NL7010208A - - Google Patents
Info
- Publication number
- NL7010208A NL7010208A NL7010208A NL7010208A NL7010208A NL 7010208 A NL7010208 A NL 7010208A NL 7010208 A NL7010208 A NL 7010208A NL 7010208 A NL7010208 A NL 7010208A NL 7010208 A NL7010208 A NL 7010208A
- Authority
- NL
- Netherlands
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/32—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers using masks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
- H01L21/76205—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
- H01L21/76213—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose
- H01L21/76216—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose introducing electrical active impurities in the local oxidation region for the sole purpose of creating channel stoppers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/112—Constructional design considerations for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layers, e.g. by using channel stoppers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
- H10D84/401—Combinations of FETs or IGBTs with BJTs
- H10D84/403—Combinations of FETs or IGBTs with BJTs and with one or more of diodes, resistors or capacitors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
- H10D84/611—Combinations of BJTs and one or more of diodes, resistors or capacitors
- H10D84/613—Combinations of vertical BJTs and one or more of diodes, resistors or capacitors
- H10D84/615—Combinations of vertical BJTs and one or more of resistors or capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
Priority Applications (34)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL7010208A NL7010208A (enrdf_load_stackoverflow) | 1966-10-05 | 1970-07-10 | |
CA117451A CA933675A (en) | 1970-07-10 | 1971-07-06 | Method of manufacturing a semiconductor device and semiconductor device obtained by using the method |
GB3184371A GB1363515A (en) | 1970-07-10 | 1971-07-07 | Manufacture of semiconductor devices |
GB186774A GB1365281A (en) | 1970-07-10 | 1971-07-07 | Manufacture of semiconductor devices |
CA117580A CA926029A (en) | 1970-07-10 | 1971-07-07 | Semiconductor device having a transistor |
CH1001271A CH539949A (de) | 1970-07-10 | 1971-07-07 | Verfahren zur Herstellung einer Halbleiteranordnung und durch dieses Verfahren hergestellte Halbleiteranordnung |
GB3184571A GB1353997A (en) | 1970-07-10 | 1971-07-07 | Semiconductor integrated devices |
CH1001371A CH542517A (de) | 1970-07-10 | 1971-07-07 | Halbleitervorrichtung mit einem Transistor und Verfahren zur Herstellung der Halbleitervorrichtung |
CH1000771A CH533364A (de) | 1970-07-10 | 1971-07-07 | Monolitische, intergrierte Schaltung |
SE08805/71A SE368480B (enrdf_load_stackoverflow) | 1970-07-10 | 1971-07-07 | |
SE08804/71A SE368479B (enrdf_load_stackoverflow) | 1970-07-10 | 1971-07-07 | |
CA117,581A CA1102012A (en) | 1970-07-10 | 1971-07-07 | Semiconductor device, in particular integrated monolithic circuit, and method of manufacturing same |
SE7108803A SE383581B (sv) | 1970-07-10 | 1971-07-07 | Forfarande for framstellning av en halvledaranordning |
DE2133982A DE2133982C2 (de) | 1970-07-10 | 1971-07-08 | Integriertes Halbleiterbauelement mit einer von einer vergrabenen Schicht gebildeten leitenden Verbindung |
ES393040A ES393040A1 (es) | 1970-07-10 | 1971-07-08 | Un dispositivo semiconductor. |
DE2133980A DE2133980C3 (de) | 1966-10-05 | 1971-07-08 | Verfahren zur Herstellung einer integrierten Halbleiterschaltung |
ES393039A ES393039A2 (es) | 1970-07-10 | 1971-07-08 | Un metodo de fabricar un dispositivo semiconductor. |
BE769734A BE769734A (fr) | 1970-07-10 | 1971-07-08 | Dispositif semiconducteur comportant un transistor |
BE769733A BE769733R (fr) | 1970-07-10 | 1971-07-08 | Dispositif semiconducteur et procede pour sa |
ES393041A ES393041A1 (es) | 1970-07-10 | 1971-07-08 | Un dispositivo semiconductor. |
BE769735A BE769735A (fr) | 1970-07-10 | 1971-07-08 | Dispositif semiconducteur, en particulier circuit monolithique integre,et procede de fabrication de ce dispositif |
