NL8700078A - Werkwijze voor het aanbrengen van elektrische schakelingen op een basisplaat. - Google Patents
Werkwijze voor het aanbrengen van elektrische schakelingen op een basisplaat. Download PDFInfo
- Publication number
- NL8700078A NL8700078A NL8700078A NL8700078A NL8700078A NL 8700078 A NL8700078 A NL 8700078A NL 8700078 A NL8700078 A NL 8700078A NL 8700078 A NL8700078 A NL 8700078A NL 8700078 A NL8700078 A NL 8700078A
- Authority
- NL
- Netherlands
- Prior art keywords
- base plate
- copper
- layer
- paste
- sides
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1423—Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49099—Coating resistive material on a base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP564586 | 1986-01-14 | ||
JP564686 | 1986-01-14 | ||
JP564686A JPH0237117B2 (ja) | 1986-01-14 | 1986-01-14 | Kibannidodenkairookeiseisuruhoho |
JP61005645A JPS62163395A (ja) | 1986-01-14 | 1986-01-14 | 基板に導電回路を形成する方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL8700078A true NL8700078A (nl) | 1987-08-03 |
Family
ID=26339617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL8700078A NL8700078A (nl) | 1986-01-14 | 1987-01-14 | Werkwijze voor het aanbrengen van elektrische schakelingen op een basisplaat. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4735676A (fr) |
KR (1) | KR900003152B1 (fr) |
DE (1) | DE3700910A1 (fr) |
FR (1) | FR2593016B1 (fr) |
NL (1) | NL8700078A (fr) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63141388A (ja) * | 1986-12-03 | 1988-06-13 | 東芝ライテック株式会社 | 厚膜回路基板の製造方法 |
US4969979A (en) * | 1989-05-08 | 1990-11-13 | International Business Machines Corporation | Direct electroplating of through holes |
US5483217A (en) * | 1992-07-15 | 1996-01-09 | Nippondenso Co., Ltd. | Electronic circuit device |
US5284548A (en) * | 1993-03-03 | 1994-02-08 | Microelectronics And Computer Technology Corporation | Process for producing electrical circuits with precision surface features |
US5603847A (en) * | 1993-04-07 | 1997-02-18 | Zycon Corporation | Annular circuit components coupled with printed circuit board through-hole |
US5347258A (en) * | 1993-04-07 | 1994-09-13 | Zycon Corporation | Annular resistor coupled with printed circuit board through-hole |
US6171468B1 (en) | 1993-05-17 | 2001-01-09 | Electrochemicals Inc. | Direct metallization process |
US6710259B2 (en) | 1993-05-17 | 2004-03-23 | Electrochemicals, Inc. | Printed wiring boards and methods for making them |
US5476580A (en) * | 1993-05-17 | 1995-12-19 | Electrochemicals Inc. | Processes for preparing a non-conductive substrate for electroplating |
US6303181B1 (en) | 1993-05-17 | 2001-10-16 | Electrochemicals Inc. | Direct metallization process employing a cationic conditioner and a binder |
US5690805A (en) * | 1993-05-17 | 1997-11-25 | Electrochemicals Inc. | Direct metallization process |
US5725807A (en) * | 1993-05-17 | 1998-03-10 | Electrochemicals Inc. | Carbon containing composition for electroplating |
US5878487A (en) * | 1996-09-19 | 1999-03-09 | Ford Motor Company | Method of supporting an electrical circuit on an electrically insulative base substrate |
US6100787A (en) * | 1997-05-28 | 2000-08-08 | Motorola, Inc. | Multilayer ceramic package with low-variance embedded resistors |
US5976391A (en) * | 1998-01-13 | 1999-11-02 | Ford Motor Company | Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same |
DE19936198A1 (de) * | 1999-07-31 | 2001-02-01 | Mannesmann Vdo Ag | Leiterplatte |
DE19961683A1 (de) * | 1999-12-21 | 2001-06-28 | Philips Corp Intellectual Pty | Bauteil mit Dünnschichtschaltkreis |
SE523150C2 (sv) | 2000-01-14 | 2004-03-30 | Ericsson Telefon Ab L M | Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt |
JP2003243807A (ja) * | 2002-02-14 | 2003-08-29 | Nec Kansai Ltd | 配線基板及びその製造方法 |
US7276453B2 (en) * | 2004-08-10 | 2007-10-02 | E.I. Du Pont De Nemours And Company | Methods for forming an undercut region and electronic devices incorporating the same |
US7166860B2 (en) * | 2004-12-30 | 2007-01-23 | E. I. Du Pont De Nemours And Company | Electronic device and process for forming same |
