CA1165465A - Over/under dual in-line chip package - Google Patents

Over/under dual in-line chip package

Info

Publication number
CA1165465A
CA1165465A CA000370651A CA370651A CA1165465A CA 1165465 A CA1165465 A CA 1165465A CA 000370651 A CA000370651 A CA 000370651A CA 370651 A CA370651 A CA 370651A CA 1165465 A CA1165465 A CA 1165465A
Authority
CA
Canada
Prior art keywords
wafer
intra
level
wafers
conductive strips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000370651A
Other languages
English (en)
French (fr)
Inventor
Alan C. Antes
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CTU of Delaware Inc
Original Assignee
Mostek Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mostek Corp filed Critical Mostek Corp
Application granted granted Critical
Publication of CA1165465A publication Critical patent/CA1165465A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W76/157—
    • H10W70/60—
    • H10W70/611—
    • H10W70/685—

Landscapes

  • Semiconductor Memories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Dram (AREA)
CA000370651A 1980-02-12 1981-02-11 Over/under dual in-line chip package Expired CA1165465A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12091780A 1980-02-12 1980-02-12
US120,917 1980-02-12

Publications (1)

Publication Number Publication Date
CA1165465A true CA1165465A (en) 1984-04-10

Family

ID=22393267

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000370651A Expired CA1165465A (en) 1980-02-12 1981-02-11 Over/under dual in-line chip package

Country Status (6)

Country Link
JP (1) JPS6356706B2 (cg-RX-API-DMAC10.html)
CA (1) CA1165465A (cg-RX-API-DMAC10.html)
FR (1) FR2476389A1 (cg-RX-API-DMAC10.html)
GB (1) GB2083285B (cg-RX-API-DMAC10.html)
NL (1) NL8020334A (cg-RX-API-DMAC10.html)
WO (1) WO1981002367A1 (cg-RX-API-DMAC10.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58159360A (ja) * 1982-03-17 1983-09-21 Fujitsu Ltd 半導体装置
US4727410A (en) * 1983-11-23 1988-02-23 Cabot Technical Ceramics, Inc. High density integrated circuit package
JPS61500879A (ja) * 1983-12-28 1986-05-01 ヒュ−ズ・エアクラフト・カンパニ− 集積回路メモリ・チップ用フラット・パッケ−ジ
US4598308A (en) * 1984-04-02 1986-07-01 Burroughs Corporation Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
US4630096A (en) * 1984-05-30 1986-12-16 Motorola, Inc. High density IC module assembly
EP0204568A3 (en) * 1985-06-05 1988-07-27 Harry Arthur Hele Spence-Bate Low power circuitry components
EP0241236A3 (en) * 1986-04-11 1989-03-08 AT&T Corp. Cavity package for saw devices and associated electronics
GB2199182A (en) * 1986-12-18 1988-06-29 Marconi Electronic Devices Multilayer circuit arrangement
FR2625042B1 (fr) * 1987-12-22 1990-04-20 Thomson Csf Structure microelectronique hybride modulaire a haute densite d'integration
US5150196A (en) * 1989-07-17 1992-09-22 Hughes Aircraft Company Hermetic sealing of wafer scale integrated wafer
FR2772516B1 (fr) * 1997-12-12 2003-07-04 Ela Medical Sa Circuit electronique, notamment pour un dispositif medical implantable actif tel qu'un stimulateur ou defibrillateur cardiaque, et son procede de realisation
GB9915076D0 (en) * 1999-06-28 1999-08-25 Shen Ming Tung Integrated circuit packaging structure

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3341649A (en) * 1964-01-17 1967-09-12 Signetics Corp Modular package for semiconductor devices
US3372310A (en) * 1965-04-30 1968-03-05 Radiation Inc Universal modular packages for integrated circuits
US3500440A (en) * 1968-01-08 1970-03-10 Interamericano Projects Inc Functional building blocks facilitating mass production of electronic equipment by unskilled labor
US3555364A (en) * 1968-01-31 1971-01-12 Drexel Inst Of Technology Microelectronic modules and assemblies
JPS5332233B1 (cg-RX-API-DMAC10.html) * 1968-12-25 1978-09-07
US3746934A (en) * 1971-05-06 1973-07-17 Siemens Ag Stack arrangement of semiconductor chips
US3760090A (en) * 1971-08-19 1973-09-18 Globe Union Inc Electronic circuit package and method for making same
US3927815A (en) * 1971-11-22 1975-12-23 Ngk Insulators Ltd Method for producing multilayer metallized beryllia ceramics
US3777220A (en) * 1972-06-30 1973-12-04 Ibm Circuit panel and method of construction
US3777221A (en) * 1972-12-18 1973-12-04 Ibm Multi-layer circuit package
US4012766A (en) * 1973-08-28 1977-03-15 Western Digital Corporation Semiconductor package and method of manufacture thereof
US4038488A (en) * 1975-05-12 1977-07-26 Cambridge Memories, Inc. Multilayer ceramic multi-chip, dual in-line packaging assembly
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
US4224637A (en) * 1978-08-10 1980-09-23 Minnesota Mining And Manufacturing Company Leaded mounting and connector unit for an electronic device

Also Published As

Publication number Publication date
JPS57500220A (cg-RX-API-DMAC10.html) 1982-02-04
FR2476389A1 (fr) 1981-08-21
GB2083285B (en) 1984-08-15
JPS6356706B2 (cg-RX-API-DMAC10.html) 1988-11-09
GB2083285A (en) 1982-03-17
WO1981002367A1 (en) 1981-08-20
FR2476389B1 (cg-RX-API-DMAC10.html) 1983-12-16
NL8020334A (cg-RX-API-DMAC10.html) 1982-01-04

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Legal Events

Date Code Title Description
MKEX Expiry