NL6916814A - - Google Patents

Info

Publication number
NL6916814A
NL6916814A NL6916814A NL6916814A NL6916814A NL 6916814 A NL6916814 A NL 6916814A NL 6916814 A NL6916814 A NL 6916814A NL 6916814 A NL6916814 A NL 6916814A NL 6916814 A NL6916814 A NL 6916814A
Authority
NL
Netherlands
Application number
NL6916814A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6916814A publication Critical patent/NL6916814A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
NL6916814A 1968-11-08 1969-11-07 NL6916814A (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US77430268A 1968-11-08 1968-11-08

Publications (1)

Publication Number Publication Date
NL6916814A true NL6916814A (OSRAM) 1970-05-12

Family

ID=25100841

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6916814A NL6916814A (OSRAM) 1968-11-08 1969-11-07

Country Status (9)

Country Link
US (1) US3615913A (OSRAM)
JP (1) JPS497995B1 (OSRAM)
BE (1) BE741192A (OSRAM)
BR (1) BR6913970D0 (OSRAM)
DE (1) DE1955730A1 (OSRAM)
ES (1) ES372779A1 (OSRAM)
FR (1) FR2022876A1 (OSRAM)
GB (1) GB1286086A (OSRAM)
NL (1) NL6916814A (OSRAM)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2027105C3 (de) * 1970-06-03 1981-03-26 Robert Bosch Gmbh, 70469 Stuttgart Verfahren zur Herstellung eines Halbleiterbauelements
US4001870A (en) * 1972-08-18 1977-01-04 Hitachi, Ltd. Isolating protective film for semiconductor devices and method for making the same
US4017886A (en) * 1972-10-18 1977-04-12 Hitachi, Ltd. Discrete semiconductor device having polymer resin as insulator and method for making the same
DE2322347A1 (de) * 1973-05-03 1974-11-14 Siemens Ag Verfahren zum herstellen eines halbleiterelementes mit isolierender schutzschicht
JPS5067575A (OSRAM) * 1973-10-15 1975-06-06
US3916073A (en) * 1974-03-11 1975-10-28 Gen Instrument Corp Process for passivating semiconductor surfaces and products thereof
DE2442276A1 (de) * 1974-09-04 1976-03-25 Siemens Ag Elektrooptischer wandler
JPS6022497B2 (ja) * 1974-10-26 1985-06-03 ソニー株式会社 半導体装置
US3978426A (en) * 1975-03-11 1976-08-31 Bell Telephone Laboratories, Incorporated Heterostructure devices including tapered optical couplers
US4030948A (en) * 1975-07-21 1977-06-21 Abe Berger Polyimide containing silicones as protective coating on semiconductor device
GB1553243A (en) * 1975-08-04 1979-09-26 Gen Electric Semiconductor
US4040874A (en) * 1975-08-04 1977-08-09 General Electric Company Semiconductor element having a polymeric protective coating and glass coating overlay
US4198444A (en) * 1975-08-04 1980-04-15 General Electric Company Method for providing substantially hermetic sealing means for electronic components
US4017340A (en) * 1975-08-04 1977-04-12 General Electric Company Semiconductor element having a polymeric protective coating and glass coating overlay
SE418433B (sv) * 1975-12-11 1981-05-25 Gen Electric Halvledarelement med ett skikt av ett polymert siloxan-innehallande membranmaterial med variabel permeabilitet anbringat pa utvalda ytomraden av elementet
SE418432B (sv) * 1975-12-11 1981-05-25 Gen Electric Sett for behandling av ett utvalt omrade hos ett halvledarelement
GB1563421A (en) * 1975-12-18 1980-03-26 Gen Electric Polyimide-siloxane copolymer protective coating for semiconductor devices
GB1585477A (en) * 1976-01-26 1981-03-04 Gen Electric Semiconductors
US4140572A (en) * 1976-09-07 1979-02-20 General Electric Company Process for selective etching of polymeric materials embodying silicones therein
US4238528A (en) * 1978-06-26 1980-12-09 International Business Machines Corporation Polyimide coating process and material
CH661932A5 (en) * 1978-09-18 1987-08-31 Gen Electric Process for the preparation of a coating composition for semiconductor components, this composition, and the use thereof
JPS55166943A (en) * 1979-06-15 1980-12-26 Fujitsu Ltd Semiconductor device
US4225686A (en) * 1979-07-19 1980-09-30 The Upjohn Company Blends of copolyimides with copolyamideimides
JPS6015152B2 (ja) * 1980-01-09 1985-04-17 株式会社日立製作所 樹脂封止半導体メモリ装置