CA2604726C (fr) * | 2005-04-20 | 2012-01-24 | Phibro-Tech, Inc. | Production de poudres de fines particules de cuivre |
CN106879190A (zh) * | 2012-12-17 | 2017-06-20 | 纬创资通股份有限公司 | 电路板及电路板的制造方法 |
WO2020133421A1 (fr) * | 2018-12-29 | 2020-07-02 | 深南电路股份有限公司 | Carte de circuit imprimé d'assemblage diversifié et procédé de fabrication |
KR102312521B1 (ko) * | 2020-06-09 | 2021-10-15 | (주)메쉬 | 열화상 카메라의 온도정확도 향상을 위한 외부 장착형 온도교정장치 및 이를 이용한 온도 측정 시스템 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2309196A1 (de) * | 1973-02-21 | 1974-09-05 | Matsushita Electric Ind Co Ltd | Verfahren zur herstellung gedruckter schaltungen |
JPS5210568A (en) * | 1974-12-28 | 1977-01-26 | Hideo Machida | Method of manufacturing multilayered printed wiring substrate |
US4211603A (en) * | 1978-05-01 | 1980-07-08 | Tektronix, Inc. | Multilayer circuit board construction and method |
JPS56103260A (en) * | 1980-01-22 | 1981-08-18 | Asahi Kagaku Kenkyusho:Kk | Conductive paint containing copper powder |
DE3006117C2 (de) * | 1980-02-19 | 1981-11-26 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Verfahren zum Herstellen von Leiterplatten mit mindestens zwei Leiterzugebenen |
DE3024030A1 (de) * | 1980-06-26 | 1982-01-14 | Siemens AG, 1000 Berlin und 8000 München | Rc-netzwerk in form einer folienschaltung |
US4424095A (en) * | 1981-01-12 | 1984-01-03 | Kollmorgen Technologies Corporation | Radiation stress relieving of polymer articles |
US4444848A (en) * | 1982-01-04 | 1984-04-24 | Western Electric Co., Inc. | Adherent metal coatings on rubber-modified epoxy resin surfaces |
US4458295A (en) * | 1982-11-09 | 1984-07-03 | Raytheon Company | Lumped passive components and method of manufacture |
US4512829A (en) * | 1983-04-07 | 1985-04-23 | Satosen Co., Ltd. | Process for producing printed circuit boards |
-
1986
- 1986-12-29 US US06/947,437 patent/US4735676A/en not_active Expired - Fee Related
-
1987
- 1987-01-13 KR KR1019870000192A patent/KR900003152B1/ko not_active IP Right Cessation
- 1987-01-13 FR FR878700274A patent/FR2593016B1/fr not_active Expired - Fee Related
- 1987-01-14 NL NL8700078A patent/NL8700078A/nl not_active Application Discontinuation
- 1987-01-14 DE DE19873700910 patent/DE3700910A1/de active Granted
Also Published As
Publication number | Publication date |
---|---|
KR900003152B1 (ko) | 1990-05-09 |
US4735676A (en) | 1988-04-05 |
DE3700910A1 (de) | 1987-08-27 |
DE3700910C2 (fr) | 1989-06-22 |
FR2593016A1 (fr) | 1987-07-17 |
KR870007646A (ko) | 1987-08-20 |
FR2593016B1 (fr) | 1991-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
NL8700078A (nl) | Werkwijze voor het aanbrengen van elektrische schakelingen op een basisplaat. | |
EP0003364B1 (fr) | Réalisation de circuits imprimés par un procédé rendant jointives les particules d'images de poudres métalliques | |
KR900003158B1 (ko) | 기판상의 전기회로 형성방법 | |
KR19980081191A (ko) | 도전성 페이스트 및 그 제조방법과 그것을 이용한 프린트 배선기판 | |
NL8602455A (nl) | Werkwijze voor het vormen van gedrukte bedradingen op een basisplaat. | |
JP3273015B2 (ja) | 導電性ペーストの製造方法 | |
JPH0237117B2 (ja) | Kibannidodenkairookeiseisuruhoho | |
NL8702082A (nl) | Werkwijze voor het op een basisplaat aanbrengen van elektrisch geleidende schakelingen. | |
JPH03264678A (ja) | 導電性ペースト用銅粉 | |
JPH08167768A (ja) | 回路パターンの形成方法及びそのペースト | |
JPH0373503A (ja) | 回路形成方法 | |
JP2842631B2 (ja) | プリント配線板の製造方法 | |
JPS58161760A (ja) | アルミニウム基板のめつき方法 | |
JPH0213957B2 (fr) | ||
GB2186435A (en) | Making printed circuits | |
JPH08250859A (ja) | セラミック多層配線基板およびその製造方法 | |
JP2673825B2 (ja) | 多層回路基板の製造方法 | |
JP2002245873A (ja) | 低抵抗導電体の形成方法 | |
JPS5892293A (ja) | 回路板およびその製造方法 | |
JPS63272097A (ja) | 多層回路基板の製造法 | |
JPH01239991A (ja) | 回路基板の製造方法 | |
JPH0350405B2 (fr) | ||
JP2002203429A (ja) | 導電性ペーストおよびそれを用いたプリント配線基板 | |
JPS6387797A (ja) | 基板に導電回路を形成する方法 | |
JPS63310972A (ja) | メッキ促進剤 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
BA | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
BV | The patent application has lapsed |