NO20013527D0 - Laminat med gode slippegenskaper samt harpiksblanding for anvendelse i laminatet - Google Patents
Laminat med gode slippegenskaper samt harpiksblanding for anvendelse i laminatetInfo
- Publication number
- NO20013527D0 NO20013527D0 NO20013527A NO20013527A NO20013527D0 NO 20013527 D0 NO20013527 D0 NO 20013527D0 NO 20013527 A NO20013527 A NO 20013527A NO 20013527 A NO20013527 A NO 20013527A NO 20013527 D0 NO20013527 D0 NO 20013527D0
- Authority
- NO
- Norway
- Prior art keywords
- laminate
- resin composition
- abrasive properties
- good abrasive
- good
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33112299 | 1999-11-22 | ||
PCT/JP2000/008195 WO2001038085A1 (fr) | 1999-11-22 | 2000-11-21 | Stratifie se destratifiant facilement et composition de resine a cet effet |
Publications (2)
Publication Number | Publication Date |
---|---|
NO20013527D0 true NO20013527D0 (no) | 2001-07-17 |
NO20013527L NO20013527L (no) | 2001-09-24 |
Family
ID=18240125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20013527A NO20013527L (no) | 1999-11-22 | 2001-07-17 | Laminat med gode slippegenskaper samt harpiksblanding for anvendelse i laminatet |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1151853A4 (no) |
KR (2) | KR100778130B1 (no) |
CN (1) | CN100486806C (no) |
AU (1) | AU1418501A (no) |
CA (1) | CA2359025A1 (no) |
NO (1) | NO20013527L (no) |
TW (2) | TWI283637B (no) |
WO (1) | WO2001038085A1 (no) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101085865B (zh) * | 2002-12-27 | 2012-10-10 | 东丽株式会社 | 用于热结合的基材及用其制造层压品的方法 |
TWI304321B (en) * | 2002-12-27 | 2008-12-11 | Toray Industries | Layered products, electromagnetic wave shielding molded articles and method for production thereof |
US20040180212A1 (en) * | 2003-03-14 | 2004-09-16 | Sun Sasongko | Adhesive coated slabs for sole manufacture in footwear assemblies |
KR100533806B1 (ko) * | 2003-07-10 | 2005-12-06 | 한국바이린주식회사 | 자동차 내장재 및 그 제조방법 |
US7153629B2 (en) * | 2004-01-16 | 2006-12-26 | Lintec Corporation | Releasing sheet |
CN100510790C (zh) * | 2005-03-30 | 2009-07-08 | 大日本油墨化学工业株式会社 | 光扩散膜 |
JP5063016B2 (ja) * | 2006-03-23 | 2012-10-31 | リンテック株式会社 | 粘着シート及び剥離シート |
JP2011236413A (ja) | 2010-04-13 | 2011-11-24 | Nitto Denko Corp | アクリル系粘着性組成物およびアクリル系粘着テープ |
JP5731137B2 (ja) | 2010-06-15 | 2015-06-10 | 電気化学工業株式会社 | エキシマ光照射による接着体の解体方法 |
KR101778720B1 (ko) * | 2010-09-01 | 2017-09-14 | 덴카 주식회사 | 접합체의 해체 방법 및 접착제 |
JP5977532B2 (ja) * | 2012-02-20 | 2016-08-24 | 東京応化工業株式会社 | 支持体分離方法及び支持体分離装置 |
JP5972009B2 (ja) * | 2012-03-30 | 2016-08-17 | デクセリアルズ株式会社 | 回路接続材料、及びこれを用いた実装体の製造方法 |
WO2014181031A1 (en) | 2013-05-10 | 2014-11-13 | Upm-Kymmene Wood Oy | A panel comprising a solid surface coating on a thermally deformable support |
