NO133819B - - Google Patents
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- Publication number
- NO133819B NO133819B NO1264/72A NO126472A NO133819B NO 133819 B NO133819 B NO 133819B NO 1264/72 A NO1264/72 A NO 1264/72A NO 126472 A NO126472 A NO 126472A NO 133819 B NO133819 B NO 133819B
- Authority
- NO
- Norway
- Prior art keywords
- electrolyte
- insulating material
- layer
- disc
- sealing
- Prior art date
Links
- 239000003792 electrolyte Substances 0.000 claims description 14
- 239000011810 insulating material Substances 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000004048 modification Effects 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- 239000012774 insulation material Substances 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 239000002001 electrolyte material Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000028161 membrane depolarization Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NO753625A NO141530C (no) | 1971-04-16 | 1975-10-29 | Keramisk multilagskrets-struktur samt fremgangsmaate for fremstilling herav |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13468971A | 1971-04-16 | 1971-04-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
NO133819B true NO133819B (sv) | 1976-03-22 |
NO133819C NO133819C (sv) | 1976-06-30 |
Family
ID=22464508
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO1264/72A NO133819C (sv) | 1971-04-16 | 1972-04-13 |
Country Status (18)
Country | Link |
---|---|
US (1) | US3679950A (sv) |
JP (1) | JPS5335085B1 (sv) |
AR (1) | AR202778A1 (sv) |
AU (1) | AU473476B2 (sv) |
BE (1) | BE782146A (sv) |
BR (1) | BR7202200D0 (sv) |
CH (1) | CH593875A5 (sv) |
DE (1) | DE2264943C3 (sv) |
ES (5) | ES401743A1 (sv) |
FR (1) | FR2139827B1 (sv) |
GB (1) | GB1373575A (sv) |
IE (1) | IE36276B1 (sv) |
IL (1) | IL38721A (sv) |
IT (1) | IT951296B (sv) |
NL (1) | NL162505C (sv) |
NO (1) | NO133819C (sv) |
SE (1) | SE7708721L (sv) |
ZA (1) | ZA722439B (sv) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4030004A (en) * | 1971-04-16 | 1977-06-14 | Nl Industries, Inc. | Dielectric ceramic matrices with end barriers |
US3882059A (en) * | 1973-05-11 | 1975-05-06 | Technical Ceramics Inc | Method of making ceramic capacitor |
US4189760A (en) * | 1973-05-13 | 1980-02-19 | Erie Technological Products, Inc. | Monolithic capacitor with non-noble metal electrodes and method of making the same |
US3879645A (en) * | 1973-09-24 | 1975-04-22 | Nl Industries Inc | Ceramic capacitors |
US4353957A (en) * | 1973-09-24 | 1982-10-12 | Tam Ceramics Inc. | Ceramic matrices for electronic devices and process for forming same |
US4071880A (en) * | 1974-06-10 | 1978-01-31 | N L Industries, Inc. | Ceramic bodies with end termination electrodes |
EP0036435B1 (de) * | 1980-03-25 | 1982-12-01 | Rosenthal Technik AG | Verfahren zur Herstellung von keramischen Mehrschichtgehäusen |
GB2103422B (en) * | 1981-07-30 | 1985-02-27 | Standard Telephones Cables Ltd | Ceramic capacitors |
GB2118366B (en) * | 1982-03-30 | 1985-09-18 | Standard Telephones Cables Ltd | Terminals for multilayer ceramic dielectric capacitors |
US4458294A (en) * | 1982-07-28 | 1984-07-03 | Corning Glass Works | Compliant termination for ceramic chip capacitors |
US4430690A (en) | 1982-10-07 | 1984-02-07 | International Business Machines Corporation | Low inductance MLC capacitor with metal impregnation and solder bar contact |
US4574329A (en) * | 1983-10-07 | 1986-03-04 | U.S. Philips Corporation | Multilayer ceramic capacitor |
DE3407443A1 (de) * | 1984-02-29 | 1985-08-29 | Buchtal Gmbh Keramische Betriebe, 8472 Schwarzenfeld | Plattenfoermiges verbundelement |
