1995-02-01 | 1997-01-14 | Coates, Asi, Inc. | Flood conveyer |
US5755935A (en) * | 1996-03-07 | 1998-05-26 | Jackson; Dale | Processing system |
EP0959153A3 (de) | 1998-05-20 | 2000-09-13 | Process Automation International Limited | Vorrichtung zur Elektroplattierung |
US6153064A (en) * | 1998-11-25 | 2000-11-28 | Oliver Sales Company | Apparatus for in line plating |
DE10015349A1 (de) * | 2000-03-23 | 2001-10-25 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum Behandeln von durchgehende Löcher und/oder Vertiefungen aufweisenden Schaltungsträgern sowie Anwendung des Verfahrens und Verwendung der Vorrichtung |
DE10210538B4 (de) * | 2002-03-05 | 2004-11-18 | Atotech Deutschland Gmbh | Horizontal-Durchlaufanlage und Verfahren zum galvanotechnischen Behandeln von Behandlungsgut |
-
2003
- 2003-12-19 DE DE10361880A patent/DE10361880B3/de not_active Expired - Fee Related
-
2004
- 2004-12-07 ES ES04801219T patent/ES2293364T3/es active Active
- 2004-12-07 DE DE602004009215T patent/DE602004009215T2/de active Active
- 2004-12-07 AT AT04801219T patent/ATE374266T1/de active
- 2004-12-07 CN CN200480037689XA patent/CN1894444B/zh active Active
- 2004-12-07 KR KR1020067011615A patent/KR101149302B1/ko active IP Right Grant
- 2004-12-07 JP JP2006544284A patent/JP4887157B2/ja active Active
- 2004-12-07 PL PL04801219T patent/PL1694886T3/pl unknown
- 2004-12-07 EP EP04801219A patent/EP1694886B1/de active Active
- 2004-12-07 BR BRPI0417271-0A patent/BRPI0417271A/pt not_active IP Right Cessation
- 2004-12-07 WO PCT/EP2004/014008 patent/WO2005059206A2/en active IP Right Grant
- 2004-12-07 US US10/581,353 patent/US7993486B2/en active Active
- 2004-12-17 TW TW093139264A patent/TWI388699B/zh active
-
2006
- 2006-07-13 NO NO20063257A patent/NO20063257L/no not_active Application Discontinuation
- 2006-09-22 HK HK06110612A patent/HK1088641A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI388699B (zh) | 2013-03-11 |
NO20063257L (no) | 2006-09-19 |
CN1894444A (zh) | 2007-01-10 |
WO2005059206A3 (en) | 2006-01-12 |
HK1088641A1 (en) | 2006-11-10 |
KR20060133995A (ko) | 2006-12-27 |
US20070012560A1 (en) | 2007-01-18 |
JP4887157B2 (ja) | 2012-02-29 |
ES2293364T3 (es) | 2008-03-16 |
JP2007514866A (ja) | 2007-06-07 |
US7993486B2 (en) | 2011-08-09 |
BRPI0417271A (pt) | 2007-03-27 |
PL1694886T3 (pl) | 2008-03-31 |
DE10361880B3 (de) | 2005-05-04 |
CN1894444B (zh) | 2010-07-14 |
EP1694886B1 (de) | 2007-09-26 |
DE602004009215T2 (de) | 2008-06-26 |
WO2005059206A2 (en) | 2005-06-30 |
DE602004009215D1 (de) | 2007-11-08 |
TW200533790A (en) | 2005-10-16 |
KR101149302B1 (ko) | 2012-05-25 |
EP1694886A2 (de) | 2006-08-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification |
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