NL7400553A - Huis voor een halfgeleiderinrichting. - Google Patents

Huis voor een halfgeleiderinrichting.

Info

Publication number
NL7400553A
NL7400553A NL7400553A NL7400553A NL7400553A NL 7400553 A NL7400553 A NL 7400553A NL 7400553 A NL7400553 A NL 7400553A NL 7400553 A NL7400553 A NL 7400553A NL 7400553 A NL7400553 A NL 7400553A
Authority
NL
Netherlands
Prior art keywords
terminal
semi
chip
conductor
degrees
Prior art date
Application number
NL7400553A
Other languages
English (en)
Dutch (nl)
Original Assignee
Ates Componenti Elettron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ates Componenti Elettron filed Critical Ates Componenti Elettron
Publication of NL7400553A publication Critical patent/NL7400553A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
NL7400553A 1973-09-26 1974-01-15 Huis voor een halfgeleiderinrichting. NL7400553A (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT29390/73A IT993429B (it) 1973-09-26 1973-09-26 Perfezionamento di una cassa per dispositivo a semiconduttori

Publications (1)

Publication Number Publication Date
NL7400553A true NL7400553A (nl) 1975-04-01

Family

ID=11226889

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7400553A NL7400553A (nl) 1973-09-26 1974-01-15 Huis voor een halfgeleiderinrichting.

Country Status (8)

Country Link
US (1) US4032706A (enExample)
JP (1) JPS5523463B2 (enExample)
DE (1) DE2364837A1 (enExample)
ES (1) ES199183Y (enExample)
FR (1) FR2245084B1 (enExample)
GB (1) GB1467054A (enExample)
IT (1) IT993429B (enExample)
NL (1) NL7400553A (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
FR2462024A1 (fr) * 1979-07-17 1981-02-06 Thomson Csf Plate-forme support de grille de connexion, notamment pour boitier de circuits integres, et boitier comportant une telle plate-forme
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
USD316251S (en) 1988-12-19 1991-04-16 Mosaic Semiconductor, Inc. In-line semiconductor package
US4994897A (en) * 1989-10-26 1991-02-19 Motorola, Inc. Multi-level semiconductor package
JPH0422762A (ja) * 1990-05-16 1992-01-27 Mitsubishi Electric Corp イグナイタ
JP2000049184A (ja) * 1998-05-27 2000-02-18 Hitachi Ltd 半導体装置およびその製造方法
FR2782573B1 (fr) * 1998-08-24 2003-10-17 Possehl Electronic France Sa Support metallique, notamment pour composants electroniques de puissance
US7005728B1 (en) 2004-06-03 2006-02-28 National Semiconductor Corporation Lead configuration for inline packages
JP1646470S (enExample) * 2019-05-14 2019-11-25
JP7607430B2 (ja) * 2020-10-12 2024-12-27 株式会社マキタ 作業機

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3368114A (en) * 1965-07-06 1968-02-06 Radiation Inc Microelectronic circuit packages with improved connection structure
DE1614364C3 (de) * 1966-06-01 1979-04-05 Rca Corp., New York, N.Y. (V.St.A.) Verfahren zur Montage eines Halbleiter-Kristallelementes
US3416348A (en) * 1966-09-30 1968-12-17 Westinghouse Electric Corp Flat-pack lead bending device
US3606673A (en) * 1968-08-15 1971-09-21 Texas Instruments Inc Plastic encapsulated semiconductor devices
NL6903229A (enExample) * 1969-03-01 1970-09-03
US3839782A (en) * 1972-03-15 1974-10-08 M Lincoln Method for using a lead frame for the manufacture of electric devices having semiconductor chips placed in a face-to-face relation

Also Published As

Publication number Publication date
FR2245084A1 (enExample) 1975-04-18
ES199183U (es) 1975-07-16
JPS5061980A (enExample) 1975-05-27
DE2364837A1 (de) 1975-04-24
FR2245084B1 (enExample) 1976-10-08
GB1467054A (en) 1977-03-16
US4032706A (en) 1977-06-28
IT993429B (it) 1975-09-30
ES199183Y (es) 1975-11-16
JPS5523463B2 (enExample) 1980-06-23

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Legal Events

Date Code Title Description
BV The patent application has lapsed