NL6715014A - - Google Patents

Info

Publication number
NL6715014A
NL6715014A NL6715014A NL6715014A NL6715014A NL 6715014 A NL6715014 A NL 6715014A NL 6715014 A NL6715014 A NL 6715014A NL 6715014 A NL6715014 A NL 6715014A NL 6715014 A NL6715014 A NL 6715014A
Authority
NL
Netherlands
Application number
NL6715014A
Other versions
NL154061B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6715013A priority Critical patent/NL6715013A/xx
Priority to NL676715014A priority patent/NL154061B/xx
Priority to DE1805826A priority patent/DE1805826C3/de
Priority to AT1061968A priority patent/AT281122B/de
Priority to GB51836/68A priority patent/GB1243355A/en
Priority to CH1631768A priority patent/CH483725A/de
Priority to SE14874/68A priority patent/SE354380B/xx
Priority to ES359847A priority patent/ES359847A1/es
Priority to BE723340D priority patent/BE723340A/xx
Priority to FR1592176D priority patent/FR1592176A/fr
Publication of NL6715014A publication Critical patent/NL6715014A/xx
Priority to US00131252A priority patent/US3839103A/en
Priority to US00213947A priority patent/US3772576A/en
Priority to JP48067663A priority patent/JPS5013633B1/ja
Publication of NL154061B publication Critical patent/NL154061B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
    • H01L29/0638—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layer, e.g. with channel stopper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/028—Dicing
NL676715014A 1967-11-04 1967-11-04 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting vervaardigd met behulp van de werkwijze. NL154061B (nl)

Priority Applications (13)

Application Number Priority Date Filing Date Title
NL6715013A NL6715013A (xx) 1967-11-04 1967-11-04
NL676715014A NL154061B (nl) 1967-11-04 1967-11-04 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting vervaardigd met behulp van de werkwijze.
DE1805826A DE1805826C3 (de) 1967-11-04 1968-10-29 Verfahren zum Hersteilen von planaren Halbleiterbauelementen
AT1061968A AT281122B (de) 1967-11-04 1968-10-31 Halbleitervorrichtung und Verfahren zur Herstellung derselben
GB51836/68A GB1243355A (en) 1967-11-04 1968-11-01 Improvements in and relating to semiconductor devices
CH1631768A CH483725A (de) 1967-11-04 1968-11-01 Planare Halbleitervorrichtung und Verfahren zur Herstellung derselben
SE14874/68A SE354380B (xx) 1967-11-04 1968-11-01
ES359847A ES359847A1 (es) 1967-11-04 1968-11-02 Un dispositivo semiconductor planar.
BE723340D BE723340A (xx) 1967-11-04 1968-11-04
FR1592176D FR1592176A (xx) 1967-11-04 1968-11-04
US00131252A US3839103A (en) 1967-11-04 1971-04-05 Semiconductor device and method of manufacturing same
US00213947A US3772576A (en) 1967-11-04 1971-12-30 Planar semiconductor device with scribe lines and channel stopper
JP48067663A JPS5013633B1 (xx) 1967-11-04 1973-06-15

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL6715013A NL6715013A (xx) 1967-11-04 1967-11-04
NL676715014A NL154061B (nl) 1967-11-04 1967-11-04 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting vervaardigd met behulp van de werkwijze.

Publications (2)

Publication Number Publication Date
NL6715014A true NL6715014A (xx) 1969-05-06
NL154061B NL154061B (nl) 1977-07-15

Family

ID=26644261

Family Applications (2)

Application Number Title Priority Date Filing Date
NL676715014A NL154061B (nl) 1967-11-04 1967-11-04 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting vervaardigd met behulp van de werkwijze.
NL6715013A NL6715013A (xx) 1967-11-04 1967-11-04

Family Applications After (1)

Application Number Title Priority Date Filing Date
NL6715013A NL6715013A (xx) 1967-11-04 1967-11-04

Country Status (11)

Country Link
US (2) US3839103A (xx)
JP (1) JPS5013633B1 (xx)
AT (1) AT281122B (xx)
BE (1) BE723340A (xx)
CH (1) CH483725A (xx)
DE (1) DE1805826C3 (xx)
ES (1) ES359847A1 (xx)
FR (1) FR1592176A (xx)
GB (1) GB1243355A (xx)
NL (2) NL154061B (xx)
SE (1) SE354380B (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2282723A1 (fr) * 1974-08-19 1976-03-19 Sony Corp Composant semi-conducteur a jonction recouverte d'une couche de passivation

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4819113B1 (xx) * 1969-08-27 1973-06-11
JPS5261333U (xx) * 1975-10-31 1977-05-06
CH594989A5 (xx) * 1976-09-03 1978-01-31 Bbc Brown Boveri & Cie
US4076558A (en) * 1977-01-31 1978-02-28 International Business Machines Corporation Method of high current ion implantation and charge reduction by simultaneous kerf implant
US4665420A (en) * 1984-11-08 1987-05-12 Rca Corporation Edge passivated charge-coupled device image sensor
US4835592A (en) * 1986-03-05 1989-05-30 Ixys Corporation Semiconductor wafer with dice having briding metal structure and method of manufacturing same
JP2578600B2 (ja) * 1987-04-28 1997-02-05 オリンパス光学工業株式会社 半導体装置
US5237197A (en) * 1989-06-26 1993-08-17 University Of Hawaii Integrated VLSI radiation/particle detector with biased pin diodes
EP0429697B1 (de) * 1989-11-28 1997-03-05 Siemens Aktiengesellschaft Halbleiterscheibe mit dotiertem Ritzrahmen
ATE106489T1 (de) * 1990-06-21 1994-06-15 Chiang Mu Long Eckenschutz für wände, träger, stützen etc.
FR2694410B1 (fr) * 1992-07-30 1994-10-28 Sgs Thomson Microelectronics Procédé de test de la résistance par carré de couches diffusées.
DE19539527C2 (de) * 1995-10-24 2001-02-22 August Braun Winkelleiste mit Armierungsmaterial für den Putz auf einer Wärmedämmung
KR102647989B1 (ko) * 2017-06-27 2024-03-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 반도체 웨이퍼, 기억 장치, 및 전자 기기

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL282779A (xx) * 1961-09-08
US3197681A (en) * 1961-09-29 1965-07-27 Texas Instruments Inc Semiconductor devices with heavily doped region to prevent surface inversion
NL294370A (xx) * 1963-06-20
GB993388A (en) * 1964-02-05 1965-05-26 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3395320A (en) * 1965-08-25 1968-07-30 Bell Telephone Labor Inc Isolation technique for integrated circuit structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2282723A1 (fr) * 1974-08-19 1976-03-19 Sony Corp Composant semi-conducteur a jonction recouverte d'une couche de passivation

Also Published As

Publication number Publication date
FR1592176A (xx) 1970-05-11
DE1805826A1 (de) 1969-06-26
SE354380B (xx) 1973-03-05
NL6715013A (xx) 1969-05-06
US3839103A (en) 1974-10-01
CH483725A (de) 1969-12-31
GB1243355A (en) 1971-08-18
JPS5013633B1 (xx) 1975-05-21
US3772576A (en) 1973-11-13
AT281122B (de) 1970-05-11
BE723340A (xx) 1969-05-05
DE1805826C3 (de) 1978-06-01
ES359847A1 (es) 1970-10-01
NL154061B (nl) 1977-07-15
DE1805826B2 (de) 1976-04-22

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Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee
NL80 Information provided on patent owner name for an already discontinued patent

Owner name: PHILIPS