NO20013527D0 - Laminat med gode slippegenskaper samt harpiksblanding for anvendelse i laminatet - Google Patents

Laminat med gode slippegenskaper samt harpiksblanding for anvendelse i laminatet

Info

Publication number
NO20013527D0
NO20013527D0 NO20013527A NO20013527A NO20013527D0 NO 20013527 D0 NO20013527 D0 NO 20013527D0 NO 20013527 A NO20013527 A NO 20013527A NO 20013527 A NO20013527 A NO 20013527A NO 20013527 D0 NO20013527 D0 NO 20013527D0
Authority
NO
Norway
Prior art keywords
laminate
resin composition
abrasive properties
good abrasive
good
Prior art date
Application number
NO20013527A
Other languages
English (en)
Other versions
NO20013527L (no
Inventor
Mahito Fujita
Shigeki Naitoh
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of NO20013527D0 publication Critical patent/NO20013527D0/no
Publication of NO20013527L publication Critical patent/NO20013527L/no

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/20Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00Presence of epoxy resin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00Presence of polyurethane
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00Presence of polysiloxane
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00Technologies relating to chemical industry
    • Y02P20/50Improvements relating to the production of bulk chemicals
    • Y02P20/582Recycling of unreacted starting or intermediate materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
NO20013527A 1999-11-22 2001-07-17 Laminat med gode slippegenskaper samt harpiksblanding for anvendelse i laminatet NO20013527L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP33112299 1999-11-22
PCT/JP2000/008195 WO2001038085A1 (fr) 1999-11-22 2000-11-21 Stratifie se destratifiant facilement et composition de resine a cet effet

Publications (2)

Publication Number Publication Date
NO20013527D0 true NO20013527D0 (no) 2001-07-17
NO20013527L NO20013527L (no) 2001-09-24

Family

ID=18240125

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20013527A NO20013527L (no) 1999-11-22 2001-07-17 Laminat med gode slippegenskaper samt harpiksblanding for anvendelse i laminatet

Country Status (8)

Country Link
EP (1) EP1151853A4 (no)
KR (2) KR100778130B1 (no)
CN (1) CN100486806C (no)
AU (1) AU1418501A (no)
CA (1) CA2359025A1 (no)
NO (1) NO20013527L (no)
TW (2) TWI283637B (no)
WO (1) WO2001038085A1 (no)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101085865B (zh) * 2002-12-27 2012-10-10 东丽株式会社 用于热结合的基材及用其制造层压品的方法
TWI304321B (en) * 2002-12-27 2008-12-11 Toray Industries Layered products, electromagnetic wave shielding molded articles and method for production thereof
US20040180212A1 (en) * 2003-03-14 2004-09-16 Sun Sasongko Adhesive coated slabs for sole manufacture in footwear assemblies
KR100533806B1 (ko) * 2003-07-10 2005-12-06 한국바이린주식회사 자동차 내장재 및 그 제조방법
US7153629B2 (en) * 2004-01-16 2006-12-26 Lintec Corporation Releasing sheet
CN100510790C (zh) * 2005-03-30 2009-07-08 大日本油墨化学工业株式会社 光扩散膜
JP5063016B2 (ja) * 2006-03-23 2012-10-31 リンテック株式会社 粘着シート及び剥離シート
JP2011236413A (ja) 2010-04-13 2011-11-24 Nitto Denko Corp アクリル系粘着性組成物およびアクリル系粘着テープ
JP5731137B2 (ja) 2010-06-15 2015-06-10 電気化学工業株式会社 エキシマ光照射による接着体の解体方法
KR101778720B1 (ko) * 2010-09-01 2017-09-14 덴카 주식회사 접합체의 해체 방법 및 접착제
JP5977532B2 (ja) * 2012-02-20 2016-08-24 東京応化工業株式会社 支持体分離方法及び支持体分離装置
JP5972009B2 (ja) * 2012-03-30 2016-08-17 デクセリアルズ株式会社 回路接続材料、及びこれを用いた実装体の製造方法
WO2014181031A1 (en) 2013-05-10 2014-11-13 Upm-Kymmene Wood Oy A panel comprising a solid surface coating on a thermally deformable support
KR102492572B1 (ko) 2016-12-02 2023-01-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 다층 접착 물품
CN107446516B (zh) * 2017-09-01 2020-10-23 安徽明讯新材料科技股份有限公司 一种基材可回收的保护膜及其制备方法
KR102000925B1 (ko) * 2017-09-26 2019-07-17 (주)메인일렉콤 재작업 향상을 위한 통로 패턴이 형성된 점착 테이프
CN111837219A (zh) * 2018-03-20 2020-10-27 琳得科株式会社 加工品的制造方法及粘合性层叠体
CN110993496B (zh) * 2019-12-23 2022-06-10 三芯威电子科技(江苏)有限公司 一种半导体晶圆芯片的加工方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1175330A (en) * 1982-09-01 1984-10-02 David Bray Method of manufacturing adhesive tape
FI881461A (fi) * 1988-03-29 1989-09-30 Yhtyneet Paperitehtaat Oy Kontaktlaminat.
JPH02274783A (ja) * 1989-04-14 1990-11-08 Nitto Denko Corp 粘着剤組成物、粘着テープまたはシート
JP2970963B2 (ja) * 1991-08-14 1999-11-02 日東電工株式会社 剥離性感圧接着剤及びその粘着部材
JPH05269906A (ja) * 1992-03-26 1993-10-19 Toppan Printing Co Ltd 積層体およびその分離方法
JP3308672B2 (ja) * 1993-02-26 2002-07-29 日東電工株式会社 接着シート
JP3405576B2 (ja) * 1993-11-12 2003-05-12 ダイセル化学工業株式会社 熱剥離性フィルム及び剥離方法
GB2301369B (en) * 1994-03-02 1997-08-13 Avery Dennison Corp Radiation curable silicone release compositions and coated substrates
JPH08247629A (ja) * 1995-03-14 1996-09-27 Matsushita Refrig Co Ltd 断熱箱体
JPH10119169A (ja) * 1996-08-31 1998-05-12 Ricoh Co Ltd リサイクル可能な物品及びその物品を構成するシート状部材

