NL8302150A - Uitgangsplaat voor een gedrukte schakeling met een weerstandslaag en werkwijze voor de vervaardiging daarvan. - Google Patents

Uitgangsplaat voor een gedrukte schakeling met een weerstandslaag en werkwijze voor de vervaardiging daarvan. Download PDF

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Publication number
NL8302150A
NL8302150A NL8302150A NL8302150A NL8302150A NL 8302150 A NL8302150 A NL 8302150A NL 8302150 A NL8302150 A NL 8302150A NL 8302150 A NL8302150 A NL 8302150A NL 8302150 A NL8302150 A NL 8302150A
Authority
NL
Netherlands
Prior art keywords
layer
printed circuit
resistance
salt
circuit board
Prior art date
Application number
NL8302150A
Other languages
English (en)
Dutch (nl)
Original Assignee
Nitto Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP57104592A external-priority patent/JPS6016117B2/ja
Priority claimed from JP57212948A external-priority patent/JPS6016118B2/ja
Application filed by Nitto Electric Ind Co filed Critical Nitto Electric Ind Co
Publication of NL8302150A publication Critical patent/NL8302150A/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
    • H01C17/14—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by chemical deposition
    • H01C17/16—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by chemical deposition using electric current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/006—Thin film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/1266—O, S, or organic compound in metal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
NL8302150A 1982-06-16 1983-06-16 Uitgangsplaat voor een gedrukte schakeling met een weerstandslaag en werkwijze voor de vervaardiging daarvan. NL8302150A (nl)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP57104592A JPS6016117B2 (ja) 1982-06-16 1982-06-16 抵抗体付き回路基板とその製造法
JP10459282 1982-06-16
JP21294882 1982-12-04
JP57212948A JPS6016118B2 (ja) 1982-12-04 1982-12-04 抵抗体付き回路基板とその製造法

Publications (1)

Publication Number Publication Date
NL8302150A true NL8302150A (nl) 1984-01-16

Family

ID=26445033

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8302150A NL8302150A (nl) 1982-06-16 1983-06-16 Uitgangsplaat voor een gedrukte schakeling met een weerstandslaag en werkwijze voor de vervaardiging daarvan.

Country Status (3)

Country Link
US (1) US4532186A (de)
DE (1) DE3321900C2 (de)
NL (1) NL8302150A (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4892776A (en) * 1987-09-02 1990-01-09 Ohmega Electronics, Inc. Circuit board material and electroplating bath for the production thereof
US5243320A (en) * 1988-02-26 1993-09-07 Gould Inc. Resistive metal layers and method for making same
EP1011111A1 (de) * 1988-02-26 2000-06-21 Gould Electronics Inc. Metallische Widerstandsschichten und Verfahren zu ihrer Herstellung
US5288535A (en) * 1989-04-28 1994-02-22 Tonen Corporation Electrode for electroviscous fluid
WO1994027302A1 (fr) * 1993-05-14 1994-11-24 Kiyokawa Mekki Kougyo Co., Ltd Resistance a film metallique ayant une fonction de fusion et procede de fabrication
US5508144A (en) * 1993-11-19 1996-04-16 At&T Corp. Process for fabricating a device
DE10020932C5 (de) * 2000-04-28 2004-12-30 Zitzmann, Heinrich, Dr. Temperaturmessfühler und Verfahren zur Herstellung desselben
US6660406B2 (en) * 2000-07-07 2003-12-09 Mitsui Mining & Smelting Co., Ltd. Method for manufacturing printed wiring board comprising electrodeposited copper foil with carrier and resistor circuit; and printed wiring board comprising resistor circuit
ATE279779T1 (de) * 2001-08-10 2004-10-15 Heusler Isabellenhuette Niederohmiger elektrischer widerstand und verfahren zur herstellung solcher widerstände
JP4758614B2 (ja) * 2003-04-07 2011-08-31 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気めっき組成物および方法
US20050046543A1 (en) * 2003-08-28 2005-03-03 Hetzler Ullrich U. Low-impedance electrical resistor and process for the manufacture of such resistor
JP6088295B2 (ja) * 2013-03-07 2017-03-01 ローム・アンド・ハース電子材料株式会社 スズ合金めっき液
EP4245893A1 (de) * 2022-03-15 2023-09-20 Université de Franche-Comté Goldgalvanisierungslösung und ihre verwendung zur galvanischen abscheidung von gold mit gealtertem aussehen

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2609470A (en) * 1949-07-22 1952-09-02 Gen Electric Resistance materials and elements
FR2350697A1 (fr) * 1976-05-06 1977-12-02 Cii Structure perfectionnee de circuits multicouches
JPS5469768A (en) * 1977-11-14 1979-06-05 Nitto Electric Ind Co Printing circuit substrate with resistance
JPS5472468A (en) * 1977-11-21 1979-06-09 Nitto Electric Ind Co Printing circuit substrate with resistance
US4311768A (en) * 1977-12-22 1982-01-19 Gould Inc. Printed circuit board having mutually etchable copper and nickel layers
US4360564A (en) * 1981-01-29 1982-11-23 General Electric Company Thin films of low resistance and high coefficients of transmission in the visible spectrum

Also Published As

Publication number Publication date
DE3321900C2 (de) 1986-01-16
US4532186A (en) 1985-07-30
DE3321900A1 (de) 1983-12-22

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Legal Events

Date Code Title Description
A85 Still pending on 85-01-01
BV The patent application has lapsed