KR102492572B1 (ko) | 2016-12-02 | 2023-01-30 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 다층 접착 물품 |
CN107446516B (zh) * | 2017-09-01 | 2020-10-23 | 安徽明讯新材料科技股份有限公司 | 一种基材可回收的保护膜及其制备方法 |
KR102000925B1 (ko) * | 2017-09-26 | 2019-07-17 | (주)메인일렉콤 | 재작업 향상을 위한 통로 패턴이 형성된 점착 테이프 |
CN111837219A (zh) * | 2018-03-20 | 2020-10-27 | 琳得科株式会社 | 加工品的制造方法及粘合性层叠体 |
CN110993496B (zh) * | 2019-12-23 | 2022-06-10 | 三芯威电子科技(江苏)有限公司 | 一种半导体晶圆芯片的加工方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1175330A (en) * | 1982-09-01 | 1984-10-02 | David Bray | Method of manufacturing adhesive tape |
FI881461A (fi) * | 1988-03-29 | 1989-09-30 | Yhtyneet Paperitehtaat Oy | Kontaktlaminat. |
JPH02274783A (ja) * | 1989-04-14 | 1990-11-08 | Nitto Denko Corp | 粘着剤組成物、粘着テープまたはシート |
JP2970963B2 (ja) * | 1991-08-14 | 1999-11-02 | 日東電工株式会社 | 剥離性感圧接着剤及びその粘着部材 |
JPH05269906A (ja) * | 1992-03-26 | 1993-10-19 | Toppan Printing Co Ltd | 積層体およびその分離方法 |
JP3308672B2 (ja) * | 1993-02-26 | 2002-07-29 | 日東電工株式会社 | 接着シート |
JP3405576B2 (ja) * | 1993-11-12 | 2003-05-12 | ダイセル化学工業株式会社 | 熱剥離性フィルム及び剥離方法 |
GB2301369B (en) * | 1994-03-02 | 1997-08-13 | Avery Dennison Corp | Radiation curable silicone release compositions and coated substrates |
JPH08247629A (ja) * | 1995-03-14 | 1996-09-27 | Matsushita Refrig Co Ltd | 断熱箱体 |
JPH10119169A (ja) * | 1996-08-31 | 1998-05-12 | Ricoh Co Ltd | リサイクル可能な物品及びその物品を構成するシート状部材 |
-
2000
- 2000-11-21 CA CA002359025A patent/CA2359025A1/en not_active Abandoned
- 2000-11-21 KR KR1020017009128A patent/KR100778130B1/ko not_active IP Right Cessation
- 2000-11-21 WO PCT/JP2000/008195 patent/WO2001038085A1/ja active Application Filing
- 2000-11-21 EP EP00976385A patent/EP1151853A4/en not_active Withdrawn
- 2000-11-21 AU AU14185/01A patent/AU1418501A/en not_active Abandoned
- 2000-11-21 KR KR1020077010910A patent/KR100941711B1/ko not_active IP Right Cessation
- 2000-11-21 CN CNB008029326A patent/CN100486806C/zh not_active Expired - Fee Related
- 2000-11-22 TW TW093122706A patent/TWI283637B/zh not_active IP Right Cessation
- 2000-11-22 TW TW089124748A patent/TWI299019B/zh not_active IP Right Cessation
-
2001
- 2001-07-17 NO NO20013527A patent/NO20013527L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2001038085A1 (fr) | 2001-05-31 |
TWI283637B (en) | 2007-07-11 |
EP1151853A1 (en) | 2001-11-07 |
CN1336867A (zh) | 2002-02-20 |
KR100941711B1 (ko) | 2010-02-12 |
NO20013527L (no) | 2001-09-24 |
TW200426031A (en) | 2004-12-01 |
KR20070067209A (ko) | 2007-06-27 |
CA2359025A1 (en) | 2001-05-31 |
KR20010101609A (ko) | 2001-11-14 |
CN100486806C (zh) | 2009-05-13 |
TWI299019B (no) | 2008-07-21 |
KR100778130B1 (ko) | 2007-11-27 |
EP1151853A4 (en) | 2003-11-05 |
AU1418501A (en) | 2001-06-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |