NL8020334A - - Google Patents

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Info

Publication number
NL8020334A
NL8020334A NL8020334A NL8020334A NL8020334A NL 8020334 A NL8020334 A NL 8020334A NL 8020334 A NL8020334 A NL 8020334A NL 8020334 A NL8020334 A NL 8020334A NL 8020334 A NL8020334 A NL 8020334A
Authority
NL
Netherlands
Prior art keywords
conductive
strips
level
slices
substrate
Prior art date
Application number
NL8020334A
Other languages
English (en)
Dutch (nl)
Original Assignee
Mostek Corporation Te Carrollton, Texas, Ver. St. V. Am.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mostek Corporation Te Carrollton, Texas, Ver. St. V. Am. filed Critical Mostek Corporation Te Carrollton, Texas, Ver. St. V. Am.
Publication of NL8020334A publication Critical patent/NL8020334A/nl

Links

Classifications

    • H10W76/157—
    • H10W70/60—
    • H10W70/611—
    • H10W70/685—

Landscapes

  • Semiconductor Memories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Dram (AREA)
NL8020334A 1980-02-12 1980-05-22 NL8020334A (cg-RX-API-DMAC10.html)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US12091780A 1980-02-12 1980-02-12
US12091780 1980-02-12
US8000662 1980-05-22
PCT/US1980/000662 WO1981002367A1 (en) 1980-02-12 1980-05-22 Over/under dual in-line chip package

Publications (1)

Publication Number Publication Date
NL8020334A true NL8020334A (cg-RX-API-DMAC10.html) 1982-01-04

Family

ID=22393267

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8020334A NL8020334A (cg-RX-API-DMAC10.html) 1980-02-12 1980-05-22

Country Status (6)

Country Link
JP (1) JPS6356706B2 (cg-RX-API-DMAC10.html)
CA (1) CA1165465A (cg-RX-API-DMAC10.html)
FR (1) FR2476389A1 (cg-RX-API-DMAC10.html)
GB (1) GB2083285B (cg-RX-API-DMAC10.html)
NL (1) NL8020334A (cg-RX-API-DMAC10.html)
WO (1) WO1981002367A1 (cg-RX-API-DMAC10.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58159360A (ja) * 1982-03-17 1983-09-21 Fujitsu Ltd 半導体装置
US4727410A (en) * 1983-11-23 1988-02-23 Cabot Technical Ceramics, Inc. High density integrated circuit package
JPS61500879A (ja) * 1983-12-28 1986-05-01 ヒュ−ズ・エアクラフト・カンパニ− 集積回路メモリ・チップ用フラット・パッケ−ジ
US4598308A (en) * 1984-04-02 1986-07-01 Burroughs Corporation Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
US4630096A (en) * 1984-05-30 1986-12-16 Motorola, Inc. High density IC module assembly
EP0204568A3 (en) * 1985-06-05 1988-07-27 Harry Arthur Hele Spence-Bate Low power circuitry components
EP0241236A3 (en) * 1986-04-11 1989-03-08 AT&T Corp. Cavity package for saw devices and associated electronics
GB2199182A (en) * 1986-12-18 1988-06-29 Marconi Electronic Devices Multilayer circuit arrangement
FR2625042B1 (fr) * 1987-12-22 1990-04-20 Thomson Csf Structure microelectronique hybride modulaire a haute densite d'integration
US5150196A (en) * 1989-07-17 1992-09-22 Hughes Aircraft Company Hermetic sealing of wafer scale integrated wafer
FR2772516B1 (fr) * 1997-12-12 2003-07-04 Ela Medical Sa Circuit electronique, notamment pour un dispositif medical implantable actif tel qu'un stimulateur ou defibrillateur cardiaque, et son procede de realisation
GB9915076D0 (en) * 1999-06-28 1999-08-25 Shen Ming Tung Integrated circuit packaging structure

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3341649A (en) * 1964-01-17 1967-09-12 Signetics Corp Modular package for semiconductor devices
US3372310A (en) * 1965-04-30 1968-03-05 Radiation Inc Universal modular packages for integrated circuits
US3500440A (en) * 1968-01-08 1970-03-10 Interamericano Projects Inc Functional building blocks facilitating mass production of electronic equipment by unskilled labor
US3555364A (en) * 1968-01-31 1971-01-12 Drexel Inst Of Technology Microelectronic modules and assemblies
JPS5332233B1 (cg-RX-API-DMAC10.html) * 1968-12-25 1978-09-07
US3746934A (en) * 1971-05-06 1973-07-17 Siemens Ag Stack arrangement of semiconductor chips
US3760090A (en) * 1971-08-19 1973-09-18 Globe Union Inc Electronic circuit package and method for making same
US3927815A (en) * 1971-11-22 1975-12-23 Ngk Insulators Ltd Method for producing multilayer metallized beryllia ceramics
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
US3777221A (en) * 1972-12-18 1973-12-04 Ibm Multi-layer circuit package
US4012766A (en) * 1973-08-28 1977-03-15 Western Digital Corporation Semiconductor package and method of manufacture thereof
US4038488A (en) * 1975-05-12 1977-07-26 Cambridge Memories, Inc. Multilayer ceramic multi-chip, dual in-line packaging assembly
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
US4224637A (en) * 1978-08-10 1980-09-23 Minnesota Mining And Manufacturing Company Leaded mounting and connector unit for an electronic device

Also Published As

Publication number Publication date
JPS57500220A (cg-RX-API-DMAC10.html) 1982-02-04
FR2476389A1 (fr) 1981-08-21
GB2083285B (en) 1984-08-15
JPS6356706B2 (cg-RX-API-DMAC10.html) 1988-11-09
CA1165465A (en) 1984-04-10
GB2083285A (en) 1982-03-17
WO1981002367A1 (en) 1981-08-20
FR2476389B1 (cg-RX-API-DMAC10.html) 1983-12-16

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