JPS56114335A (en) 1980-02-13 1981-09-08 Fujitsu Ltd Semiconductor device and its manufacture
US4426769A (en) 1981-08-14 1984-01-24 Amp Incorporated Moisture getter for integrated circuit packages
US4535350A (en) * 1981-10-29 1985-08-13 National Semiconductor Corporation Low-cost semiconductor device package and process
US4468411A (en) * 1982-04-05 1984-08-28 Motorola, Inc. Method for providing alpha particle protection for an integrated circuit die
US4670325A (en) * 1983-04-29 1987-06-02 Ibm Corporation Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure
JPS59204295A (ja) * 1983-04-29 1984-11-19 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 金属回路構造体
US4603372A (en) * 1984-11-05 1986-07-29 Direction De La Meteorologie Du Ministere Des Transports Method of fabricating a temperature or humidity sensor of the thin film type, and sensors obtained thereby
US5026667A (en) * 1987-12-29 1991-06-25 Analog Devices, Incorporated Producing integrated circuit chips with reduced stress effects
US5144407A (en) * 1989-07-03 1992-09-01 General Electric Company Semiconductor chip protection layer and protected chip
KR0159287B1 (ko) * 1991-01-24 1999-01-15 윤종용 실록산 변성 폴리이미드 수지의 제조방법
US5834824A (en) * 1994-02-08 1998-11-10 Prolinx Labs Corporation Use of conductive particles in a nonconductive body as an integrated circuit antifuse
US5813881A (en) * 1994-02-08 1998-09-29 Prolinx Labs Corporation Programmable cable and cable adapter using fuses and antifuses
US5808351A (en) * 1994-02-08 1998-09-15 Prolinx Labs Corporation Programmable/reprogramable structure using fuses and antifuses
US5917229A (en) * 1994-02-08 1999-06-29 Prolinx Labs Corporation Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect
US5962815A (en) * 1995-01-18 1999-10-05 Prolinx Labs Corporation Antifuse interconnect between two conducting layers of a printed circuit board
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
US5767575A (en) * 1995-10-17 1998-06-16 Prolinx Labs Corporation Ball grid array structure and method for packaging an integrated circuit chip
US5783452A (en) * 1996-02-02 1998-07-21 University Of Washington Covered microchannels and the microfabrication thereof
US5872338A (en) * 1996-04-10 1999-02-16 Prolinx Labs Corporation Multilayer board having insulating isolation rings
US6034427A (en) * 1998-01-28 2000-03-07 Prolinx Labs Corporation Ball grid array structure and method for packaging an integrated circuit chip
US6319604B1 (en) * 1999-07-08 2001-11-20 Phelps Dodge Industries, Inc. Abrasion resistant coated wire
US6914093B2 (en) 2001-10-16 2005-07-05 Phelps Dodge Industries, Inc. Polyamideimide composition
DE10253163B4 (de) * 2002-11-14 2015-07-23 Epcos Ag Bauelement mit hermetischer Verkapselung und Waferscale Verfahren zur Herstellung
US7658709B2 (en) * 2003-04-09 2010-02-09 Medtronic, Inc. Shape memory alloy actuators
US7973122B2 (en) * 2004-06-17 2011-07-05 General Cable Technologies Corporation Polyamideimide compositions having multifunctional core structures
US20070151743A1 (en) * 2006-01-03 2007-07-05 Murray Thomas J Abrasion resistant coated wire
US20080193637A1 (en) * 2006-01-03 2008-08-14 Murray Thomas J Abrasion resistant coated wire
US7790501B2 (en) * 2008-07-02 2010-09-07 Ati Technologies Ulc Semiconductor chip passivation structures and methods of making the same
US7994044B2 (en) * 2009-09-03 2011-08-09 Ati Technologies Ulc Semiconductor chip with contoured solder structure opening
US8647974B2 (en) 2011-03-25 2014-02-11 Ati Technologies Ulc Method of fabricating a semiconductor chip with supportive terminal pad
JP2014192500A (ja) * 2013-03-28 2014-10-06 Shindengen Electric Mfg Co Ltd メサ型半導体装置の製造方法

Also Published As

Publication number Publication date
BE741192A (OSRAM) 1970-04-16
ES372779A1 (es) 1971-11-01
GB1286086A (en) 1972-08-16
JPS497995B1 (OSRAM) 1974-02-23
DE1955730A1 (de) 1970-06-04
FR2022876A1 (OSRAM) 1970-08-07
US3615913A (en) 1971-10-26
BR6913970D0 (pt) 1973-01-11

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