DE3509746A1 (de) * | 1985-03-18 | 1986-09-18 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum verfuellen von evakuierten hohlraeumen in material bzw. in koerpern |
US4687044A (en) * | 1985-05-03 | 1987-08-18 | Tam Ceramics, Inc. | Injection method and apparatus |
DE3771973D1 (de) * | 1986-08-18 | 1991-09-12 | Siemens Ag | Verfahren zur herstellung von fuellschichtbauteilen. |
ES2035837T3 (es) * | 1986-08-18 | 1993-05-01 | Siemens Aktiengesellschaft | Componente de capa de relleno. |
DE3725455A1 (de) * | 1987-07-31 | 1989-02-09 | Siemens Ag | Elektrisches vielschichtbauelement mit einem gesinterten, monolithischen keramikkoerper und verfahren zur herstellung des elektrischen vielschichtbauelementes |
DE3725454A1 (de) * | 1987-07-31 | 1989-02-09 | Siemens Ag | Elektrisches vielschichtbauelement mit einem gesinterten, monolithischen keramikkoerper und verfahren zur herstellung des elektrischen vielschichtbauelementes |
ATE78950T1 (de) * | 1987-07-31 | 1992-08-15 | Siemens Ag | Fuellschichtbauteil mit einem gesinterten, monolithischen keramikkoerper und verfahren zu dessen herstellung. |
US5234641A (en) * | 1988-05-06 | 1993-08-10 | Avx Corporation | Method of making varistor or capacitor |
US4881308A (en) * | 1988-07-01 | 1989-11-21 | Avx Corporation | Method of terminating lead filled capacitor |
US4903166A (en) * | 1989-06-09 | 1990-02-20 | Avx Corporation | Electrostrictive actuators |
JP3041952B2 (ja) † | 1990-02-23 | 2000-05-15 | セイコーエプソン株式会社 | インクジェット式記録ヘッド、圧電振動体、及びこれらの製造方法 |
US5121288A (en) * | 1990-10-12 | 1992-06-09 | Motorola, Inc. | Capacitive power supply |
JP3121119B2 (ja) * | 1992-06-16 | 2000-12-25 | ローム株式会社 | 積層セラミックコンデンサの外部電極の形成方法 |
US5216573A (en) * | 1992-08-21 | 1993-06-01 | Avx Corporation | Lead filled ceramic capacitor and method of making same |
DE4331381C1 (de) * | 1993-09-15 | 1995-02-09 | Siemens Matsushita Components | Verfahren zur Herstellung von elektrischen Vielschichtwiderstandselementen |
US5601673A (en) * | 1995-01-03 | 1997-02-11 | Ferro Corporation | Method of making ceramic article with cavity using LTCC tape |
DE19509668C1 (de) * | 1995-03-17 | 1996-05-23 | Karlsruhe Forschzent | Verfahren zur Herstellung eines keramischen Sinterkörpers |
US5661882A (en) * | 1995-06-30 | 1997-09-02 | Ferro Corporation | Method of integrating electronic components into electronic circuit structures made using LTCC tape |
DE19529304C2 (de) * | 1995-08-09 | 1998-09-03 | Siemens Matsushita Components | Verfahren zur Herstellung von elektrischen Vielschichtwiderstandselementen |
JP3077056B2 (ja) * | 1996-09-12 | 2000-08-14 | 株式会社村田製作所 | 積層型電子部品 |
DE10018377C1 (de) * | 2000-04-13 | 2001-12-06 | Epcos Ag | Keramisches Vielschichtbauelement und Verfahren zur Herstellung |
GB0109782D0 (en) * | 2001-04-20 | 2001-06-13 | Btg Int Ltd | Nanoelectronic devices and circuits |
WO2002091408A1 (de) * | 2001-05-08 | 2002-11-14 | Epcos Ag | Keramisches vielschichtbauelement und verfahren zur herstellung |
US20030020377A1 (en) * | 2001-07-30 | 2003-01-30 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive element and piezoelectric/electrostrictive device and production method thereof |
US7152291B2 (en) | 2002-04-15 | 2006-12-26 | Avx Corporation | Method for forming plated terminations |
JP3870936B2 (ja) * | 2003-07-14 | 2007-01-24 | 株式会社村田製作所 | 積層セラミック電子部品 |
US6798640B1 (en) * | 2003-09-03 | 2004-09-28 | Sun Microsystems, Inc. | Capacitor having plates with a pattern void of conductive material and method of making therfor |
US7279724B2 (en) * | 2004-02-25 | 2007-10-09 | Philips Lumileds Lighting Company, Llc | Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection |
JP2006295077A (ja) * | 2005-04-14 | 2006-10-26 | Rohm Co Ltd | セラミック製チップ型電子部品とその製造方法 |
CN100521000C (zh) * | 2005-09-21 | 2009-07-29 | 佳荣科技股份有限公司 | 固态电容及其制作方法 |
