NL8401619A - Elektronisch microcircuit voorzien van kontaktverhogingen. - Google Patents

Elektronisch microcircuit voorzien van kontaktverhogingen. Download PDF

Info

Publication number
NL8401619A
NL8401619A NL8401619A NL8401619A NL8401619A NL 8401619 A NL8401619 A NL 8401619A NL 8401619 A NL8401619 A NL 8401619A NL 8401619 A NL8401619 A NL 8401619A NL 8401619 A NL8401619 A NL 8401619A
Authority
NL
Netherlands
Prior art keywords
contact
elevations
paladium
contact elevations
electronic microcircuit
Prior art date
Application number
NL8401619A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8401619A priority Critical patent/NL8401619A/nl
Priority to EP85200739A priority patent/EP0165626B1/de
Priority to DE8585200739T priority patent/DE3574526D1/de
Priority to KR1019850003274A priority patent/KR850008042A/ko
Priority to JP60108074A priority patent/JPS60254739A/ja
Publication of NL8401619A publication Critical patent/NL8401619A/nl
Priority to SG877/90A priority patent/SG87790G/en
Priority to HK876/91A priority patent/HK87691A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
NL8401619A 1984-05-21 1984-05-21 Elektronisch microcircuit voorzien van kontaktverhogingen. NL8401619A (nl)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL8401619A NL8401619A (nl) 1984-05-21 1984-05-21 Elektronisch microcircuit voorzien van kontaktverhogingen.
EP85200739A EP0165626B1 (de) 1984-05-21 1985-05-10 Verfahren zur Herstellung von elektronischen Mikroschaltungen mit höckerförmigen Kontakten
DE8585200739T DE3574526D1 (de) 1984-05-21 1985-05-10 Verfahren zur herstellung von elektronischen mikroschaltungen mit hoeckerfoermigen kontakten.
KR1019850003274A KR850008042A (ko) 1984-05-21 1985-05-14 돌출접점을 가진 전자 마이크로회로
JP60108074A JPS60254739A (ja) 1984-05-21 1985-05-20 接触突起を有する超小型電子回路
SG877/90A SG87790G (en) 1984-05-21 1990-10-25 Method of manufacturing an electronic microcircuit provided with contact elevations
HK876/91A HK87691A (en) 1984-05-21 1991-11-07 Method of manufacturing an electronic microcircuit provided with contact elevations

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8401619A NL8401619A (nl) 1984-05-21 1984-05-21 Elektronisch microcircuit voorzien van kontaktverhogingen.
NL8401619 1984-05-21

Publications (1)

Publication Number Publication Date
NL8401619A true NL8401619A (nl) 1985-12-16

Family

ID=19843977

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8401619A NL8401619A (nl) 1984-05-21 1984-05-21 Elektronisch microcircuit voorzien van kontaktverhogingen.

Country Status (7)

Country Link
EP (1) EP0165626B1 (de)
JP (1) JPS60254739A (de)
KR (1) KR850008042A (de)
DE (1) DE3574526D1 (de)
HK (1) HK87691A (de)
NL (1) NL8401619A (de)
SG (1) SG87790G (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5776824A (en) 1995-12-22 1998-07-07 Micron Technology, Inc. Method for producing laminated film/metal structures for known good die ("KG") applications

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3978517A (en) * 1975-04-04 1976-08-31 Motorola, Inc. Titanium-silver-palladium metallization system and process therefor
DE8122540U1 (de) * 1981-07-31 1983-01-13 Philips Patentverwaltung Gmbh, 2000 Hamburg "informationskarte mit integriertem baustein"

Also Published As

Publication number Publication date
EP0165626B1 (de) 1989-11-29
DE3574526D1 (de) 1990-01-04
SG87790G (en) 1990-12-21
KR850008042A (ko) 1985-12-11
EP0165626A1 (de) 1985-12-27
JPS60254739A (ja) 1985-12-16
JPH0476497B2 (de) 1992-12-03
HK87691A (en) 1991-11-15

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A1B A search report has been drawn up
BV The patent application has lapsed