DE19712133981 DE2133981C3 (de) | 1970-07-10 | 1971-07-08 | Halbleiterbauelement mit einem Halbleiterkörper mit einem Transistor und Verfahren zu seiner Herstellung |
AT594171A AT344788B (de) | 1970-07-10 | 1971-07-08 | Verfahren zur herstellung einer integrierten monolithischen halbleiteranordnung |
FR7125297A FR2098323B2 (enrdf_load_stackoverflow) | 1966-10-05 | 1971-07-09 | |
FR7125299A FR2098325B1 (enrdf_load_stackoverflow) | 1970-07-10 | 1971-07-09 | |
FR7125298A FR2098324B1 (enrdf_load_stackoverflow) | 1970-07-10 | 1971-07-09 | |
IT26784/71A IT995017B (it) | 1970-07-10 | 1971-07-09 | Metodo di fabbricazione di un di spositivo semiconduttore e dispo sitivo semiconduttore ottenuto con l ausilio di tale metodo |
JP46050732A JPS5010101B1 (enrdf_load_stackoverflow) | 1970-07-10 | 1971-07-10 | |
JP46050731A JPS517550B1 (enrdf_load_stackoverflow) | 1970-07-10 | 1971-07-10 | |
JP50141236A JPS522273B2 (enrdf_load_stackoverflow) | 1970-07-10 | 1975-11-27 | |
HK592/76*UA HK59276A (en) | 1970-07-10 | 1976-09-23 | Manufacture of semiconductor device |
HK585/76*UA HK58576A (en) | 1970-07-10 | 1976-09-23 | Improvements in and relating to semiconductor integrated devices |
HK595/76*UA HK59576A (en) | 1970-07-10 | 1976-09-23 | Manufacture of semiconductor devices |
NLAANVRAGE8002038,A NL176414C (nl) | 1970-07-10 | 1980-04-08 | Werkwijze ter vervaardiging van een halfgeleiderinrichting. |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL666614016A NL153374B (nl) | 1966-10-05 | 1966-10-05 | Werkwijze ter vervaardiging van een halfgeleiderinrichting voorzien van een oxydelaag en halfgeleiderinrichting vervaardigd volgens de werkwijze. |
NL7002384.A NL159817B (nl) | 1966-10-05 | 1970-02-19 | Werkwijze ter vervaardiging van een halfgeleiderinrichting. |
NL7010208A NL7010208A (enrdf_load_stackoverflow) | 1966-10-05 | 1970-07-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7010208A true NL7010208A (enrdf_load_stackoverflow) | 1972-01-12 |
Family
ID=27351385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7010208A NL7010208A (enrdf_load_stackoverflow) | 1966-10-05 | 1970-07-10 |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE2133980C3 (enrdf_load_stackoverflow) |
NL (1) | NL7010208A (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3886000A (en) * | 1973-11-05 | 1975-05-27 | Ibm | Method for controlling dielectric isolation of a semiconductor device |
FR2252638B1 (enrdf_load_stackoverflow) * | 1973-11-23 | 1978-08-04 | Commissariat Energie Atomique | |
FR2341201A1 (fr) * | 1976-02-16 | 1977-09-09 | Radiotechnique Compelec | Procede d'isolement entre regions d'un dispositif semiconducteur et dispositif ainsi obtenu |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3386865A (en) * | 1965-05-10 | 1968-06-04 | Ibm | Process of making planar semiconductor devices isolated by encapsulating oxide filled channels |
US3442011A (en) * | 1965-06-30 | 1969-05-06 | Texas Instruments Inc | Method for isolating individual devices in an integrated circuit monolithic bar |
NL153374B (nl) * | 1966-10-05 | 1977-05-16 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting voorzien van een oxydelaag en halfgeleiderinrichting vervaardigd volgens de werkwijze. |
US3488564A (en) * | 1968-04-01 | 1970-01-06 | Fairchild Camera Instr Co | Planar epitaxial resistors |
US3649386A (en) * | 1968-04-23 | 1972-03-14 | Bell Telephone Labor Inc | Method of fabricating semiconductor devices |
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1970
- 1970-07-10 NL NL7010208A patent/NL7010208A/xx unknown
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1971
- 1971-07-08 DE DE2133980A patent/DE2133980C3/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2133980A1 (de) | 1972-01-13 |
DE2133980C3 (de) | 1983-12-22 |
DE2133980B2 (de) | 1979-07-05 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
BN | A decision not to publish the application has become irrevocable |