Also Published As

Publication number Publication date
WO2001038085A1 (fr) 2001-05-31
TWI283637B (en) 2007-07-11
EP1151853A1 (en) 2001-11-07
CN1336867A (zh) 2002-02-20
KR100941711B1 (ko) 2010-02-12
NO20013527L (no) 2001-09-24
TW200426031A (en) 2004-12-01
KR20070067209A (ko) 2007-06-27
CA2359025A1 (en) 2001-05-31
KR20010101609A (ko) 2001-11-14
CN100486806C (zh) 2009-05-13
TWI299019B (no) 2008-07-21
KR100778130B1 (ko) 2007-11-27
EP1151853A4 (en) 2003-11-05
AU1418501A (en) 2001-06-04

Similar Documents

Publication Publication Date Title
NO20013527D0 (no) Laminat med gode slippegenskaper samt harpiksblanding for anvendelse i laminatet
TWI315323B (en) Resin composition for foam and the use thereof
EP1275674A4 (en) EPOXY RESIN COMPOSITION AND PREPREG MADE FROM THIS COMPOSITION
DE60317068D1 (de) Schleifartikel mit einer schutzfolie mit vorsprüngen und verfahren zu ihrer herstellung und ihrer verwendung
AU2693400A (en) Resin composition and jig for use in transportation
ZA9810688B (en) Polymeric foam substrate and its use as in combination with decorative surfaces.
EP1154005A4 (en) SURFACE PROTECTION FILM AND COMPOSITE MATERIAL MADE THEREOF
ATE550145T1 (de) Schleifscheiben mit werkstücksichtmerkmal
EP1306467A4 (en) ALUMINUM PLATE WITH THERMOPLASTIC RESIN COATING AND ARTICLE FORM COMPRISING THIS PLATE
DE60001512D1 (de) Reifen mit elastischer Verstärkung in der Seitenwand
NO20005253L (no) Fibergjenstander med luktabsorberende evne samt fremstilling derav
HK1110885A1 (en) Flame-retardant resin composition and molded article using the same
DE60018019D1 (de) Werkstückhalter und Poliervorrichtung mit demselben
ATE309772T1 (de) Saugfähiger artikel mit öffnungen im saugfähigen körper
DE60100392D1 (de) Modifizierte Polypropylen-Harzzusammensetzung und Verwendung zu Laminaten
ID26890A (id) 2-fenil-1-(4-(2-aminoetoksi) -benzil)-indol dalam kombinasinya dengan estrogen
DE60116586D1 (de) Thermoplastische Harzzusammensetzung und daraus geformte Laminate
SG86374A1 (en) An olefinic resin composition and their moldings
AU2002368337A1 (en) Surfaces with gradients in surface topography
DE60039590D1 (de) Transparentes kunststofflaminat mit geschützter oberfläche
GB0303914D0 (en) Functional urethane resin flim and laminated film comprising the film
EP1302495A4 (en) EPOXY RESIN COMPOSITION AND FIBER-REINFORCED COMPOSITE MATERIAL COMPRISING THE EPOXY RESIN COMPOSITION
DK1066358T3 (da) Hærder til brug i urinstof-formaldehyd- og urinstof-melamin-formaldehyd-baserede klæbemidler, en klæbemiddelsammensætning omfattende hæderen samt anvendelsen heraf
AU2003273029A1 (en) Resin composition excellent in antistatic property, surface hardness, and strength
AU2003217421A1 (en) Prostate specific genes and the use thereof in design or therapeutics

Legal Events

Date Code Title Description
FC2A Withdrawal, rejection or dismissal of laid open patent application