EP1788595B1 (en) * | 2005-11-17 | 2010-06-16 | Ctech Corporation | Solid capacitor and manufacturing method thereof |
JP2007234800A (ja) * | 2006-02-28 | 2007-09-13 | Tdk Corp | 電子部品及びその製造方法 |
DE102006022600B4 (de) * | 2006-05-15 | 2008-02-14 | Siemens Ag | Herstellungsverfahren eines Piezoaktors |
WO2009018130A2 (en) * | 2007-07-27 | 2009-02-05 | The Penn State Research Foundation | Piezoelectric materials based on flexoelectric charge separation and their fabrication |
DE102007043098A1 (de) * | 2007-09-10 | 2009-03-12 | Epcos Ag | Verfahren zur Herstellung eines Vielschichtbauelements |
CN109320260B (zh) * | 2018-08-30 | 2021-06-04 | 四川众磊陶瓷科技有限公司 | 一种馈电/绝缘异质复合陶瓷材料一体化制备方法 |
KR102416778B1 (ko) * | 2020-11-23 | 2022-07-06 | 한국생산기술연구원 | 유전체와 전극의 어셈블리 및 그 제조 방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2421652A (en) * | 1943-08-02 | 1947-06-03 | Sprague Electric Co | Electrical conductor |
US2939059A (en) * | 1955-03-21 | 1960-05-31 | Clevite Corp | Capacitor of high permittivity ceramic |
US3223905A (en) * | 1964-10-14 | 1965-12-14 | Sprague Electric Co | Mixed metal-ceramic capacitor |
-
1971
- 1971-04-16 US US134689A patent/US3679950A/en not_active Expired - Lifetime
-
1972
- 1972-02-08 IL IL38721A patent/IL38721A/xx unknown
- 1972-03-08 CH CH340772A patent/CH593875A5/xx not_active IP Right Cessation
- 1972-04-10 IT IT22991/72A patent/IT951296B/it active
- 1972-04-11 IE IE470/72A patent/IE36276B1/xx unknown
- 1972-04-11 ZA ZA722439A patent/ZA722439B/xx unknown
- 1972-04-12 AU AU41067/72A patent/AU473476B2/en not_active Expired
- 1972-04-12 JP JP3682972A patent/JPS5335085B1/ja active Pending
- 1972-04-13 NO NO1264/72A patent/NO133819C/no unknown
- 1972-04-13 FR FR7212977A patent/FR2139827B1/fr not_active Expired
- 1972-04-14 NL NL7205042.A patent/NL162505C/xx not_active IP Right Cessation
- 1972-04-14 GB GB1746372A patent/GB1373575A/en not_active Expired
- 1972-04-14 DE DE2264943A patent/DE2264943C3/de not_active Expired
- 1972-04-14 AR AR241494A patent/AR202778A1/es active
- 1972-04-14 BE BE782146A patent/BE782146A/xx unknown
- 1972-04-14 BR BR2200/72A patent/BR7202200D0/pt unknown
- 1972-04-14 ES ES401743A patent/ES401743A1/es not_active Expired
-
1974
- 1974-08-16 ES ES429324A patent/ES429324A1/es not_active Expired
- 1974-08-16 ES ES1974205337U patent/ES205337Y/es not_active Expired
- 1974-08-16 ES ES1974205338U patent/ES205338Y/es not_active Expired
- 1974-08-16 ES ES0205339U patent/ES205339Y/es not_active Expired
-
1977
- 1977-07-29 SE SE7708721A patent/SE7708721L/sv not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
AU473476B2 (en) | 1973-10-18 |
IE36276B1 (en) | 1976-09-29 |
ES205337Y (es) | 1976-06-01 |
ES205339Y (es) | 1976-06-01 |
ES205338Y (es) | 1976-06-01 |
ES205337U (es) | 1976-02-01 |
AR202778A1 (es) | 1975-07-24 |
ES401743A1 (es) | 1975-11-01 |
JPS5335085B1 (sv) | 1978-09-25 |
DE2264943A1 (de) | 1975-07-31 |
BE782146A (fr) | 1972-07-31 |
DE2264943C3 (de) | 1979-10-31 |
IE36276L (en) | 1972-10-16 |
AU4106772A (en) | 1973-10-18 |
ES429324A1 (es) | 1976-08-16 |
DE2218170A1 (de) | 1972-11-30 |
NL162505B (nl) | 1979-12-17 |
BR7202200D0 (pt) | 1973-05-15 |
SE7708721L (sv) | 1977-07-29 |
GB1373575A (en) | 1974-11-13 |
NL162505C (nl) | 1980-05-16 |
ES205338U (es) | 1976-02-01 |
US3679950A (en) | 1972-07-25 |
IL38721A0 (en) | 1972-04-27 |
ES205339U (es) | 1976-02-01 |
NL7205042A (sv) | 1972-10-18 |
IL38721A (en) | 1975-06-25 |
CH593875A5 (sv) | 1977-12-15 |
ZA722439B (en) | 1973-01-31 |
FR2139827B1 (sv) | 1976-10-29 |
NO133819C (sv) | 1976-06-30 |
IT951296B (it) | 1973-06-30 |
DE2264943B2 (de) | 1979-03-01 |
DE2218170B2 (de) | 1976-03-04 |
FR2139827A1 (sv) | 1973-01-12 |
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